Resistance and Inductance of Through-Wafer Vias: Models, Measurement, and Scaling

Martin J. Brophy, Thorsten Saeger, and Wes Mickanin*
TriQuint Semiconductor, *Consultant
mbrophy@tqs.com (503) 615-9235

The measurement of substrate vias (SVIAs) in process control modules and the interpretation of that measurement is reviewed. They are seen to typically have resistances of about 5 mOhms and noisily variable inductances of 10 25 pHenry for a nominal 50 um diameter SVIA. Both increase for smaller SVIA diameters.

Keywords: Through-Wafer Vias, Substrate Vias, Test and Measurement, Modeling

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