High Yield Intra-Cavity Interconnection Fabrication Method And Characterization Methodologies

M. Yajima, P. Chang-Chien, X. Zeng, K. Luo, C. Cheung, K. Tornquist, and M. Barsky

Northrop Grumman Space Technology One Space Park, Redondo Beach, CA 90278 Tel: (310) 813-9195, Email: melanie.yajima@ngc.com

Keywords: Interconnections, wafer level packaging, wafer bonding, heterogeneous integration, test structures.

ABSTRACT

Northrop Grumman Space Technology has demonstrated the capability to manufacture intra-cavity interconnections (ICICs), which consistently yield greater than 99%. These ICICs are an integral part of MMICs packaged at the wafer level using wafer bonding techniques. Efficient test structures were designed to evaluate these interconnects, allowing fast on-wafer assessment of interconnect yield in a production environment.

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