Stepper-Based Integrated Process on Wafer Pieces
Cohen-Nov, V. Krasniansky, G. Buinin, J. Kaplun, L. Ortenberg and R.
Ben-Or GAL-EL (MMIC) P.O. Box 330,
Ashdod 77102, Israel
Email: firstname.lastname@example.org, email@example.com
High-cost compound semiconductors involve complicated technological development. Using pieces of a whole wafer allows performing the R&D process in a cost-effective way. We developed a method for the processing a piece of wafer using standard manufacturing equipment. This method provides the benefits of high-resolution and superior alignment capability of a stepper with the low-cost advantages of working with wafer pieces that normally cannot be exposed in a stepper. This article describes what we do in order to allow processing of mounted InP piece in regular FAB equipment.
Keywords: Pieces, Wafer fragments, Stepper, Permanent mounting, InP