A Manufacturable Multi-Level Interconnect Process Using Two Layers of 4.5mm-Thick Plated Gold

J.W.L. Dilley and S.K. Hall

M/A-COM
5310 Valley Park Drive, Roanoke, VA 24019

This paper describes a metal interconnect process which uses two layers of thick plated gold and thick polyimide intermetal dielectric.  The fabrication process is described and results are presented.  The results include via yield, initial reliability testing, transmission line characteristics and inductor characteristics.
 

 

10c.pdf 

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