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The International Conference on
Compound Semiconductor Manufacturing Technology

"Sharing Ideas Throughout the Industry"

2003 On-line Digest Table of Content

 

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1.1
David J. Aldrich, Skyworks Solutions Inc.
1.2
John C. Zolper, DARPA/MTO
1.3
Mark Wilson, Motorola Semiconductor Products Sector
2.1
Qi Huang and Junming Zhou, Institute of Physics, Chinese Academy of Sciences, Advanced Chinese Epitaxy Ltd.
2.2
C.E. Weitzel, Motorola, Inc., Semiconductor Products Sector
2.3
Richard Chan, Robert Lesnick, David Caruth, and Milton Feng, High Speed Integrated Circuits Group, Department of Electrical and Computer Engineering, University of Illinois
2.4
J. Hughes, E. Huang, J. Apibunyopas, C. Della-Morrow, T. Nilsson, M. Coe, Motorola Semiconductor Products Sector
3.1
Michael Wojtowicz, Randy Sandhu, Ben Heying, and Thomas Block, Northrop Grumman Space Technology
3.2
J. Lowmaster, R. Pelzel, M. Dydyk, D. Green, IQE, Inc., 
3.3
D. I. Lubyshev, K. Teker, O. Malis, Y. Wu, J. M. Fastenau, X.-M. Fang, C. Doss, A. B. Cornfeld, and W. K. Liu, IQE Inc.,
3.4
Michael Pelczynski, Mark Rittgers, Bob Duffin, Celicia Della-Morrow, Mikhail Mikhov*, Motorola Inc. Semiconductor Product Sector
3.5
T. Bünger, J. Stenzenberger, F. Börner, U. Kretzer, S. Eichler, M. Jurisch, R. Bindemann, B. Weinert, S. Teichert, T. Flade, Freiberger Compound Materials GmbH
4.1
Martin J. Brophy, Alfredo Torrejon, Shawn Petersen, Kamal Avala, and Li Liu, TriQuint Semiconductor
4.2
Y. C. Chou, R. Lai, G. P. Li , H. Guan * , R. Grundbacher, P. Nam, H. K. Kim, Y. Ra ** , M. Barsky, M. Biedenbender, and A. Oki, Northrop Grumman Space Technology
4.3
Jiro Yota, Ravi Ramanathan, Jose Arreaga, Peter Dai, Cristian Cismaru, Richard Burton, Parminder Bal, Lance Rushing, Skyworks Solutions, Inc.
4.4
Suehiro Sugitani, Hideaki Matsuzaki, and Takatomo Enoki,  NTT Photonics Laboratories, NTT Corporation
4.5
Muralidhar R. Rao, Sheila T. O'Neil, Shiban Tiku, Skyworks Solutions Inc.,
4.6
P. Sanders, H. Henry, D. Hill, M. Sadaka, S. Wilson, Motorola Semiconductor Products Sector
5.1
J. Laskar, S. Pinel, K. Lim, A. Raghavan, R. Li, C-H. Lee, M. Maeng, M.F. Davis, M. Tentzeris., School of ecE, Georgia Institute of Technology
5.2
R. Vandersmissen 1 , D. Schreurs 1 , S. Vandenberghe 1 , G. Carchon, and G. Borghs 2, IMec, MCP,
5.3
J.-Q. Lu, A. Jindal, P.D. Persans, T.S. Cale, and R.J. Gutmann, Interconnect Focus Center: Interconnections for Gigascale Integration, Rensselaer Polytechnic Institute
5.4
Doug J. Burrows, Kelly A. Zabierek, Richard R. Dennis, Suzanne M. Wade, and Robert W. Cook, TeraConnect, Inc., 
5.5
P. Kurpas, A. Maaßdorf, W. Doser*, W. Köhler, P. Heymann, B. Janke, F. Schnieder, H. Blanck*, P. Auxemery**, D. Pons**, W. Heinrich, J. Würfl, Ferdinand-Braun-Institut für Höchstfrequenztechnik (FBH)
6.1
James Cotronakis, Thomas Nilsson, Motorola Compound Semiconductor
6.2
Hong Shen, Jose Arreaga, Ravi Ramanathan, Heather Knoedler, John Sawyer, and Shiban Tiku, Skyworks Solutions, Inc.,
6.3
Ellen Lan, Qianghua Xie, Peter Fejes, and Ha Le, Motorola Inc., Semiconductor Products Sector
6.4
Chad M. Becker, William Rummel*, Dr. Paul Ocansey, Motorola Compound Semiconductor
6.5
S.J. Huang, H.C. Chou, T.C. Lee, B. Lin, D.W. Tu, P.C. Chao, and C.S. Wu, WIN Semiconductors Corporation
7.1
D. Miller and M. Drinkwine, M/A-COM, Inc.
7.2
Yung S. Liu, Optoelectonics & Systems Laboratories, Industrial Technology Research Institute
7.3
D. Fukushi, M. Watanabe and S. Nakajima, Optoelectronics R&D Laboratories, Sumitomo Electric Ind., Ltd.
7.4
D. Miller, M/A-COM, Inc.
7.5
Y. Mitani, D. Kasai and K. Horio, Faculty of Systems Engineering, Shibaura Institute of Technology
8.1
T. Baksht, S. Solodky, A. Khramtsov, * S. Hava * and Yoram Shapira, Faculty of Engineering,Tel Aviv University,Ramat Aviv,69978,Israel; Engineering Faculty,Ben-Gurion University of the Negev, Mark Leibovich and Gregory Bunin Gal El (MMIC)
8.2
M. Chertouk, W. D. Chang, C. G. Yuan, H. H. Chen, L. Lo, C. H. Chen, D. W. Tu, J. Liu, N. Draidia, P. C. Chao, WIN Semiconductors Corp.
8.3
B. Houli-Arbiv, G. Bunin, J. Kaplun, I. Hallakoun, T. Boterashvili, Y. Knafo, A. Cohen-Nov, M. Leibovitch, B. Revzin, Gal-El (MMIC)
8.4
James Chingwei Li 1 , Peter J. Zampardi 2 , and Van Pho 3, Skyworks Solutions Inc., 
8.5
Yahui Zhang and Douglas G. Ivey, Department of Chemical and Materials Engineering, University of Alberta
8.6
Dennis Anderson, Heather Knoedler, Shiban Tiku, Skyworks Solutions Inc.,
8.7
Candi S. Cook,1,2 Terry Daly,1 Ran Liu,1 Michael Canonico,1 Martha Erickson,1 Qianghua Xie,1 Rich Gregory,1 and Stefan Zollner 1
1 Motorola, Inc.,  2 Arizona State University, Science and Engineering of Materials Program
8.8
J. Moore, H. Hendriks*, and A. Morales*, General Chemical - Electronic Materials, *M/A-COM: Tyco
8.9
F.S. Pool, W.A. Wohlmuth, E. Maxwell, B. Berggren, S. Roadman, S. Mahon, B. Howell and W. Mickanin, TriQuint Semiconductor
8.1
Jason Fender, Susan Chorrushi-Patino, Janet Hill-Tinkler, Compound Semiconductor-1 Motorola, Inc.
8.11
Gergana I. Drandova, John M. Beall, Kenneth D. Decker, Keith A. Salzman, TriQuint Semiconductor
8.12
Sabyasachi Nayak, Marcus King, Keith Salzman, John Beall, TriQuint Semiconductor Texas
8.13
Misao Takakusaki, Hajime Momoi, Kouji Kakuta and Hirofumi Nakata, Nikko Materials Co., Ltd.
8.14
Yuefei Yang, Kevin Feng, Byounguk In, Chanh Nguyen, Daniel Hou, Yaochung Chen and Dave Wang, Global Communication Semiconductors, Inc.
8.15
Hiep Pham, Chang-Hwang Hua, Skyworks Solutions, Inc.,
8.16
Yao-Sheng Lee, Mike DeVre, David Lishan, Brad Reelfs, Russ Westerman, Unaxis USA, Inc.
8.17
Karen Lenaburg, Susan Valocchi, Jan Campbell, Motorola, Semiconductor Products Sector
8.18
June Nguyen, Oksun Dydasco, Harutoshi Saigusa, Chang-Hwang Hua, Skyworks Solutions, Inc.,
8.19
Prasit Sricharoenchaikit, M/A-COM, Inc.,
8.2
Necmi Bilir and Long Do, Skyworks Solutions, Inc., 
8.21
Sam Wang, Guojin Feng, Peter Lao, Sangmin Lee, Sujane Wang, and Chanh Nguyen, Global Communication Semiconductors, Inc.
8.22
Oded Tal, MAX International Engineering Group
8.23
C. Schaefer 1 , V. Dragoi 1 , S. Farrens 2 , M. Wimplinger , P. Lindner 1, 1 EV Group E. Thallner GmbH, 2 EV Group Inc., 
8.24
Shyh-Chiang Shen, David C. Caruth, Doris Chan, Aunt Thu, Jeffrey Feng, and Milton Feng, Xindium Technologies, Inc.
8.25
N. X. Nguyen, J. Fierro, K. T. Feng, and C. Nguyen, Global Communication Semiconductors, Inc.
8.26
Patrick Van Lierde, Chunsheng Tian, Charles Evans & Associates
10.1
K. Bock, M. Bleier, O. Köthe, C. Landesberger, Fraunhofer Institute for Reliability and Microintegration IZM-M, Munich branch of the institute,
10.2
H.C. Chou, T.C. Lee, S.J. Huang, H.H. Weng, M.H. Tsai, J.M. Lee, M. Chertouk, D.W. Tu, P.C. Chao, and C.S. Wu, WIN Semiconductors Corporation
10.3
P. Nam, R. Tsai, D. Davison, B. Allen, M. Barsky, R. Grundbacher, R. Lai and S. Olson, Northrop Grumman Space Technology
10.4
Maria Huffman 1, Timothy Engel 1, Nicholas Pfister 1, Gabriel Arevalo 1, Tom Brown 1, Maya Farhoud 1, Ron Miller 1, Ben Keppeler 1, John Staroba 1, Richard Jefferies 2 ., 1 Agilent Technologies Inc.,  2 Trikon Technologies Ltd.,
10.5
R. Westerman 1 , D. Johnson 1 , F. Clayton 2, Unaxis USA, Inc., Motorola Inc.,
10.6
Terry Daly, Jason Fender, Bob Duffin, Mike Kottke, Compound Semiconductor-1 Motorola, Inc.
11.1
Yasuyuk i Miyamoto, Department of Physical Electronics, Tokyo Institute of Technology
11.2
V. Ilderem, S.G. Thomas, J.P. John, S. Wipf, D. Zupac, H. Rueda, F. Chai, R. Reuter*, J. Kirchgessner, J.Teplik, P. Wennekers*, T. Baker, M. Clifford, J. Griffiths, M. Tawney, M. McCombs, Digital DNA TM Laboratories, Semiconductor Products Sector, *EMEA-Berlin, Motorola Inc,
11.3
V.E. Houtsma, J. Frackoviak, R.F. Kopf, R.R. Reyes, W. Sung, A. Tate, Y. Yang, N.G. Weimann, and Y.K. Chen, Bell Labs, Lucent Technologies
11.4
Bryan D. Dickerson, Bradley J. Heath, and Louis J. Guido, Virginia Tech, Department of Material Science and Engineering,
Kevin S. Stevens, Charles R. Lutz, Eric M. Rehder, and Roger E. Welser, Kopin Corporation,
12.1
Jan Campbell, Karen Lenaburg, Niki Liggins, Motorola, Semiconductor Product Sector
12.2
Xin Cao, Iain Thayne, Ultrafast Systems Group, Department of Electronics and Electrical Engineering, University of Glasgow
12.3
Kamal Tabatabaie-Alavi, Colin Whelan, and Elsa Tong, Raytheon RF Components Company
12.4
James Tajadod, Henry Hendriks, John Klocke*, Antonio Morales, and Heather Rapuano, M/A-COM: Tyco
12.5
Brent Boerger, Scott Mcleod, Richard Forber, I.C.E. Turcu, Cel Gaeta, Donald K. Bailey, Jacob Ben-Jacob, JMAR Systems
13.1
A. Crespo, R. Fitch, J. Gillespie, N. Moser, G. Via, M. Yannuzzi, Sensors Directorate, Air Force Research Laboratory, Wright-Patterson AFB
13.2
Richard Lossy 1, Nidhi Chaturvedi 1 , Peter Heymann 1, Klaus Köhler 2, Stefan Müller 2 and Joachim Würfl , 1 Ferdinand-Braun-Institut für Höchstfrequenztechnik
13.3
Yohei Otoki, *Michio Kihara, *Takeshi Tanaka, *Kazuto Takano, **Toshihide Kikkawa and ***Tsutomu Igarashi, Semiconductor Engineering Dept., Hitachi Cable, *Advanced Research Center, Hitachi Cable, **Fujitsu Laboratories Ltd, ***Fujitsu Quantum Devices Ltd.
13.4
J.W. Milligan, S.T. Allen, J.J. Sumakeris, A.R. Powell, J.R. Jenny, and J.W. Palmour, Cree, Inc., 
13.5
Jeff Y. Tsao, Sandia National Laboratories