Thermal Management of High Power Devices

J. Laskar, S. Nuttinck, and S. Pinel

Georgia Electronic Design Center, School of E.C.E., Georgia Institute of Technology Atlanta, GA 30332

Email: Tel: 404 385 6009


Keywords: power devices, thermal effects, micro-channels



We report in this paper the thermal effects onto the performances of high power microwave transistors. Also, thermal simulation results along with means to optimize the heat dissipation on a wafer level are discussed. Finally we present a novel active thermal management technique using micro-fluidic channels. The simple fabrication process is presented.


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