Development of RM³ Technololgy to Integrate P-i-N Photodiodes on Si-CMOS for Optical Clock Distribution

Eralp Atmaca,^a Mindy Teo, ^a Yie-Shu Vivian Lei, ^a Laoke Wan Khaib, ^b Joseph J. Rumpler, ^a James M. Perkins, ^a Yoon Soon Fatt, ^b and Clifton G. Fonstad, Jr. ^a

^a Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, 77 Massachusetts Avenue, Cambridge, MA 02139 USA

^bDepartment of Electrical and Electronic Engineering, Nanyang Technological University, Singapore

fonstad@mit.edu; 617-253-4634

Keywords: heterogeneous integration, compound semiconductors, optoelectronic integration, self-assembly

Abstracht

This extended abstract presents the elements of an OptoPill assembly implementation of the monolithic heterogeneous integration technology known as recess mounting with monolithic metallization (RM³), and details the motivation for applying of RM³ integration to the problem of optical clock distribution on Si-CMOS. The processes for manual pick-and-place assembly of pills in recesses formed on a wafer surface, bonding of the pills in place, and replanarization of the wafer surface are described.

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