A Novel Approach for Hermetic Wafer Scale MEMS RF and GaAs Packaging

Gerard Minogue Ravi Mullapudi 
Surfect Technologies Inc. Albuquerque,NM 
Phone: 505-294-6354  Email: gminogue@surfect.com

Hionix Inc. San Jose, CA  ravi@hionix.com

Technical advances in RF and GaAs devices have generally outpaced those in device packaging.  This disparity has created a situation where packaging technology can become a limiter to device performance.  A process strategy is presented here for massively parallel creation of hermetic wafer scale packaging for RF devices.

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