Development of a Lead Free Solder Bumped RFIC Switch Process

Suzanne Combe, John S Atherton, Matthew F O’Keefe, Chris Main Filtronic IP, Newton Aycliffe, County Durham, DL5 6JW. UK. Phone + 44 1325 301111, Fax + 44 1325 306600

email suzanne.combe@filcs.com

Key Words: 150mm GaAs wafer, lead free solder bump, flip chip.

ABSTRACT

As the RF front-end module market aggressively strives to reduce both size and cost of their assemblies, the consumer demands ever-increasing levels of functionality. To accommodate this front-end module makers are looking to more advanced packaging solutions which accommodate the increased pin counts of advancing architectures while also enabling simplified assembly processing.

At Filtronic Compound Semiconductors’ 150mm gallium arsenide wafer fab in Newton Aycliffe, a high yielding RF switch process with flip chip capability is being developed for high volume applications.  Whilst maintaining the ethos within Filtronic to provide products mindful of regulatory and industry requirements, such as the Restriction of Hazardous Substances Directive (RoHS), and offer Lead (Pb)-Free and environmental considerate solutions to meet the needs of its customers.

This paper will discuss the wafer level process development of a lead free solder bumped process and necessary process controls and wafer level qualification results.

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