Paradigm Shift in Compound Semiconductor Production since the Introduction of Laser Dicing

Rene Hendriks, Jeroen van Borkulo and Mark Mueller
Advanced Laser Separation International (ALSI) NV, Beuningen, the Netherlands Phone: +31-(0)246782888 E-mail address:

Keywords: Laser dicing, Multibeam, HAZ, Solar Cells, CSH

This paper will address the impact of multi beam laser dicing on the dicing process capability in the backend of the line, as well the advantages it brings for manufacturing optimization such as cycle time reduction, cost reduction, wafer and dicing yield improvement, and elimination of backside processes.


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