Compact System-on-Package (SOP) Architectures for low cost RF Front-end modules

J. Laskar, S. Pinel, K. Lim, A. Raghavan, R. Li, C-H. Lee, M. Maeng, M.F. Davis, M. Tentzeris.

School of ecE, Georgia Institute of Technology, Atlanta, GA 30332, U.S.A.

e-mail: laskar@ece.gatech.edu

 

Abstract

This paper presents the development of RF System-on-Package (SOP) architectures for compact and low cost wireless radio front-end systems. We present multi-layer Ceramic-based module development such as a 2.4 GHz SiGe HBT power amplifier module with a harmonic suppression filter implemented in LTCC substrate and a via-fed stacked cavity-backed patch antenna designed to fully cover the required band (5.725-5.825 GHz). Multi-layer organic packaging development for SOP is reported. A C-band up-converter MMIC integrated with a square patch resonator band pass filter and an Intelligent Network Communicator (INC) RF block are presented as example of the high performances of multi-layer organic package.

 

 

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