Applications of Compound Semiconductors in High Data Rate Optic Fiber Communications

Y. K. Chen, Y. Baeyens, R. Hamm, G. Georgiou, C-T Liu, R. Kopf, J-M Kuo, Y. Yang, H. Maynard, N. Weimann, C. Chen, A. Tate, J. Frackoviak, M. Melendes, R. Reyes

This talk will provide a general overview of the high speed electronics necessary to provide the essential physical layer interface between the high speed TDM optical signals and the lower bit-rate tributary electrical signals. We will examine the performance requirement of each critical function block and the associated compound semiconductor IC technologies needed to achieve an ETDM data rate of 40 Gbps per wavelength.