Study on effect of fabrication process on TDDB lifetime of MIM capacitors

T. Kagiyama, Y. Tosaka, R. yamabi, and H.Yano

Eudyna Devices Inc.
1, Kanai-cho, Sakae-ku, Yokohama, 244-0845 Japan
Tel: +81-45-853-8153, Fax +81-45-853-8170,-E-mail: t.kagiyama@eudyna.com

Keywords: MIM capacitor, TDDB lifetime, Wet cleaning, Plasma ashing

Abstract

The lifetime of MIM capacitor is studied focused on fabrication process conditions.  Comparing the lifetime of capacitors cleaned with various reagents, wehave revealed that wet cleaning of lower electrode has distinct effect on capacitor lifetime.  We have also investigated the effect of plasma ashing on SiN film and found that high-pressure paralled plate etcher is preferred to remote plasma etcher.

 

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