Stress and Other Challenges with Evaporated Ni-Cr Thin Film Resistors Used in the Manufacture of ASICs
Necmi Bilir and Long Do
Keywords: thin film resistor, resistivity, Ni-Cr, TaN, stress
This paper studied the change in the characteristics of the Ni-Cr thin film resistors developed at the Sunnyvale facility of Skyworks Solutions,(formerly known as NDI-Alpha Industries), with the number of depositions from the same source melt, as well as the effects of sputter etch cleaning, oxygen plasma etch, HCl dip and regular annealing. were deposited in the later runs, came up very seldom, if ever.