RF SiP Technology: Integration and Innovation

Jianhua Wu, Dave Coller, Michael J. Anderson and Greg Guth


141 Mt. Bethel Road, Warren, NJ 07059, USA



Keywords: Electronic packaging, RF SiP, system integration



With the continued demand for electronic systems and sub-systems with more functionality, high performance, smaller size and lower cost, system-in-package (SiP) modules have been growing rapidly in recent years as an alternative solution for system-on-chip (SoC).  As a packaging technology platform, SiP allows a high degree of flexibility in the package architecture, particularly for radio frequency (RF) applications.  RF SiP is an enabling packaging platform for wireless communication and data access, which allows the integration of digital integrated circuits (ICs), logic ICs and RFICs into a compact RF system, or sub-system within a single module format using state-of-the-art manufacturing technology converged from IC chip and wire packaging and SMT assembly.


In this paper the trends of wireless access and mobile networking technologies are reviewed.  Technical challenges and constraints to wireless systems for handset and mobile access applications are discussed.  The packaging technology choice, performance and cost trade-offs are presented using RF SiP as a packaging platform.  Finally, new RF SiP technology formats are presented to provide an innovative solution, through integration, to meet the demands of miniaturization, performance and cost for wireless handset and other mobile products.


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