EM Simulation and Development of Wafer Level Micro-packaging Technique for
GaAs-based RFMEMS Switches
Keywords: RFMEMS, wafer level packaging, micro-cap, reactive ion etching, EM simulation
Abstract: We present here a technique for wafer level micro-packaging of GaAs based RFMEMS switches. The developed technique is simple yet effective as it has a very minimal effect on the switch performance. Effects of package cavity height and physical properties of the cap material have been analyzed by full wave simulation and the optimal parameters were used during fabrication.