J. M. Liu, Y.S. Lu, X.S. Pang Wireless Packaging System Laboratory, Technology Solutions Organization, Freescale Semiconductor (China) Ltd.
R60671@freescale.com Tel: 86-22-85686447 Fax: 86-22-85686555
Keywords: FFT, Granular Compound, Fine Pitch
The paper introduces the advantages of FFT mold technology, and presents an analysis of granular compound properties and parameters effect on wire sweep. Key mold parameters for 44um fine pitch device are determined based on wire sweep performance and wire sweep can be controlled below 1.5%. Strip warpage after PMC (Post Mold Cure) is resolved through FEM analysis and compound formation improvement.