Cross-functional Optimization of Backside Metal Adhesion to GaAs
Knoedler, A. Aleman, E. Babcock, P. Bal, S. Canale, B. Darley, N. Ebrahimi, Q.
Luo, S. Mony, Y. Recsei, J. Riege, J. Sawyer*, S. Tiku, D. Zapp
Sun, Skyworks Solutions, Inc. 2427 Hillcrest Drive, Newbury Park, CA 91320 *Formerly of Skyworks Solutions, Inc.,
A cross-functional team was
formed to investigate backside metal adhesion as die sizes shrunk in Skyworks’
Keywords: backside, adhesion, metallization, UV tape, die shrink, through wafer via