Film growth characterization of pulse electrodeposited Au/Sn thin films
Barbara Djurfors and Douglas G. Ivey
Department of Chemical and Materials Engineering
One of the more promising lead-free solders currently being used in GaAs-based and InP-based optoelectronic and microelectronic packaging applications is eutectic Au/Sn (30 at%Sn). The film growth characteristics were studied to better understand the deposition mechanisms for Au5Sn and AuSn. AuSn deposits more rapidly and the process is growth controlled. Au5Sn deposition is slower and is nucleation controlled.