Reversible Wafer Bonding; Challenges in Ramping up 150mm GaAs Wafer Production to Meet Growing Demand.

 

Suzanne Combe, John Cullen, Matthew O’Keefe.

 

 Filtronic IP, Newton Aycliffe, County Durham, DL5 6JW. UK.

Phone + 44 1325 301111, Fax + 44 1325 306600

email suzanne.combe@filcs.com

 

Key Words: 150mm GaAs wafer, backend process, cycle time reduction, process capability, yield.

 



ABSTRACT

 

At Filtronic Compound Semiconductors’ 150mm gallium arsenide wafer fab in Newton Aycliffe a reversible wafer bonding process has been developed to accommodate a significant increase in wafer production through the backend processes. This method of mounting and demounting wafers from sapphire substrates has produced mechanical and visual yield exceeding 99% while demonstrating process capability for wafer thinning  >1.7 CpK. This paper will discuss the process development for wafer bonding and de-bonding in a volume-manufacturing environment along with the challenges experienced with rapid growth in wafer demand.

 

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