Reversible Wafer Bonding; Challenges
in Ramping up 150mm GaAs Wafer Production to Meet Growing Demand.
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email
suzanne.combe@filcs.com
Key Words: 150mm GaAs wafer, backend process, cycle time
reduction, process capability, yield.
ABSTRACT
At Filtronic
Compound Semiconductors’ 150mm gallium arsenide wafer fab in Newton Aycliffe a
reversible wafer bonding process has been developed to accommodate a
significant increase in wafer production through the backend processes. This
method of mounting and demounting wafers from sapphire substrates has produced
mechanical and visual yield exceeding 99% while demonstrating process
capability for wafer thinning >1.7
CpK. This paper will discuss the process development for wafer bonding and
de-bonding in a volume-manufacturing environment along with the challenges
experienced with rapid growth in wafer demand.