Lessons Learned from Laser Dicing

Travis A Abshere, Moreen Minkoff, and Bill Howell
TriQuint Semiconductor, 2300 NE Brookwood Parkway, Hillsboro, OR 97124
tabshere@tqs.com, (503) 615-9445
Keywords: LASER DICING, SINGULATION, WET CHEMICAL CLEANING, DIE CRACK
Abstract
Every project has challenges that must be overcome in order to drive to completion. Bringing laser dicing up to production provided several lessons that will
improve similar efforts at TriQuint and may be valuable to others within the industry. Issues to be discussed include 1) a surprising wire bond short caused by opening up a dielectric layer in the streets. 2) A late in the project change to the size of the hoop stretch rings needed for die separation. 3) Importance of die edge recast to die strength. 4) Low level die crack problem that occurred despite emphasizing testing for die cracks during the reliability testing (REL) portion of the project.
 
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