Status and Progress in InP Optoelectronic Processing:
Towards Higher Levels of Integration
Jacco L. Pleumeekers, Richard P. Schneider, Jr.,
Evans, Andrew G. Dentai, Charles H. Joyner, Damien
Stephen C. Pennypacker, Rory Schlenker, Robert B. Taylor, Huan-Shang Tsai, Michael
F. Van Leeuwen,
Michael Reffle, David G. Mehuys, Fred A. Kish, and David F. Welch
The status and progress of InP optoelectronic integration is reviewed. It is shown that Infinera has been able to commercialize large-scale photonic integrated circuits with more than 50 components on a single InP chip through a set of well controlled processes and robust component designs. The architecture and performance of Infinera’s PICs is described, along with relevant yield and production metrics that make this platform at once manufacturable and scalable.