Productive Availability of Non-destructive Thickness Measurement Techniques

Ryo Hattori and Tomoki Oky
Mitsubishi Electric Corporation
4-1 Mizuhara, Itami, Hyogo 664-8641, Japan

"Thickness control" is the most fundamental and essential subject for the semiconductor device fabrication.  At the actual production stage, however, the accurate thickness inspection had been hard to be accomplished by the reason of forbidden limitation of wafer destruction.  For the effective device production, the enough accurate non-destructive thickness measurement techniques have to be realized.  In this paper, we report the productive availability of the specially improved non-destructive thickness measurement techniques of Grazing Incidence X-ray Reflectometer, FTIR, and Spectroscopic Ellipsometer for the wafer process inline inspections.

 

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