Cycle Time Reduction During Electroplating of Through Wafer Vias For Backside Metallization of III-V Semiconductor Circuits
Dennis Anderson, Heather Knoedler, Shiban Tiku
[dennis.anderson or heather.knoedler or shiban.tiku @skyworksinc.com
phone: 805- 480-4274]
Keywords: through wafer vias, cycle time reduction, electroplating, gold-sulfite
The cycle time for electroplating through wafer vias (TWVs) has been reduced by 50% with little to no loss in plating thickness and uniformity by adjusting the plating parameters through design of experiments (DOE) studies. By optimizing the mechanical parameters of the plating tool, the power supply parameters, and the bath component concentrations, the studies showed that the current density could be doubled.