|Reducing chipping defects
during GaAs wafer dicing
with a four-point diamond tool
Jason Chou, Chang-Hwang Hua, Sen Yang and Ping-Wei Chen
WIN Semiconductors corp.
No.69, Technology 7th Rd., Hwaya Technology Park Kuei Shan Hsiang, Tao Yuan Shien, Taiwan333
Phone: (03) 3975999 FAX: (03) 3975668
|Keyword: Diamond-Tool, Scribe and Break, Dicing,
This paper reports the results of a DOE, analyzed with Mini-Tab software that studied GaAs dicing with a four-point diamond-scribing tool. An excellent scribe and break (S&B) yield was obtained by simultaneously controlling the cutting depth and applied force. An August automatic inspection system was used to determine the die yield after wafer dicing.
|8.3 PDF||Return to TOC|