Status and Progress in InP Optoelectronic Processing:

Towards Higher Levels of Integration

 

Jacco L. Pleumeekers, Richard P. Schneider, Jr., Atul Mathur, Sheila K. Hurtt, Peter W.

Evans, Andrew G. Dentai, Charles H. Joyner, Damien J.H. Lambert, Sanjeev Murthy,

Ranjani Muthiah, Johan Baeck, Mark J. Missey, Randal A. Salvatore, Mehrdad Ziari,

Masaki Kato, Radhakrishnan Nagarajan, Jeffrey S. Bostak, Timothy Butrie, Vincent G.

Dominic, Mike Kauffman, Richard H. Miles, Matthew L. Mitchell, Alan C. Nilsson,

Stephen C. Pennypacker, Rory Schlenker, Robert B. Taylor, Huan-Shang Tsai, Michael

F. Van Leeuwen, Jonas Webjorn, Drew Perkins, Jagdeep Singh, Stephen G. Grubb,

Michael Reffle, David G. Mehuys, Fred A. Kish, and David F. Welch

 

Infinera Corporation, Sunnyvale, CA 94089 USA (email rschneider@infinera.com)

 

 

Keywords: InP, optoelectronic devices, monolithic integration, yield management, process control, manufacturing

 

 

Abstract

     The status and progress of InP optoelectronic integration is reviewed. It is shown that Infinera has been able to commercialize large-scale photonic integrated circuits with more than 50 components on a single InP chip through a set of well controlled processes and robust component designs. The architecture and performance of Infinera’s PICs is described, along with relevant yield and production metrics that make this platform at once manufacturable and scalable.

 

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