Oxygen Plasma Photoresist Strip in High Valume HBT Production
Jiang Wang, Sam Mony and Nercy Ebrahimi
Skyworks Solution Inc.,
Keywords: HBT, resist stgrip, oxygen plasma
A dry resist strip process using oxygen plasma is reported to strip resist layers after He++ ion-implantation and dielectric SiN etch. The new dry strip process implemented has the following advantages over a wet NMP strip: (1) dry strip tools have good process control with end point monitoring, (2) elimination of environmentally harmful chemicals, (3) tremendous cost savings, and (4) process time reduction.