Advanced Low-k Polymer Dielectrics Platform for RF Applications

Mashiro Ito, Kaori Tsuruoka, Shunsuke Yokotsuka 
Asahi Glass Co., Ltd Research Center, 1150 Hazawa, Yokohama 221-8755, Japan
Email: shunsuke-yokosuka@agc.co.jp, masahiro-itou@agc.co.jp
Phone: +81-45-374-7566

In this paper, properties as well as processability of our new class of low-k dielectric material platform based on fluorinated polymer technology is presented and this low-k material shows suitability to passivation and interlayer dielectrics for high performance compound semiconductor devices.

Keywords:  Low-k dielectrics, Interconnect, Passivation, Processing

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