Shuffle Up and Deal: the Use of Wafer Randomization as a Yield and Process Analysis Tool

Albert Wang, Mark Urfer, Steve Shevenock, Wayne Richling, Stan Strathman
Avago Technologies, Fort Collins, Colorado, USA (albert.w.wang@avagotech.com , +1 970 288-4230)
Keywords: wafer randomization, yield analysis, process troubleshooting

Abstract
The use of repeated wafer randomization throughout a process flow can be correlated to yield or other observables to identify problematic tools or process steps. This technique can help identify bad chambers in multichamber tools, conditioning of tools through the process to change observables, or process dependences which were not previously understood. Although less effective on small lots, the technique is sometimes capable of revealing trends across a series of lots.

Paper 9a.2.pdf