On Wafer Reliability Test Bench for PHEMT and HBT Technologies

 

F. Bourgeois, M. Lanz, G.Jonsson, H. Stieglauer and D. Behammer

 

United Monolithic Semiconductors - GmbH, Wilhelm-Runge-strasse11.D-89081 Ulm-Germany

Phone: +49-731-505-3092, Fax: +49-731-505-3005, e-mail: bourgeoi@ums-ulm.de

 

Keywords: On Wafer Reliability, PHEMT, HBT, Life-test

 

INTRODUCTION

Fast reliability testing is a key point for III-V technologies.  This is particularly true when modifications have to be implemented on the production line.  Such modifications can be sorted in four categories: raw material, new equipment, process step and design rule modifications.  endurance tests have to be performed to ensure that through the modified steps the reliability of the technology has not been changed.

 

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