Improving Final Test Yield and Reliability through Backside Final Outgoing Inspection
Leggins, Jan Campbell
Implementing an automated frontside final outgoing inspection (FOI) process on power amplifiers is not new. However, until recently technology to automatically inspect backside vias had not been developed, but compound Semiconductor Fab One (CS1) has implemented a process that can distinguish between visually “good” and visually “bad” backside vias. The importance of implementing an inspection process on the backside vias is crucial in maintaining final test yields and insuring reliable devises are passed along to the final user. This paper presents the benefits of implementing a backside via inspection process.
Keywords: Backside Vias, Final Outgoing Inspection