Statistical Quality Control of Wafer Level DC Die Sort Test

Y. Z. Wang, R. S. Persaud, R. C. Salvador and D. J. Troy,

Anadigics, Inc

141 Mt. Bethel Road, Warren, NJ 07059

Tel: (908) 668-5000, e-mail: ywang@anadigics.com

 

Keywords: Die Sort, statistical quality control, yield, yield excursion

 

Abstract

In this report, we developed a statistical quality ontrol (SQC) system associated in our test programs to control wafer level DC Die Sort test by providing controls over TRI failures, bin yield loss and mean and standard deviation variances of key parameters.  This SQC system has dramatically reduced the test caused yield loss ~1.2% since the tool was implemented.  The yield excursions have been captured in real-time from the control of bin yields and variability of the critical parameters.  Productivity is also greatly improved by integrating automated recipe downloading and TRI re-test as well as Die Sort disposition decision making into the process.

 

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