Improvements in the Process for Electrodeposition of Au-Sn Alloys
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An electroplating process has been developed to deposit gold rich, Au-Sn eutectic alloys from a single, non-cyanide, slightly acidic bath onto metallized semiconductor substrates. However, commercial exploitation is limited by plating bath lifetime and plating rates. In this paper, the most effective factors influencing the lifetime and the plating rate are determined. Next, a statistical design approach (Box-Behnken) is taken to try to optimize the essential factors and, consequently, electrolyte lifetime and deposition rates. A multiple response optimizer using commercial software can then be used to analyze the data to determine the optimal combination of solution components to both improve the stability and the plating rate.