Development of RM3 Technololgy to Integrate P-i-N Photodiodes on Si-CMOS for Optical Clock Distribution

Eralp Atmaca,a Mindy Teo, a Yie-Shu Vivian Lei, a Laoke Wan Khaib, b Joseph J. Rumpler, a James M. Perkins, a Yoon Soon Fatt, b and Clifton G. Fonstad, Jr. a

 

a Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, 77 Massachusetts Avenue, Cambridge, MA  02139 USA

bDepartment of Electrical and Electronic Engineering, Nanyang Technological University, Singapore

fonstad@mit.edu; 617-253-4634

 

Keywords: heterogeneous integration, compound semiconductors, optoelectronic integration, self-assembly

 

Abstracht

This extended abstract presents the elements of an OptoPill assembly implementation of the monolithic heterogeneous integration technology known as recess mounting with monolithic metallization (RM3), and details the motivation for applying of RM3 integration to the problem of optical clock distribution on Si-CMOS.  The processes for manual pick-and-place assembly of pills in recesses formed on a wafer surface, bonding of the pills in place, and replanarization of the wafer surface are described.

 

10B.2pdf             Return to TOC