TaN Resistor Process Development and Integration


M.J. Martinez, F.H. Austin, J.B. Clevenger, A.J. Griñe, G.A. Patrizi, K. Romero, P.S. Vigil, S.

Wolfley, C.T. Sullivan

Sandia National Laboratories, Albuquerque, NM 87185

mmarti8@sandia.gov, 505-844-0113

LMATA, Albuquerque, NM 87185


Keywords: tantalum nitride, stabilization bake, resistor, process control, lift-off lithography, design of




This paper describes the development and implementation of an integrated resistor process based on reactively sputtered tantalum nitride. Image reversal lithography was shown to be a superior method for liftoff patterning of these films. The results of a response surface DOE for the sputter deposition of the films are discussed. Several approaches to stabilization baking were examined and the advantages of the hot plate method are shown.



18.5 PDF                                  Return to TOC