Resistance and Inductance of Through-Wafer
Vias: Models, Measurement, and Scaling
Martin
J. Brophy, Thorsten Saeger, and Wes Mickanin*
TriQuint Semiconductor, *Consultant
mbrophy@tqs.com
The measurement of substrate vias (SVIAs) in process control modules and the interpretation of that measurement is reviewed. They are seen to typically have resistances of about 5 mOhms and noisily variable inductances of 10 – 25 pHenry for a nominal 50 um diameter SVIA. Both increase for smaller SVIA diameters.
Keywords: Through-Wafer Vias, Substrate Vias, Test and Measurement, Modeling