Simple Method for Calculating Backside Via Inductance
 
R. Tsai, W. Okamura, P. Nam, R. Grundbacher, M. Nishimoto, Y. C. Chou, R. Lai, and S. Olson
TRW, Inc.
 
Backside via self-inductance is a critical electrical quantity needed for the design of Monolithic Millimeter-wave Integrated Circuits (MMIC). We have investigated a simple, analytical method for accurately calculating via inductance based upon physical geometry. The analytical method enables backside via process development to be tailored to meet design goals. Conversely, the sensitivity of RF performance yield to via process variation can also be evaluated.