Advanced Low-k Polymer Dielectrics Platform for RF Applications
Ito, Kaori Tsuruoka, Shunsuke Yokotsuka
Asahi Glass Co., Ltd Research Center, 1150 Hazawa, Yokohama 221-8755, Japan
Email: firstname.lastname@example.org, email@example.com
In this paper, properties as well as processability of our new class of low-k dielectric material platform based on fluorinated polymer technology is presented and this low-k material shows suitability to passivation and interlayer dielectrics for high performance compound semiconductor devices.
Keywords: Low-k dielectrics, Interconnect, Passivation, Processing