Novel packaging solutions for GaN power electronics:
Silver-diamond composite packages
Keywords: Thermal management, diamond composites, thermal modeling, thermal conductivity, GaN
We present a new packaging solution for GaN power electronics for efficient heat extraction needed for high power devices. The benefits of using silver diamond composite as base plate in packages for GaN power bars is demonstrated. A dramatic improvement in thermal management (as high as ~50%) was obtained with respect to the existing packaging technologies based on CuW. Micro-Raman thermography measurements were carried out to determine the device temperature at a range of operating power levels. A finite element thermal model was built to assert the obtained experimental results and was found to be in good agreement.