MMIC Packaging and Heterogeneous Integration Using Wafer-Scale Assembly

P. Chang-Chien, X. Zeng, K. Tornquist, M. Nishimoto, M. Battung, Y. Chung, J. Yang, D. Farkas, M. Yajima, C. Cheung, K. Luo, D. Eaves, J. Lee, J. Uyeda, and M. Barsky

Northrop Grumman Space Technology One Space Park, Redondo Beach, CA 90278 Patty Chang-Chien, Email: patty.chang-chien@ngc.com Tel: (310) 812-7432

Keywords: Wafer Scale Assembly, Wafer-Level Packaging, Wafer Bonding, Heterogeneous Integration

Abstract

Northrop Grumman Space Technology (NGST) has developed a MMIC compatible, hermetic Wafer Scale Assembly (WSA) technology that is proven to be mechanically and electrically robust. This WSA technology is an enabling technology for realizing lightweight, multifunctional and low cost modules for current and future space and military systems. In this paper, data obtained from various DC/RF interconnect structures as well as packaged MMICs using NGST’s 2layer WSA technology is presented. Furthermore, RF front-end modules with integrated antenna are also demonstrated. Data from the integrated RF module as well as multiple-layer DC/RF structures fabricated in a 4-layer WSA configuration is also presented. NGST’s WSA technology enables true three-dimensional circuit integration by allowing intimate multi-function integration among various MMIC technologies and offers significant size and weight advantages to future high performance RF systems.

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