DENSE, TWO-DIMENSIONAL OPTOELecTRONIC CHIPS FOR HIGH-SPEED, PARALLEL OPTICAL LINKS

Doug J. Burrows, Kelly A. Zabierek, Richard R. Dennis,

Suzanne M. Wade, and Robert W. Cook

TeraConnect, Inc., 98 Spit Brook Road, Suite 300, Nashua, NH 03062

dburrows@teraconnect.com (603) 885-1094

 

Keywords: Parallel optics, VCSELs, transmit modules, receive modules, hybrid opto-electronic chips

 

Abstract:

Two-dimensional opto-electronic chips are gaining acceptance as a means to dramatically increase data transfer bandwidths. Thermal issues combine with the laws of statistics to stand in the way of achieving the low failure rates demanded by system engineers. Redundancy constitutes a promising avenue to pursue for circumventing the problem and ensuring the desired component life expectancies.

 

 

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