Green Semiconductor Manufacturing Potential New Routes Using Aqueous

Solution Chemistry

 

David C. Johnson1, Darren W. Johnson2, John F. Wager3 and Douglas Keszler4

1 Department of Chemistry, University of Oregon, Eugene, OR 97403 davej@uoregon.edu 541-346-4612

2 Department of Chemistry, University of Oregon, Eugene, OR 97403 dwj@uoregon.edu 541-346-1695

3School of Electrical Engineering and Computer Science, Oregon State University, Corvallis, OR jfw@ece.orst.edu 541-737-2994

4 Department of Chemistry, Oregon State University, Corvallis, OR Douglas.Keszler@oregonstate.edu 541-737-6736

 

Keywords: green manufacturing, photoresist, dielectric films

 

Abstract

There are exceptional opportunities to increase materials efficiencies in semiconductor manufacturing. The challenge is maintaining or increasing performance while reducing waste. The Center for Green Materials Chemistry is developing a platform of solution based inks for direct deposition of high performance inorganic films at atmospheric pressure and low temperature. This platform should be useful for applications ranging from the extreme end of the nanoscale in support of wafer processing to state of the art large area substrates. Results are presented on the deposition of nanoscale thin films of high performance, fully dense amorphous materials from aqueous based solutions. Results are also presented demonstrating that these films can be directly patterned, eliminating the need for a separate photo resist layer.

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