Flip Chip Technology Vendor Overview

Mark S. Hauhe RF Tech Director
Advanced Concepts & Technology
2000 El Segundo Blvd. El Segundo, CA 90245 Bldg. E01 M/S A135
310-647-0322 mhauhe@raytheon.com

Advancements in the packaging of semiconductor devices traditionally use wire bonds to provide the interconnect from device to substrate or to other active devices. Flip chip offers advantages over traditional interconnect schemes. A smaller overall footprint can be realized, better thermal heat transfer, and improved performance especially at higher frequencies are all enabled through the use of flip chip technology.

Keywords: Active Array, flip chip, MMIC

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