TaN Resistor Process Development and Integration
Keywords: tantalum nitride, stabilization bake, resistor, process control, lift-off lithography, design of
This paper describes the development and implementation of an integrated resistor process based on reactively sputtered tantalum nitride. Image reversal lithography was shown to be a superior method for liftoff patterning of these films. The results of a response surface DOE for the sputter deposition of the films are discussed. Several approaches to stabilization baking were examined and the advantages of the hot plate method are shown.