A Novel Approach for Hermetic Wafer Scale MEMS RF and GaAs Packaging
Minogue Ravi Mullapudi
Surfect Technologies Inc. Albuquerque,NM
Hionix Inc. San Jose, CA email@example.com
Technical advances in RF and GaAs devices have generally outpaced those in device packaging. This disparity has created a situation where packaging technology can become a limiter to device performance. A process strategy is presented here for massively parallel creation of hermetic wafer scale packaging for RF devices.