-
A. Chevtchenko, S.
Ferdinand-Braun-Institut-
Investigation and Reduction of Leakage Current Associated with Gate Encapsulation in by SiNx AlGaN/GaN HFETs
S. A. Chevtchenko, Ferdinand-Braun-InstitutP. Kurpas, Ferdinand-Braun-InstitutN. Chaturvedi, Ferdinand-Braun-Institut
-
-
A. del Alamo, Jesús
MIT-
The High‐Electron Mobility Transistor at 30: Impressive Accomplishments and Exciting Prospect
Jesús A. del Alamo, MIT
-
-
Alvarez, Brian
Skyworks Solutions, Inc.-
Overall Equipment Efficiency Improvement for GaAs Fab Evaporators
Jesus Teran, Skyworks Solutions, Inc.Daniel WeaverHeather Knoedler, Skyworks SolutionsLam Luu, Skyworks Solutions, Inc.Richard BingleBrian Alvarez, Skyworks Solutions, Inc.Joshua Doria, Skyworks Solutions, Inc.David Holzman, Skyworks Solutions, Inc.Juan Velasquez, Skyworks Solutions
-
-
Aulnette, Cecile
SOITEC-
Advanced Semiconductor on Insulator Substrates for Low Power and High Performance Digital CMOS Applications
Bich-Yen Nguyen, SOITECMariam Sadaka, SOITECNicolas Daval, SOITECWalter Schwarzenbach, SOITECCecile Aulnette, SOITECKonstantin Bourdelle, SOITECFabrice Letertre, SOITECChristophe Maleville, SOITECCarlos Mazure, SOITEC
-
-
Bahouth, Fadi
RFMD-
Reducing Broken Thinned GaAs Wafers During Backside Processing
Fadi Bahouth, RFMD
-
-
Baker, Greg
TriQuint Semiconductor, TX-
Implementation of Value Added Kaizens (VAK) in a GaAs Manufacturing Facility
Jan CampbellRick Cobo, TriQuint Semiconductor, TXDavid Beene, TriQuint Semiconductor, TXJerry Beene, TriQuint Semiconductor,TXGary HeadMartin IviePavan Bhatia, Brewer Science, TriQuint SemiconductorGreg Baker, TriQuint Semiconductor, TX
-
-
Banbrook, Hal
-
Balancing Electrical and Thermal Device Characteristics: Thru Wafer Vias vs. Backside Thermal Vias
Cristian Cismaru, Skyworks Solutions, Inc.Hal Banbrook
-
-
Beene, David
TriQuint Semiconductor, TX-
Implementation of Value Added Kaizens (VAK) in a GaAs Manufacturing Facility
Jan CampbellRick Cobo, TriQuint Semiconductor, TXDavid Beene, TriQuint Semiconductor, TXJerry Beene, TriQuint Semiconductor,TXGary HeadMartin IviePavan Bhatia, Brewer Science, TriQuint SemiconductorGreg Baker, TriQuint Semiconductor, TX
-
-
Beene, Jerry
TriQuint Semiconductor,TX-
The Use of a Structured Approach to Solve Yield Limiting Defects in a Compound Semiconductor Factory
Jan CampbellQizhi HeHowie Yang, TriQuint Semiconductor,TXMartin IvieJohn Gibbon, QorvoDarrel Lupo, TriQuint Semiconductor,TXDario Nappa, TriQuint Semiconductor,TXJerry Beene, TriQuint Semiconductor,TX -
Implementation of Value Added Kaizens (VAK) in a GaAs Manufacturing Facility
Jan CampbellRick Cobo, TriQuint Semiconductor, TXDavid Beene, TriQuint Semiconductor, TXJerry Beene, TriQuint Semiconductor,TXGary HeadMartin IviePavan Bhatia, Brewer Science, TriQuint SemiconductorGreg Baker, TriQuint Semiconductor, TX
-
-
Berger, Otto
TriQuint Semiconductor-
3G/4G Requirements for Wireless Systems and the Role GaAs and GaN
Otto Berger, TriQuint Semiconductor
-
-
Bernardoni. N. Delmonte, M.
University of Parma, Italy-
Modeling of the Impact of Boundary Conditions on AlGaN/GaN HEMT Self Heating
M. Bernardoni. N. Delmonte, University of Parma, ItalyR. Menozzi, University of Parma, Italy
-
-
Bhatia, Pavan
Brewer Science, TriQuint Semiconductor-
Implementation of Value Added Kaizens (VAK) in a GaAs Manufacturing Facility
Jan CampbellRick Cobo, TriQuint Semiconductor, TXDavid Beene, TriQuint Semiconductor, TXJerry Beene, TriQuint Semiconductor,TXGary HeadMartin IviePavan Bhatia, Brewer Science, TriQuint SemiconductorGreg Baker, TriQuint Semiconductor, TX
-
-
Bingle, Richard
-
Overall Equipment Efficiency Improvement for GaAs Fab Evaporators
Jesus Teran, Skyworks Solutions, Inc.Daniel WeaverHeather Knoedler, Skyworks SolutionsLam Luu, Skyworks Solutions, Inc.Richard BingleBrian Alvarez, Skyworks Solutions, Inc.Joshua Doria, Skyworks Solutions, Inc.David Holzman, Skyworks Solutions, Inc.Juan Velasquez, Skyworks Solutions
-
-
Biswas, Dhrubes
Indian Institute of Technology-
Perspectives, Opportunities and Future of Compound Semiconductor Technologies in India
Dhrubes Biswas, Indian Institute of Technology
-
-
Bock, Karlheinz
-
Modular Solid State Technologies for a Multi-functional System Integration
Karlheinz Bock
-
-
Bourdelle, Konstantin
SOITEC-
Advanced Semiconductor on Insulator Substrates for Low Power and High Performance Digital CMOS Applications
Bich-Yen Nguyen, SOITECMariam Sadaka, SOITECNicolas Daval, SOITECWalter Schwarzenbach, SOITECCecile Aulnette, SOITECKonstantin Bourdelle, SOITECFabrice Letertre, SOITECChristophe Maleville, SOITECCarlos Mazure, SOITEC
-
-
Bratschun, Alan
Avago Technologies-
A Study of Implant Damage and Isolation Properties in an InGaP HBT Process
Alan Bratschun, Avago TechnologiesMartin J. Brophy, Avago Technologies
-
-
Bronner, W.
Fraunhofer Institute for Applied Solid State Physics-
From Epitaxy to Backside Process: Reproducible AlGaN/GaN HEMT Technology for Reliable and Rugged Power Devices
W. Bronner, Fraunhofer Institute for Applied Solid State PhysicsP. Waltereit, Fraunhofer InstituteS. Müller, Fraunhofer InstituteM. Dammann, Fraunhofer Institute for Applied Solid State PhysicsR. Kiefer, Fraunhofer Institute for Applied Solid State PhysicsPh. Dennler, Fraunhofer Institute for Applied Solid State PhysicsF. van Raay, Fraunhofer Institute for Applied Solid State PhysicsM. Mußer, Fraunhofer Institute for Applied Solid State PhysicsR. Quay, Fraunhofer Institute for Applied Solid State PhysicsM. Mikulla, Fraunhofer Institute
-
-
Brown, Jerry
TriQuint Semiconductor, TX-
Optimization and Characterization of a Photo Definable BCB for HV3S and HVHBT Technologies
Jerry Brown, TriQuint Semiconductor, TXAmy Zhou, TriQuint Semiconductor, TX
-
-
Burke, Erich
RFMD-
Waste Minimization, Pollution Prevention and Resource Recovery at a GaAs Manufacturer
Erich Burke, RFMD
-
-
Campbell, Jan
-
Improved T-Gate Yield Using E-Beam Trilayer Resist Process
Huatang Chen, TriQuint Semiconductor, TXAndrew Ketterson, Qorvo Inc.Marcus King, TriQuint Semiconductor, TXKeith Salzman, TriQuint Semiconductor, TXVicki Milam, TriQuint Semiconductor, TXJames Halvorson, TriQuint Semiconductor, TXJan Campbell -
The Use of a Structured Approach to Solve Yield Limiting Defects in a Compound Semiconductor Factory
Jan CampbellQizhi HeHowie Yang, TriQuint Semiconductor,TXMartin IvieJohn Gibbon, QorvoDarrel Lupo, TriQuint Semiconductor,TXDario Nappa, TriQuint Semiconductor,TXJerry Beene, TriQuint Semiconductor,TX -
Implementation of Value Added Kaizens (VAK) in a GaAs Manufacturing Facility
Jan CampbellRick Cobo, TriQuint Semiconductor, TXDavid Beene, TriQuint Semiconductor, TXJerry Beene, TriQuint Semiconductor,TXGary HeadMartin IviePavan Bhatia, Brewer Science, TriQuint SemiconductorGreg Baker, TriQuint Semiconductor, TX
-
-
Carlson, E.
Dow Corning Corporation-
Advances in SiC Substrates for Power and Energy Applications
M.J. Loboda, Dow Corning CorporationG. Chung, Dow Corning CorporationE. Carlson, Dow Corning CorporationR. Drachev, Dow Corning CorporationD. Hansen, Dow Corning CorporationE. Sanchez, Dow Corning CorporationJ. Wan, Dow Corning CorporationJ. Zhang, Dow Corning Corporation
-
-
Chang, Chun-Hsiang
National Taiwan University-
Investigation of Low-Temperature Optical Characteristics of InGaN/GaN Based Nanorod Light Emitting Arrays
Chun-Hsiang Chang, National Taiwan UniversityLiang-Yi Chen, National Taiwan UniversityYing-Yuan Huang, National Taiwan University
-
-
Chaturvedi, N.
Ferdinand-Braun-Institut-
Investigation and Reduction of Leakage Current Associated with Gate Encapsulation in by SiNx AlGaN/GaN HFETs
S. A. Chevtchenko, Ferdinand-Braun-InstitutP. Kurpas, Ferdinand-Braun-InstitutN. Chaturvedi, Ferdinand-Braun-Institut
-
-
Chen, Chao-Hong
WIN Semiconductors Corp.-
6 Inch 0.1μm GaAs pHEMT Technology for E/V Band Application
His-Tsung Lin, WIN Semiconductors Corp.Chao-Hong Chen, WIN Semiconductors Corp.Shih-Chun Lee, WIN Semiconductors Corp.I-Te Cho, WIN Semiconductors Corp.
-
-
Chen, Fu-Nung
WIN Semiconductors Corp-
The Demonstration of Enhancement/Depletion-Mode pHEMT Technology with Optimized E-mode Characteristics for Better Yield
Jhih-Han Du, WIN Semiconductors CorpFu-Nung Chen, WIN Semiconductors CorpDavid Wu, WIN Semiconductors CorpKang-Lin Peng, WIN Semiconductors CorpChen-An Hsieh, WIN Semiconductors CorpTsung-Jung Yeh, WIN Semiconductors Corp
-
-
Chen, Hsiang
National Chi Nan University-
Characterizing Reverse-bias Electroluminescence of InGaN/GaN LEDs
Hsiang Chen, National Chi Nan UniversityChuan-Haur Kao, National Chi Nan UniversityTien-Chang Lu, National Chi Nan University
-
-
Chen, Huatang
TriQuint Semiconductor, TX-
Improved T-Gate Yield Using E-Beam Trilayer Resist Process
Huatang Chen, TriQuint Semiconductor, TXAndrew Ketterson, Qorvo Inc.Marcus King, TriQuint Semiconductor, TXKeith Salzman, TriQuint Semiconductor, TXVicki Milam, TriQuint Semiconductor, TXJames Halvorson, TriQuint Semiconductor, TXJan Campbell
-
-
Chen, J.
Global Communication Semiconductors, Inc.-
Managing Process Diversity for Opto Wafer Fabrication in a Photonics Foundry
S. Wang, Global Communication Semiconductors, Inc.F. Monzon, Global Communication Semiconductors, LLCP. Chen, Global Communication Semiconductors, Inc.J. Chen, Global Communication Semiconductors, Inc.D. Kumar, Global Communication Semiconductors, Inc.P. Lao, Global Communication Semiconductors, Inc.J. Pepper, Global Communication Semiconductors, Inc.P. Tran, Global Communication Semiconductors, Inc.M. Chen, Global Communication Semiconductors, LLCD. Hou, Global Communication Semiconductors, LLC
-
-
Chen, Liang-Yi
National Taiwan University-
Investigation of Low-Temperature Optical Characteristics of InGaN/GaN Based Nanorod Light Emitting Arrays
Chun-Hsiang Chang, National Taiwan UniversityLiang-Yi Chen, National Taiwan UniversityYing-Yuan Huang, National Taiwan University
-
-
Chen, M.
Global Communication Semiconductors, LLC-
Process Control Improvements for Critical PECVD SiNx Thin Films
F. Monzon, Global Communication Semiconductors, LLCF. Li, Global Communication Semiconductors, LLCD. Wolfe, Global Communication Semiconductors, LLCT. Dang, Global Communication Semiconductors, LLCM. Chen, Global Communication Semiconductors, LLC -
Managing Process Diversity for Opto Wafer Fabrication in a Photonics Foundry
S. Wang, Global Communication Semiconductors, Inc.F. Monzon, Global Communication Semiconductors, LLCP. Chen, Global Communication Semiconductors, Inc.J. Chen, Global Communication Semiconductors, Inc.D. Kumar, Global Communication Semiconductors, Inc.P. Lao, Global Communication Semiconductors, Inc.J. Pepper, Global Communication Semiconductors, Inc.P. Tran, Global Communication Semiconductors, Inc.M. Chen, Global Communication Semiconductors, LLCD. Hou, Global Communication Semiconductors, LLC
-
-
Chen, P.
Global Communication Semiconductors, Inc.-
Managing Process Diversity for Opto Wafer Fabrication in a Photonics Foundry
S. Wang, Global Communication Semiconductors, Inc.F. Monzon, Global Communication Semiconductors, LLCP. Chen, Global Communication Semiconductors, Inc.J. Chen, Global Communication Semiconductors, Inc.D. Kumar, Global Communication Semiconductors, Inc.P. Lao, Global Communication Semiconductors, Inc.J. Pepper, Global Communication Semiconductors, Inc.P. Tran, Global Communication Semiconductors, Inc.M. Chen, Global Communication Semiconductors, LLCD. Hou, Global Communication Semiconductors, LLC
-
-
Cheng, Kezia
Skyworks Solutions Inc.-
Electron Radiation as an Indicator of Gold Nodule Defect during E-beam Evaporation
Kezia Cheng, Skyworks Solutions Inc.
-
-
Cho, I-Te
WIN Semiconductors Corp.-
6 Inch 0.1μm GaAs pHEMT Technology for E/V Band Application
His-Tsung Lin, WIN Semiconductors Corp.Chao-Hong Chen, WIN Semiconductors Corp.Shih-Chun Lee, WIN Semiconductors Corp.I-Te Cho, WIN Semiconductors Corp.
-
-
Christou, A.
-
Failure Modes and Effects Criticality Analysis (FMECA) of AlGaN/GaN Based Microwave Devices Degradation Mechanisms
Shahrzad Salemi, University of MarylandA. Christou
-
-
Chung, G.
Dow Corning Corporation-
Advances in SiC Substrates for Power and Energy Applications
M.J. Loboda, Dow Corning CorporationG. Chung, Dow Corning CorporationE. Carlson, Dow Corning CorporationR. Drachev, Dow Corning CorporationD. Hansen, Dow Corning CorporationE. Sanchez, Dow Corning CorporationJ. Wan, Dow Corning CorporationJ. Zhang, Dow Corning Corporation
-
-
Chung, Jinwook
MIT-
The Best Material for the Function: Seamless On-Wafer Integration of GaN and Si Devices
Hyung-Seok Lee, MITKevin Ryu, MITJinwook Chung, MIT
-
-
Cismaru, Cristian
Skyworks Solutions, Inc.-
Balancing Electrical and Thermal Device Characteristics: Thru Wafer Vias vs. Backside Thermal Vias
Cristian Cismaru, Skyworks Solutions, Inc.Hal Banbrook
-
-
Clausen, Mike
PETEC-
Introduction to the PETEC Flexible Electronics Centre and Technology Challenges
Mike Clausen, PETECBela Green, PETECMartin Walkinshaw, PETECSimon Ogier, PETEC
-
-
Cobo, Rick
TriQuint Semiconductor, TX-
Implementation of Value Added Kaizens (VAK) in a GaAs Manufacturing Facility
Jan CampbellRick Cobo, TriQuint Semiconductor, TXDavid Beene, TriQuint Semiconductor, TXJerry Beene, TriQuint Semiconductor,TXGary HeadMartin IviePavan Bhatia, Brewer Science, TriQuint SemiconductorGreg Baker, TriQuint Semiconductor, TX
-
-
Crites, J.
Skyworks Solutions Inc.-
Relocation of Cobham’s MMIC Wafer Fab
M. Drinkwine, CobhamJ. Crites, Skyworks Solutions Inc.
-
-
D. Albrecht, John
Defense Advanced Research Projects Agency-
THz Electronics: Transistors, TMICs, and High Power Amplifiers
John D. Albrecht, Defense Advanced Research Projects Agency
-
-
D. Dupuis, Russell
Georgia Institute of Technology, Atlanta, GA-
GaN/InGaN Heterojunction Bipolar Transistors with Collector Current Density > 20 kA/cm2
Yun Zhang, Institute of Semiconductors, Chinese Academy of Sciences, BeijingYi-Che Lee, Georgia Institute of TechnologyZachary Lochner, Georgia Institute of TechnologyHee Jin Kim, Lumileds LLCJae-Hyun Ryou, Georgia Institute of TechnologyRussell D. Dupuis, Georgia Institute of Technology, Atlanta, GA
-
-
Dai, Peter
Skyworks Solution, Inc.-
Plasma Etch Induced Surface Damage and its Impacts on GaAs Schottky Diodes
Hong ShenPeter Dai, Skyworks Solution, Inc.
-
-
Dammann, M.
Fraunhofer Institute for Applied Solid State Physics-
From Epitaxy to Backside Process: Reproducible AlGaN/GaN HEMT Technology for Reliable and Rugged Power Devices
W. Bronner, Fraunhofer Institute for Applied Solid State PhysicsP. Waltereit, Fraunhofer InstituteS. Müller, Fraunhofer InstituteM. Dammann, Fraunhofer Institute for Applied Solid State PhysicsR. Kiefer, Fraunhofer Institute for Applied Solid State PhysicsPh. Dennler, Fraunhofer Institute for Applied Solid State PhysicsF. van Raay, Fraunhofer Institute for Applied Solid State PhysicsM. Mußer, Fraunhofer Institute for Applied Solid State PhysicsR. Quay, Fraunhofer Institute for Applied Solid State PhysicsM. Mikulla, Fraunhofer Institute
-
-
Dang, T.
Global Communication Semiconductors, LLC-
Process Control Improvements for Critical PECVD SiNx Thin Films
F. Monzon, Global Communication Semiconductors, LLCF. Li, Global Communication Semiconductors, LLCD. Wolfe, Global Communication Semiconductors, LLCT. Dang, Global Communication Semiconductors, LLCM. Chen, Global Communication Semiconductors, LLC
-
-
Daval, Nicolas
SOITEC-
Advanced Semiconductor on Insulator Substrates for Low Power and High Performance Digital CMOS Applications
Bich-Yen Nguyen, SOITECMariam Sadaka, SOITECNicolas Daval, SOITECWalter Schwarzenbach, SOITECCecile Aulnette, SOITECKonstantin Bourdelle, SOITECFabrice Letertre, SOITECChristophe Maleville, SOITECCarlos Mazure, SOITEC
-
-
DenBaars, Steven
UCSB-
Optoelectronic Devices Grown on Nonpolar and Semipolar Free-Standing GaN Substrates
Daniel Feezell, Center for High Technology Materials, Department of Electrical Engineering, University of New MexicoJames Speck, UCSBSteven DenBaars, UCSB
-
-
Dennler, Ph.
Fraunhofer Institute for Applied Solid State Physics-
From Epitaxy to Backside Process: Reproducible AlGaN/GaN HEMT Technology for Reliable and Rugged Power Devices
W. Bronner, Fraunhofer Institute for Applied Solid State PhysicsP. Waltereit, Fraunhofer InstituteS. Müller, Fraunhofer InstituteM. Dammann, Fraunhofer Institute for Applied Solid State PhysicsR. Kiefer, Fraunhofer Institute for Applied Solid State PhysicsPh. Dennler, Fraunhofer Institute for Applied Solid State PhysicsF. van Raay, Fraunhofer Institute for Applied Solid State PhysicsM. Mußer, Fraunhofer Institute for Applied Solid State PhysicsR. Quay, Fraunhofer Institute for Applied Solid State PhysicsM. Mikulla, Fraunhofer Institute
-
-
Doria, Joshua
Skyworks Solutions, Inc.-
Overall Equipment Efficiency Improvement for GaAs Fab Evaporators
Jesus Teran, Skyworks Solutions, Inc.Daniel WeaverHeather Knoedler, Skyworks SolutionsLam Luu, Skyworks Solutions, Inc.Richard BingleBrian Alvarez, Skyworks Solutions, Inc.Joshua Doria, Skyworks Solutions, Inc.David Holzman, Skyworks Solutions, Inc.Juan Velasquez, Skyworks Solutions
-
-
Drachev, R.
Dow Corning Corporation-
Advances in SiC Substrates for Power and Energy Applications
M.J. Loboda, Dow Corning CorporationG. Chung, Dow Corning CorporationE. Carlson, Dow Corning CorporationR. Drachev, Dow Corning CorporationD. Hansen, Dow Corning CorporationE. Sanchez, Dow Corning CorporationJ. Wan, Dow Corning CorporationJ. Zhang, Dow Corning Corporation
-
-
Drinkwine, M.
Cobham-
Relocation of Cobham’s MMIC Wafer Fab
M. Drinkwine, CobhamJ. Crites, Skyworks Solutions Inc.
-
-
Du, Jhih-Han
WIN Semiconductors Corp-
The Demonstration of Enhancement/Depletion-Mode pHEMT Technology with Optimized E-mode Characteristics for Better Yield
Jhih-Han Du, WIN Semiconductors CorpFu-Nung Chen, WIN Semiconductors CorpDavid Wu, WIN Semiconductors CorpKang-Lin Peng, WIN Semiconductors CorpChen-An Hsieh, WIN Semiconductors CorpTsung-Jung Yeh, WIN Semiconductors Corp
-
-
Dungan, Tom
Avago Technologies-
Characterization of BCB Planarization of Isolated and Dense Features in a High-Topography HBT Process
Tom Dungan, Avago Technologies
-
-
Ebrahimi, Nercy
Skyworks Solution Inc.-
Plating Showerhead System for Improved Backside Wafer Plating
Jens Riege, Skyworks Solutions, Inc.Heather Knoedler, Skyworks SolutionsShiban Tiku, Skyworks Solutions, Inc.Nercy Ebrahimi, Skyworks Solution Inc. -
A New Method for Creating Sloped Resist Profiles Using Mask Structures
Jens Riege, Skyworks Solutions, Inc.Samuel Mony, Skyworks Solutions, Inc.Nercy Ebrahimi, Skyworks Solution Inc.
-
-
Evertsen, Rogier
ALSI-
Backside Processing Steps Elimination and Cost Reduction by Multi Beam Full Cut Laser Dicing
Rogier Evertsen, ALSIRene Hendriks, ALSI
-
-
Faili, Firooz
Element Six Technologies, Santa Clara, CA-
Material Studies of GaN on Diamond
Sergey Zaitsev, Group4 Labs, Inc.Frank Lowe, Akash Systems, San Francisco, CA, USADaniel Francis, Akash Systems, San Francisco, CA, USAFirooz Faili, Element Six Technologies, Santa Clara, CA
-
-
Feezell, Daniel
Center for High Technology Materials, Department of Electrical Engineering, University of New Mexico-
Optoelectronic Devices Grown on Nonpolar and Semipolar Free-Standing GaN Substrates
Daniel Feezell, Center for High Technology Materials, Department of Electrical Engineering, University of New MexicoJames Speck, UCSBSteven DenBaars, UCSB
-
-
Fong, D.
UCLA-
Engineered Substrates: Alternative Technologies using Materials Integration
M.S. Goorsky, University of California, Los Angeles, CA USAM. Jackson, UCLAM. Joshi, UCLAC. Ventosa, UCLAX. Kuo, UCLAD. Fong, UCLA
-
-
Francis, Daniel
Akash Systems, San Francisco, CA, USA-
Material Studies of GaN on Diamond
Sergey Zaitsev, Group4 Labs, Inc.Frank Lowe, Akash Systems, San Francisco, CA, USADaniel Francis, Akash Systems, San Francisco, CA, USAFirooz Faili, Element Six Technologies, Santa Clara, CA
-
-
Friedrichs, Peter
Infineon Technologies, Neubiberg, Germany-
SiC Power Devices – Lessons Learned and Prospects After 10 Years of Commercial Availability
Peter Friedrichs, Infineon Technologies, Neubiberg, Germany
-
-
Gao, Xiang
IQE RF LLC-
A Statistical Study of AlGaN/GaN HEMT Uniformity with Various Buffer and Barrier Structures
Xiang Gao, IQE RF LLCDaniel Gorka, IQE RF LLCSongponn Vatanapradit, IQE RF LLCMing Pan, Veeco Instruments
-
-
Gibbon, John
Qorvo-
The Use of a Structured Approach to Solve Yield Limiting Defects in a Compound Semiconductor Factory
Jan CampbellQizhi HeHowie Yang, TriQuint Semiconductor,TXMartin IvieJohn Gibbon, QorvoDarrel Lupo, TriQuint Semiconductor,TXDario Nappa, TriQuint Semiconductor,TXJerry Beene, TriQuint Semiconductor,TX
-
-
Goorsky, M.S.
University of California, Los Angeles, CA USA-
Engineered Substrates: Alternative Technologies using Materials Integration
M.S. Goorsky, University of California, Los Angeles, CA USAM. Jackson, UCLAM. Joshi, UCLAC. Ventosa, UCLAX. Kuo, UCLAD. Fong, UCLA
-
-
Gorka, Daniel
IQE RF LLC-
A Statistical Study of AlGaN/GaN HEMT Uniformity with Various Buffer and Barrier Structures
Xiang Gao, IQE RF LLCDaniel Gorka, IQE RF LLCSongponn Vatanapradit, IQE RF LLCMing Pan, Veeco Instruments
-
-
Green, Bela
PETEC-
Introduction to the PETEC Flexible Electronics Centre and Technology Challenges
Mike Clausen, PETECBela Green, PETECMartin Walkinshaw, PETECSimon Ogier, PETEC
-
-
Halvorson, James
TriQuint Semiconductor, TX-
Improved T-Gate Yield Using E-Beam Trilayer Resist Process
Huatang Chen, TriQuint Semiconductor, TXAndrew Ketterson, Qorvo Inc.Marcus King, TriQuint Semiconductor, TXKeith Salzman, TriQuint Semiconductor, TXVicki Milam, TriQuint Semiconductor, TXJames Halvorson, TriQuint Semiconductor, TXJan Campbell
-
-
Hansen, D.
Dow Corning Corporation-
Advances in SiC Substrates for Power and Energy Applications
M.J. Loboda, Dow Corning CorporationG. Chung, Dow Corning CorporationE. Carlson, Dow Corning CorporationR. Drachev, Dow Corning CorporationD. Hansen, Dow Corning CorporationE. Sanchez, Dow Corning CorporationJ. Wan, Dow Corning CorporationJ. Zhang, Dow Corning Corporation
-
-
He, Qizhi
-
The Use of a Structured Approach to Solve Yield Limiting Defects in a Compound Semiconductor Factory
Jan CampbellQizhi HeHowie Yang, TriQuint Semiconductor,TXMartin IvieJohn Gibbon, QorvoDarrel Lupo, TriQuint Semiconductor,TXDario Nappa, TriQuint Semiconductor,TXJerry Beene, TriQuint Semiconductor,TX
-
-
Head, Gary
-
Implementation of Value Added Kaizens (VAK) in a GaAs Manufacturing Facility
Jan CampbellRick Cobo, TriQuint Semiconductor, TXDavid Beene, TriQuint Semiconductor, TXJerry Beene, TriQuint Semiconductor,TXGary HeadMartin IviePavan Bhatia, Brewer Science, TriQuint SemiconductorGreg Baker, TriQuint Semiconductor, TX
-
-
Hendriks, Rene
ALSI-
Backside Processing Steps Elimination and Cost Reduction by Multi Beam Full Cut Laser Dicing
Rogier Evertsen, ALSIRene Hendriks, ALSI
-
-
Hirose, M.
Toshiba Corp.-
Effects of Via Layout on AlGaN/GaN HEMTs at Ka-band
K. Matsushita, Toshiba Corp.H. Sakurai, Toshiba Corp.S. Nakanishi, Toshiba Corp.K. Takagi, Toshiba Corp.H. Kawasaki, Toshiba Corp.Y. Takada, Toshiba Corp.M. Hirose, Toshiba Corp.
-
-
Holzman, David
Skyworks Solutions, Inc.-
Overall Equipment Efficiency Improvement for GaAs Fab Evaporators
Jesus Teran, Skyworks Solutions, Inc.Daniel WeaverHeather Knoedler, Skyworks SolutionsLam Luu, Skyworks Solutions, Inc.Richard BingleBrian Alvarez, Skyworks Solutions, Inc.Joshua Doria, Skyworks Solutions, Inc.David Holzman, Skyworks Solutions, Inc.Juan Velasquez, Skyworks Solutions
-
-
Hong, Bing-San
WIN Semiconductors Corp.-
The Study of Heterojunction Bipolar Transistors for High Ruggedness Performance
Szu-Ju Li, WIN Semiconductors Corp.Cheng-Kuo Lin, WIN Semiconductors CorpShu-Hsiao Tsai, WIN Semiconductors CorpBing-San Hong, WIN Semiconductors Corp.Dennis William, WIN Semiconductors Corp.
-
-
Hou, D.
Global Communication Semiconductors, LLC-
Managing Process Diversity for Opto Wafer Fabrication in a Photonics Foundry
S. Wang, Global Communication Semiconductors, Inc.F. Monzon, Global Communication Semiconductors, LLCP. Chen, Global Communication Semiconductors, Inc.J. Chen, Global Communication Semiconductors, Inc.D. Kumar, Global Communication Semiconductors, Inc.P. Lao, Global Communication Semiconductors, Inc.J. Pepper, Global Communication Semiconductors, Inc.P. Tran, Global Communication Semiconductors, Inc.M. Chen, Global Communication Semiconductors, LLCD. Hou, Global Communication Semiconductors, LLC
-
-
Hsieh, Chen-An
WIN Semiconductors Corp-
The Demonstration of Enhancement/Depletion-Mode pHEMT Technology with Optimized E-mode Characteristics for Better Yield
Jhih-Han Du, WIN Semiconductors CorpFu-Nung Chen, WIN Semiconductors CorpDavid Wu, WIN Semiconductors CorpKang-Lin Peng, WIN Semiconductors CorpChen-An Hsieh, WIN Semiconductors CorpTsung-Jung Yeh, WIN Semiconductors Corp
-
-
Huang, Ying-Yuan
National Taiwan University-
Investigation of Low-Temperature Optical Characteristics of InGaN/GaN Based Nanorod Light Emitting Arrays
Chun-Hsiang Chang, National Taiwan UniversityLiang-Yi Chen, National Taiwan UniversityYing-Yuan Huang, National Taiwan University
-
-
Ivie, Martin
-
The Use of a Structured Approach to Solve Yield Limiting Defects in a Compound Semiconductor Factory
Jan CampbellQizhi HeHowie Yang, TriQuint Semiconductor,TXMartin IvieJohn Gibbon, QorvoDarrel Lupo, TriQuint Semiconductor,TXDario Nappa, TriQuint Semiconductor,TXJerry Beene, TriQuint Semiconductor,TX -
Implementation of Value Added Kaizens (VAK) in a GaAs Manufacturing Facility
Jan CampbellRick Cobo, TriQuint Semiconductor, TXDavid Beene, TriQuint Semiconductor, TXJerry Beene, TriQuint Semiconductor,TXGary HeadMartin IviePavan Bhatia, Brewer Science, TriQuint SemiconductorGreg Baker, TriQuint Semiconductor, TX
-
-
J. Brophy, Martin
Avago Technologies-
A Study of Implant Damage and Isolation Properties in an InGaP HBT Process
Alan Bratschun, Avago TechnologiesMartin J. Brophy, Avago Technologies
-
-
Jackson, M.
UCLA-
Engineered Substrates: Alternative Technologies using Materials Integration
M.S. Goorsky, University of California, Los Angeles, CA USAM. Jackson, UCLAM. Joshi, UCLAC. Ventosa, UCLAX. Kuo, UCLAD. Fong, UCLA
-
-
Jin Kim, Hee
Lumileds LLC-
GaN/InGaN Heterojunction Bipolar Transistors with Collector Current Density > 20 kA/cm2
Yun Zhang, Institute of Semiconductors, Chinese Academy of Sciences, BeijingYi-Che Lee, Georgia Institute of TechnologyZachary Lochner, Georgia Institute of TechnologyHee Jin Kim, Lumileds LLCJae-Hyun Ryou, Georgia Institute of TechnologyRussell D. Dupuis, Georgia Institute of Technology, Atlanta, GA
-
-
Jitty Gu, Chunzhi
Evans Analytical Group-
Rapid Characterization of Vertical Threading Dislocations in GaN Using Dedicated Scanning Transmission Electron Microscopy
Chunzhi Jitty Gu, Evans Analytical GroupMike Salmon, Evans Analytical GroupJim Vitarelli, Evans Analytical Group
-
-
Joshi, M.
UCLA-
Engineered Substrates: Alternative Technologies using Materials Integration
M.S. Goorsky, University of California, Los Angeles, CA USAM. Jackson, UCLAM. Joshi, UCLAC. Ventosa, UCLAX. Kuo, UCLAD. Fong, UCLA
-
-
K. Das, Mrinal
Cree-
Commercially Available Cree Silicon Carbide Power Devices: Historical Success of JBS Diodes and Future Power Switch Prospects
Mrinal K. Das, Cree
-
-
Kao, Chuan-Haur
National Chi Nan University-
Characterizing Reverse-bias Electroluminescence of InGaN/GaN LEDs
Hsiang Chen, National Chi Nan UniversityChuan-Haur Kao, National Chi Nan UniversityTien-Chang Lu, National Chi Nan University
-
-
Kawasaki, H.
Toshiba Corp.-
Effects of Via Layout on AlGaN/GaN HEMTs at Ka-band
K. Matsushita, Toshiba Corp.H. Sakurai, Toshiba Corp.S. Nakanishi, Toshiba Corp.K. Takagi, Toshiba Corp.H. Kawasaki, Toshiba Corp.Y. Takada, Toshiba Corp.M. Hirose, Toshiba Corp.
-
-
Kelly, Dylan
Peregrine Semiconductor-
The Golden Age of Mobile Wireless
Dylan Kelly, Peregrine SemiconductorDuncan Pilgrim, Peregrine Semiconductor
-
-
Ketterson, Andrew
Qorvo Inc.-
Improved T-Gate Yield Using E-Beam Trilayer Resist Process
Huatang Chen, TriQuint Semiconductor, TXAndrew Ketterson, Qorvo Inc.Marcus King, TriQuint Semiconductor, TXKeith Salzman, TriQuint Semiconductor, TXVicki Milam, TriQuint Semiconductor, TXJames Halvorson, TriQuint Semiconductor, TXJan Campbell
-
-
Kiefer, R.
Fraunhofer Institute for Applied Solid State Physics-
From Epitaxy to Backside Process: Reproducible AlGaN/GaN HEMT Technology for Reliable and Rugged Power Devices
W. Bronner, Fraunhofer Institute for Applied Solid State PhysicsP. Waltereit, Fraunhofer InstituteS. Müller, Fraunhofer InstituteM. Dammann, Fraunhofer Institute for Applied Solid State PhysicsR. Kiefer, Fraunhofer Institute for Applied Solid State PhysicsPh. Dennler, Fraunhofer Institute for Applied Solid State PhysicsF. van Raay, Fraunhofer Institute for Applied Solid State PhysicsM. Mußer, Fraunhofer Institute for Applied Solid State PhysicsR. Quay, Fraunhofer Institute for Applied Solid State PhysicsM. Mikulla, Fraunhofer Institute
-
-
King, Marcus
TriQuint Semiconductor, TX-
Improved T-Gate Yield Using E-Beam Trilayer Resist Process
Huatang Chen, TriQuint Semiconductor, TXAndrew Ketterson, Qorvo Inc.Marcus King, TriQuint Semiconductor, TXKeith Salzman, TriQuint Semiconductor, TXVicki Milam, TriQuint Semiconductor, TXJames Halvorson, TriQuint Semiconductor, TXJan Campbell
-
-
Knoedler, Heather
Skyworks Solutions-
Plating Showerhead System for Improved Backside Wafer Plating
Jens Riege, Skyworks Solutions, Inc.Heather Knoedler, Skyworks SolutionsShiban Tiku, Skyworks Solutions, Inc.Nercy Ebrahimi, Skyworks Solution Inc. -
Overall Equipment Efficiency Improvement for GaAs Fab Evaporators
Jesus Teran, Skyworks Solutions, Inc.Daniel WeaverHeather Knoedler, Skyworks SolutionsLam Luu, Skyworks Solutions, Inc.Richard BingleBrian Alvarez, Skyworks Solutions, Inc.Joshua Doria, Skyworks Solutions, Inc.David Holzman, Skyworks Solutions, Inc.Juan Velasquez, Skyworks Solutions -
Collector Contact Optimization in GaAs HBT Manufacturing
Lam Luu-Henderson, Skyworks Solutions Inc.Daniel WeaverHeather Knoedler, Skyworks SolutionsShiban Tiku, Skyworks Solutions, Inc.
-
-
Kumar, D.
Global Communication Semiconductors, Inc.-
Managing Process Diversity for Opto Wafer Fabrication in a Photonics Foundry
S. Wang, Global Communication Semiconductors, Inc.F. Monzon, Global Communication Semiconductors, LLCP. Chen, Global Communication Semiconductors, Inc.J. Chen, Global Communication Semiconductors, Inc.D. Kumar, Global Communication Semiconductors, Inc.P. Lao, Global Communication Semiconductors, Inc.J. Pepper, Global Communication Semiconductors, Inc.P. Tran, Global Communication Semiconductors, Inc.M. Chen, Global Communication Semiconductors, LLCD. Hou, Global Communication Semiconductors, LLC
-
-
Kuo, X.
UCLA-
Engineered Substrates: Alternative Technologies using Materials Integration
M.S. Goorsky, University of California, Los Angeles, CA USAM. Jackson, UCLAM. Joshi, UCLAC. Ventosa, UCLAX. Kuo, UCLAD. Fong, UCLA
-
-
Kurpas, P.
Ferdinand-Braun-Institut-
Investigation and Reduction of Leakage Current Associated with Gate Encapsulation in by SiNx AlGaN/GaN HFETs
S. A. Chevtchenko, Ferdinand-Braun-InstitutP. Kurpas, Ferdinand-Braun-InstitutN. Chaturvedi, Ferdinand-Braun-Institut
-
-
Lao, P.
Global Communication Semiconductors, Inc.-
Managing Process Diversity for Opto Wafer Fabrication in a Photonics Foundry
S. Wang, Global Communication Semiconductors, Inc.F. Monzon, Global Communication Semiconductors, LLCP. Chen, Global Communication Semiconductors, Inc.J. Chen, Global Communication Semiconductors, Inc.D. Kumar, Global Communication Semiconductors, Inc.P. Lao, Global Communication Semiconductors, Inc.J. Pepper, Global Communication Semiconductors, Inc.P. Tran, Global Communication Semiconductors, Inc.M. Chen, Global Communication Semiconductors, LLCD. Hou, Global Communication Semiconductors, LLC
-
-
Lee, Hyung-Seok
MIT-
The Best Material for the Function: Seamless On-Wafer Integration of GaN and Si Devices
Hyung-Seok Lee, MITKevin Ryu, MITJinwook Chung, MIT
-
-
Lee, Shih-Chun
WIN Semiconductors Corp.-
6 Inch 0.1μm GaAs pHEMT Technology for E/V Band Application
His-Tsung Lin, WIN Semiconductors Corp.Chao-Hong Chen, WIN Semiconductors Corp.Shih-Chun Lee, WIN Semiconductors Corp.I-Te Cho, WIN Semiconductors Corp.
-
-
Lee, Yi-Che
Georgia Institute of Technology-
GaN/InGaN Heterojunction Bipolar Transistors with Collector Current Density > 20 kA/cm2
Yun Zhang, Institute of Semiconductors, Chinese Academy of Sciences, BeijingYi-Che Lee, Georgia Institute of TechnologyZachary Lochner, Georgia Institute of TechnologyHee Jin Kim, Lumileds LLCJae-Hyun Ryou, Georgia Institute of TechnologyRussell D. Dupuis, Georgia Institute of Technology, Atlanta, GA
-
-
Letertre, Fabrice
SOITEC-
Advanced Semiconductor on Insulator Substrates for Low Power and High Performance Digital CMOS Applications
Bich-Yen Nguyen, SOITECMariam Sadaka, SOITECNicolas Daval, SOITECWalter Schwarzenbach, SOITECCecile Aulnette, SOITECKonstantin Bourdelle, SOITECFabrice Letertre, SOITECChristophe Maleville, SOITECCarlos Mazure, SOITEC
-
-
Li, F.
Global Communication Semiconductors, LLC-
Process Control Improvements for Critical PECVD SiNx Thin Films
F. Monzon, Global Communication Semiconductors, LLCF. Li, Global Communication Semiconductors, LLCD. Wolfe, Global Communication Semiconductors, LLCT. Dang, Global Communication Semiconductors, LLCM. Chen, Global Communication Semiconductors, LLC
-
-
Li, Szu-Ju
WIN Semiconductors Corp.-
The Study of Heterojunction Bipolar Transistors for High Ruggedness Performance
Szu-Ju Li, WIN Semiconductors Corp.Cheng-Kuo Lin, WIN Semiconductors CorpShu-Hsiao Tsai, WIN Semiconductors CorpBing-San Hong, WIN Semiconductors Corp.Dennis William, WIN Semiconductors Corp.
-
-
Lin, Cheng-Kuo
WIN Semiconductors Corp-
The Study of Heterojunction Bipolar Transistors for High Ruggedness Performance
Szu-Ju Li, WIN Semiconductors Corp.Cheng-Kuo Lin, WIN Semiconductors CorpShu-Hsiao Tsai, WIN Semiconductors CorpBing-San Hong, WIN Semiconductors Corp.Dennis William, WIN Semiconductors Corp.
-
-
Lin, His-Tsung
WIN Semiconductors Corp.-
6 Inch 0.1μm GaAs pHEMT Technology for E/V Band Application
His-Tsung Lin, WIN Semiconductors Corp.Chao-Hong Chen, WIN Semiconductors Corp.Shih-Chun Lee, WIN Semiconductors Corp.I-Te Cho, WIN Semiconductors Corp.
-
-
Loboda, M.J.
Dow Corning Corporation-
Advances in SiC Substrates for Power and Energy Applications
M.J. Loboda, Dow Corning CorporationG. Chung, Dow Corning CorporationE. Carlson, Dow Corning CorporationR. Drachev, Dow Corning CorporationD. Hansen, Dow Corning CorporationE. Sanchez, Dow Corning CorporationJ. Wan, Dow Corning CorporationJ. Zhang, Dow Corning Corporation
-
-
Lochner, Zachary
Georgia Institute of Technology-
GaN/InGaN Heterojunction Bipolar Transistors with Collector Current Density > 20 kA/cm2
Yun Zhang, Institute of Semiconductors, Chinese Academy of Sciences, BeijingYi-Che Lee, Georgia Institute of TechnologyZachary Lochner, Georgia Institute of TechnologyHee Jin Kim, Lumileds LLCJae-Hyun Ryou, Georgia Institute of TechnologyRussell D. Dupuis, Georgia Institute of Technology, Atlanta, GA
-
-
Lowe, Frank
Akash Systems, San Francisco, CA, USA-
Material Studies of GaN on Diamond
Sergey Zaitsev, Group4 Labs, Inc.Frank Lowe, Akash Systems, San Francisco, CA, USADaniel Francis, Akash Systems, San Francisco, CA, USAFirooz Faili, Element Six Technologies, Santa Clara, CA
-
-
Lu, Tien-Chang
National Chi Nan University-
Characterizing Reverse-bias Electroluminescence of InGaN/GaN LEDs
Hsiang Chen, National Chi Nan UniversityChuan-Haur Kao, National Chi Nan UniversityTien-Chang Lu, National Chi Nan University
-
-
Lupo, Darrel
TriQuint Semiconductor,TX-
The Use of a Structured Approach to Solve Yield Limiting Defects in a Compound Semiconductor Factory
Jan CampbellQizhi HeHowie Yang, TriQuint Semiconductor,TXMartin IvieJohn Gibbon, QorvoDarrel Lupo, TriQuint Semiconductor,TXDario Nappa, TriQuint Semiconductor,TXJerry Beene, TriQuint Semiconductor,TX
-
-
Luu, Lam
Skyworks Solutions, Inc.-
Overall Equipment Efficiency Improvement for GaAs Fab Evaporators
Jesus Teran, Skyworks Solutions, Inc.Daniel WeaverHeather Knoedler, Skyworks SolutionsLam Luu, Skyworks Solutions, Inc.Richard BingleBrian Alvarez, Skyworks Solutions, Inc.Joshua Doria, Skyworks Solutions, Inc.David Holzman, Skyworks Solutions, Inc.Juan Velasquez, Skyworks Solutions
-
-
Luu-Henderson, Lam
Skyworks Solutions Inc.-
Collector Contact Optimization in GaAs HBT Manufacturing
Lam Luu-Henderson, Skyworks Solutions Inc.Daniel WeaverHeather Knoedler, Skyworks SolutionsShiban Tiku, Skyworks Solutions, Inc.
-
-
Mackenzie, K.
Plasma-Therm LLC,-
Improving Corrosion Resistance of Plasma Etch Reactors Testing Anodize Coatings and Cleaning Methods
K. Mackenzie, Plasma-Therm LLC,K. Pizzo, Plasma‐ThermE. Scott, Plasma‐Therm
-
-
Maleville, Christophe
SOITEC-
Advanced Semiconductor on Insulator Substrates for Low Power and High Performance Digital CMOS Applications
Bich-Yen Nguyen, SOITECMariam Sadaka, SOITECNicolas Daval, SOITECWalter Schwarzenbach, SOITECCecile Aulnette, SOITECKonstantin Bourdelle, SOITECFabrice Letertre, SOITECChristophe Maleville, SOITECCarlos Mazure, SOITEC
-
-
Matsushita, K.
Toshiba Corp.-
Effects of Via Layout on AlGaN/GaN HEMTs at Ka-band
K. Matsushita, Toshiba Corp.H. Sakurai, Toshiba Corp.S. Nakanishi, Toshiba Corp.K. Takagi, Toshiba Corp.H. Kawasaki, Toshiba Corp.Y. Takada, Toshiba Corp.M. Hirose, Toshiba Corp.
-
-
Mazure, Carlos
SOITEC-
Advanced Semiconductor on Insulator Substrates for Low Power and High Performance Digital CMOS Applications
Bich-Yen Nguyen, SOITECMariam Sadaka, SOITECNicolas Daval, SOITECWalter Schwarzenbach, SOITECCecile Aulnette, SOITECKonstantin Bourdelle, SOITECFabrice Letertre, SOITECChristophe Maleville, SOITECCarlos Mazure, SOITEC
-
-
Meguro, Takeshi
Hitachi Cable-
Role of Buffer Layers of High Power GaAs MESFETs for Higher Output Power
Junichiro Takeda, Hitachi CableYohei Otoki, SCIOCSTadayoshi Tsuchiya, Hitachi CableTakeshi Meguro, Hitachi CableYukio Sasaki, Hitachi Cable
-
-
Menozzi, R.
University of Parma, Italy-
Modeling of the Impact of Boundary Conditions on AlGaN/GaN HEMT Self Heating
M. Bernardoni. N. Delmonte, University of Parma, ItalyR. Menozzi, University of Parma, Italy
-
-
Mikulla, M.
Fraunhofer Institute-
From Epitaxy to Backside Process: Reproducible AlGaN/GaN HEMT Technology for Reliable and Rugged Power Devices
W. Bronner, Fraunhofer Institute for Applied Solid State PhysicsP. Waltereit, Fraunhofer InstituteS. Müller, Fraunhofer InstituteM. Dammann, Fraunhofer Institute for Applied Solid State PhysicsR. Kiefer, Fraunhofer Institute for Applied Solid State PhysicsPh. Dennler, Fraunhofer Institute for Applied Solid State PhysicsF. van Raay, Fraunhofer Institute for Applied Solid State PhysicsM. Mußer, Fraunhofer Institute for Applied Solid State PhysicsR. Quay, Fraunhofer Institute for Applied Solid State PhysicsM. Mikulla, Fraunhofer Institute
-
-
Milam, Vicki
TriQuint Semiconductor, TX-
Improved T-Gate Yield Using E-Beam Trilayer Resist Process
Huatang Chen, TriQuint Semiconductor, TXAndrew Ketterson, Qorvo Inc.Marcus King, TriQuint Semiconductor, TXKeith Salzman, TriQuint Semiconductor, TXVicki Milam, TriQuint Semiconductor, TXJames Halvorson, TriQuint Semiconductor, TXJan Campbell
-
-
Mitsunaga, Masahiro
Sony Semiconductor-
Integration of E-Mode P-Channel JFET into GaAs E/D-Mode JPHEMT Technology for Multi-Band/Mode Antenna Switch Application
Masahiro Mitsunaga, Sony SemiconductorShinichi Tamari, Sony Semiconductor
-
-
Mony, Samuel
Skyworks Solutions, Inc.-
A New Method for Creating Sloped Resist Profiles Using Mask Structures
Jens Riege, Skyworks Solutions, Inc.Samuel Mony, Skyworks Solutions, Inc.Nercy Ebrahimi, Skyworks Solution Inc.
-
-
Monzon, F.
Global Communication Semiconductors, LLC-
Process Control Improvements for Critical PECVD SiNx Thin Films
F. Monzon, Global Communication Semiconductors, LLCF. Li, Global Communication Semiconductors, LLCD. Wolfe, Global Communication Semiconductors, LLCT. Dang, Global Communication Semiconductors, LLCM. Chen, Global Communication Semiconductors, LLC -
Managing Process Diversity for Opto Wafer Fabrication in a Photonics Foundry
S. Wang, Global Communication Semiconductors, Inc.F. Monzon, Global Communication Semiconductors, LLCP. Chen, Global Communication Semiconductors, Inc.J. Chen, Global Communication Semiconductors, Inc.D. Kumar, Global Communication Semiconductors, Inc.P. Lao, Global Communication Semiconductors, Inc.J. Pepper, Global Communication Semiconductors, Inc.P. Tran, Global Communication Semiconductors, Inc.M. Chen, Global Communication Semiconductors, LLCD. Hou, Global Communication Semiconductors, LLC
-
-
Müller, S.
Fraunhofer Institute-
From Epitaxy to Backside Process: Reproducible AlGaN/GaN HEMT Technology for Reliable and Rugged Power Devices
W. Bronner, Fraunhofer Institute for Applied Solid State PhysicsP. Waltereit, Fraunhofer InstituteS. Müller, Fraunhofer InstituteM. Dammann, Fraunhofer Institute for Applied Solid State PhysicsR. Kiefer, Fraunhofer Institute for Applied Solid State PhysicsPh. Dennler, Fraunhofer Institute for Applied Solid State PhysicsF. van Raay, Fraunhofer Institute for Applied Solid State PhysicsM. Mußer, Fraunhofer Institute for Applied Solid State PhysicsR. Quay, Fraunhofer Institute for Applied Solid State PhysicsM. Mikulla, Fraunhofer Institute
-
-
Mußer, M.
Fraunhofer Institute for Applied Solid State Physics-
From Epitaxy to Backside Process: Reproducible AlGaN/GaN HEMT Technology for Reliable and Rugged Power Devices
W. Bronner, Fraunhofer Institute for Applied Solid State PhysicsP. Waltereit, Fraunhofer InstituteS. Müller, Fraunhofer InstituteM. Dammann, Fraunhofer Institute for Applied Solid State PhysicsR. Kiefer, Fraunhofer Institute for Applied Solid State PhysicsPh. Dennler, Fraunhofer Institute for Applied Solid State PhysicsF. van Raay, Fraunhofer Institute for Applied Solid State PhysicsM. Mußer, Fraunhofer Institute for Applied Solid State PhysicsR. Quay, Fraunhofer Institute for Applied Solid State PhysicsM. Mikulla, Fraunhofer Institute
-
-
Nakanishi, S.
Toshiba Corp.-
Effects of Via Layout on AlGaN/GaN HEMTs at Ka-band
K. Matsushita, Toshiba Corp.H. Sakurai, Toshiba Corp.S. Nakanishi, Toshiba Corp.K. Takagi, Toshiba Corp.H. Kawasaki, Toshiba Corp.Y. Takada, Toshiba Corp.M. Hirose, Toshiba Corp.
-
-
Nappa, Dario
TriQuint Semiconductor,TX-
The Use of a Structured Approach to Solve Yield Limiting Defects in a Compound Semiconductor Factory
Jan CampbellQizhi HeHowie Yang, TriQuint Semiconductor,TXMartin IvieJohn Gibbon, QorvoDarrel Lupo, TriQuint Semiconductor,TXDario Nappa, TriQuint Semiconductor,TXJerry Beene, TriQuint Semiconductor,TX
-
-
Nguyen, Bich-Yen
SOITEC-
Advanced Semiconductor on Insulator Substrates for Low Power and High Performance Digital CMOS Applications
Bich-Yen Nguyen, SOITECMariam Sadaka, SOITECNicolas Daval, SOITECWalter Schwarzenbach, SOITECCecile Aulnette, SOITECKonstantin Bourdelle, SOITECFabrice Letertre, SOITECChristophe Maleville, SOITECCarlos Mazure, SOITEC
-
-
Ogier, Simon
PETEC-
Introduction to the PETEC Flexible Electronics Centre and Technology Challenges
Mike Clausen, PETECBela Green, PETECMartin Walkinshaw, PETECSimon Ogier, PETEC
-
-
Ooki, Mitsuhiro
Sony Semiconductor-
The Green Activity of Back Grinding Process
Shinji Tsukino, Sony SemiconductorNorio Sakaguchi, Sony SemiconductorSeiji Tsunematsu, Sony SemiconductorMitsuhiro Ooki, Sony SemiconductorOsamu Sakamoto, Sony Semiconductor
-
-
Otoki, Yohei
SCIOCS-
Role of Buffer Layers of High Power GaAs MESFETs for Higher Output Power
Junichiro Takeda, Hitachi CableYohei Otoki, SCIOCSTadayoshi Tsuchiya, Hitachi CableTakeshi Meguro, Hitachi CableYukio Sasaki, Hitachi Cable
-
-
Pan, Ming
Veeco Instruments-
A Statistical Study of AlGaN/GaN HEMT Uniformity with Various Buffer and Barrier Structures
Xiang Gao, IQE RF LLCDaniel Gorka, IQE RF LLCSongponn Vatanapradit, IQE RF LLCMing Pan, Veeco Instruments
-
-
Peng, Kang-Lin
WIN Semiconductors Corp-
The Demonstration of Enhancement/Depletion-Mode pHEMT Technology with Optimized E-mode Characteristics for Better Yield
Jhih-Han Du, WIN Semiconductors CorpFu-Nung Chen, WIN Semiconductors CorpDavid Wu, WIN Semiconductors CorpKang-Lin Peng, WIN Semiconductors CorpChen-An Hsieh, WIN Semiconductors CorpTsung-Jung Yeh, WIN Semiconductors Corp
-
-
Pengelly, Raymond
Cree Inc.-
Commercial GaN Devices for Switching and Low‐Noise Applications
Raymond Pengelly, Cree Inc.Scott Sheppard, Wolfspeed | A Cree CompanyThomas Smith, Cree Inc.Bill Pribble
-
-
Pepper, J.
Global Communication Semiconductors, Inc.-
Managing Process Diversity for Opto Wafer Fabrication in a Photonics Foundry
S. Wang, Global Communication Semiconductors, Inc.F. Monzon, Global Communication Semiconductors, LLCP. Chen, Global Communication Semiconductors, Inc.J. Chen, Global Communication Semiconductors, Inc.D. Kumar, Global Communication Semiconductors, Inc.P. Lao, Global Communication Semiconductors, Inc.J. Pepper, Global Communication Semiconductors, Inc.P. Tran, Global Communication Semiconductors, Inc.M. Chen, Global Communication Semiconductors, LLCD. Hou, Global Communication Semiconductors, LLC
-
-
Philippe Roussel, Dr.
Yole Développement-
Will GaN-on-Si Displace Si and SiC in Power Electronics?
Dr. Philippe Roussel, Yole Développement
-
-
Pilgrim, Duncan
Peregrine Semiconductor-
The Golden Age of Mobile Wireless
Dylan Kelly, Peregrine SemiconductorDuncan Pilgrim, Peregrine Semiconductor
-
-
Pizzo, K.
Plasma‐Therm-
Improving Corrosion Resistance of Plasma Etch Reactors Testing Anodize Coatings and Cleaning Methods
K. Mackenzie, Plasma-Therm LLC,K. Pizzo, Plasma‐ThermE. Scott, Plasma‐Therm
-
-
Preble, E.A.
Kyma Technologies, Inc.-
Considerations towards a Nitride Semiconductor Substrate Roadmap
E.A. Preble, Kyma Technologies, Inc.H.A. Splawn, Kyma Technologies, Inc.
-
-
Pribble, Bill
-
Commercial GaN Devices for Switching and Low‐Noise Applications
Raymond Pengelly, Cree Inc.Scott Sheppard, Wolfspeed | A Cree CompanyThomas Smith, Cree Inc.Bill Pribble
-
-
Quay, R.
Fraunhofer Institute for Applied Solid State Physics-
From Epitaxy to Backside Process: Reproducible AlGaN/GaN HEMT Technology for Reliable and Rugged Power Devices
W. Bronner, Fraunhofer Institute for Applied Solid State PhysicsP. Waltereit, Fraunhofer InstituteS. Müller, Fraunhofer InstituteM. Dammann, Fraunhofer Institute for Applied Solid State PhysicsR. Kiefer, Fraunhofer Institute for Applied Solid State PhysicsPh. Dennler, Fraunhofer Institute for Applied Solid State PhysicsF. van Raay, Fraunhofer Institute for Applied Solid State PhysicsM. Mußer, Fraunhofer Institute for Applied Solid State PhysicsR. Quay, Fraunhofer Institute for Applied Solid State PhysicsM. Mikulla, Fraunhofer Institute
-
-
R. Hess, Ronald
RFMD-
Optimized PECVD Chamber Clean for Improved Film Deposition Capability
Ronald R. Hess, RFMD
-
-
Riege, Jens
Skyworks Solutions, Inc.-
Plating Showerhead System for Improved Backside Wafer Plating
Jens Riege, Skyworks Solutions, Inc.Heather Knoedler, Skyworks SolutionsShiban Tiku, Skyworks Solutions, Inc.Nercy Ebrahimi, Skyworks Solution Inc. -
A New Method for Creating Sloped Resist Profiles Using Mask Structures
Jens Riege, Skyworks Solutions, Inc.Samuel Mony, Skyworks Solutions, Inc.Nercy Ebrahimi, Skyworks Solution Inc.
-
-
Ryou, Jae-Hyun
Georgia Institute of Technology-
GaN/InGaN Heterojunction Bipolar Transistors with Collector Current Density > 20 kA/cm2
Yun Zhang, Institute of Semiconductors, Chinese Academy of Sciences, BeijingYi-Che Lee, Georgia Institute of TechnologyZachary Lochner, Georgia Institute of TechnologyHee Jin Kim, Lumileds LLCJae-Hyun Ryou, Georgia Institute of TechnologyRussell D. Dupuis, Georgia Institute of Technology, Atlanta, GA
-
-
Ryu, Kevin
MIT-
The Best Material for the Function: Seamless On-Wafer Integration of GaN and Si Devices
Hyung-Seok Lee, MITKevin Ryu, MITJinwook Chung, MIT
-
-
Sadaka, Mariam
SOITEC-
Advanced Semiconductor on Insulator Substrates for Low Power and High Performance Digital CMOS Applications
Bich-Yen Nguyen, SOITECMariam Sadaka, SOITECNicolas Daval, SOITECWalter Schwarzenbach, SOITECCecile Aulnette, SOITECKonstantin Bourdelle, SOITECFabrice Letertre, SOITECChristophe Maleville, SOITECCarlos Mazure, SOITEC
-
-
Sahota, Kamaru
Qualcomm-
RF Front End Component Requirements for Mobile LTE Terminals (Withdrawn)
Kamaru Sahota, Qualcomm
-
-
Sakaguchi, Norio
Sony Semiconductor-
The Green Activity of Back Grinding Process
Shinji Tsukino, Sony SemiconductorNorio Sakaguchi, Sony SemiconductorSeiji Tsunematsu, Sony SemiconductorMitsuhiro Ooki, Sony SemiconductorOsamu Sakamoto, Sony Semiconductor
-
-
Sakamoto, Osamu
Sony Semiconductor-
The Green Activity of Back Grinding Process
Shinji Tsukino, Sony SemiconductorNorio Sakaguchi, Sony SemiconductorSeiji Tsunematsu, Sony SemiconductorMitsuhiro Ooki, Sony SemiconductorOsamu Sakamoto, Sony Semiconductor
-
-
Sakurai, H.
Toshiba Corp.-
Effects of Via Layout on AlGaN/GaN HEMTs at Ka-band
K. Matsushita, Toshiba Corp.H. Sakurai, Toshiba Corp.S. Nakanishi, Toshiba Corp.K. Takagi, Toshiba Corp.H. Kawasaki, Toshiba Corp.Y. Takada, Toshiba Corp.M. Hirose, Toshiba Corp.
-
-
Salemi, Shahrzad
University of Maryland-
Failure Modes and Effects Criticality Analysis (FMECA) of AlGaN/GaN Based Microwave Devices Degradation Mechanisms
Shahrzad Salemi, University of MarylandA. Christou
-
-
Salmon, Mike
Evans Analytical Group-
Rapid Characterization of Vertical Threading Dislocations in GaN Using Dedicated Scanning Transmission Electron Microscopy
Chunzhi Jitty Gu, Evans Analytical GroupMike Salmon, Evans Analytical GroupJim Vitarelli, Evans Analytical Group
-
-
Salzman, Keith
TriQuint Semiconductor, TX-
Improved T-Gate Yield Using E-Beam Trilayer Resist Process
Huatang Chen, TriQuint Semiconductor, TXAndrew Ketterson, Qorvo Inc.Marcus King, TriQuint Semiconductor, TXKeith Salzman, TriQuint Semiconductor, TXVicki Milam, TriQuint Semiconductor, TXJames Halvorson, TriQuint Semiconductor, TXJan Campbell
-
-
Sanchez, E.
Dow Corning Corporation-
Advances in SiC Substrates for Power and Energy Applications
M.J. Loboda, Dow Corning CorporationG. Chung, Dow Corning CorporationE. Carlson, Dow Corning CorporationR. Drachev, Dow Corning CorporationD. Hansen, Dow Corning CorporationE. Sanchez, Dow Corning CorporationJ. Wan, Dow Corning CorporationJ. Zhang, Dow Corning Corporation
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Sasaki, Yukio
Hitachi Cable-
Role of Buffer Layers of High Power GaAs MESFETs for Higher Output Power
Junichiro Takeda, Hitachi CableYohei Otoki, SCIOCSTadayoshi Tsuchiya, Hitachi CableTakeshi Meguro, Hitachi CableYukio Sasaki, Hitachi Cable
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Schwarzenbach, Walter
SOITEC-
Advanced Semiconductor on Insulator Substrates for Low Power and High Performance Digital CMOS Applications
Bich-Yen Nguyen, SOITECMariam Sadaka, SOITECNicolas Daval, SOITECWalter Schwarzenbach, SOITECCecile Aulnette, SOITECKonstantin Bourdelle, SOITECFabrice Letertre, SOITECChristophe Maleville, SOITECCarlos Mazure, SOITEC
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Scott, E.
Plasma‐Therm-
Improving Corrosion Resistance of Plasma Etch Reactors Testing Anodize Coatings and Cleaning Methods
K. Mackenzie, Plasma-Therm LLC,K. Pizzo, Plasma‐ThermE. Scott, Plasma‐Therm
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Shen, Hong
-
Plasma Etch Induced Surface Damage and its Impacts on GaAs Schottky Diodes
Hong ShenPeter Dai, Skyworks Solution, Inc.
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Sheppard, Scott
Wolfspeed | A Cree Company-
Commercial GaN Devices for Switching and Low‐Noise Applications
Raymond Pengelly, Cree Inc.Scott Sheppard, Wolfspeed | A Cree CompanyThomas Smith, Cree Inc.Bill Pribble
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Shevenock, Steve
Avago Technologies-
Shuffle Up and Deal: the Use of Wafer Randomization as a Yield and Process Analysis Tool
Albert Wang, Avago TechnologiesMark Urfer, Avago TechnologiesSteve Shevenock, Avago Technologies
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Smith, Thomas
Cree Inc.-
Commercial GaN Devices for Switching and Low‐Noise Applications
Raymond Pengelly, Cree Inc.Scott Sheppard, Wolfspeed | A Cree CompanyThomas Smith, Cree Inc.Bill Pribble
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Speck, James
UCSB-
Optoelectronic Devices Grown on Nonpolar and Semipolar Free-Standing GaN Substrates
Daniel Feezell, Center for High Technology Materials, Department of Electrical Engineering, University of New MexicoJames Speck, UCSBSteven DenBaars, UCSB
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Splawn, H.A.
Kyma Technologies, Inc.-
Considerations towards a Nitride Semiconductor Substrate Roadmap
E.A. Preble, Kyma Technologies, Inc.H.A. Splawn, Kyma Technologies, Inc.
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Takada, Y.
Toshiba Corp.-
Effects of Via Layout on AlGaN/GaN HEMTs at Ka-band
K. Matsushita, Toshiba Corp.H. Sakurai, Toshiba Corp.S. Nakanishi, Toshiba Corp.K. Takagi, Toshiba Corp.H. Kawasaki, Toshiba Corp.Y. Takada, Toshiba Corp.M. Hirose, Toshiba Corp.
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Takagi, K.
Toshiba Corp.-
Effects of Via Layout on AlGaN/GaN HEMTs at Ka-band
K. Matsushita, Toshiba Corp.H. Sakurai, Toshiba Corp.S. Nakanishi, Toshiba Corp.K. Takagi, Toshiba Corp.H. Kawasaki, Toshiba Corp.Y. Takada, Toshiba Corp.M. Hirose, Toshiba Corp.
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Takagi, Kazutaka
Toshiba Corp.-
A Difference of Thermal Design between GaN and GaAs
Takuji Yamamura, Toshiba CorporationKazutaka Takagi, Toshiba Corp.
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Takeda, Junichiro
Hitachi Cable-
Role of Buffer Layers of High Power GaAs MESFETs for Higher Output Power
Junichiro Takeda, Hitachi CableYohei Otoki, SCIOCSTadayoshi Tsuchiya, Hitachi CableTakeshi Meguro, Hitachi CableYukio Sasaki, Hitachi Cable
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Tamari, Shinichi
Sony Semiconductor-
Integration of E-Mode P-Channel JFET into GaAs E/D-Mode JPHEMT Technology for Multi-Band/Mode Antenna Switch Application
Masahiro Mitsunaga, Sony SemiconductorShinichi Tamari, Sony Semiconductor
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Teran, Jesus
Skyworks Solutions, Inc.-
Overall Equipment Efficiency Improvement for GaAs Fab Evaporators
Jesus Teran, Skyworks Solutions, Inc.Daniel WeaverHeather Knoedler, Skyworks SolutionsLam Luu, Skyworks Solutions, Inc.Richard BingleBrian Alvarez, Skyworks Solutions, Inc.Joshua Doria, Skyworks Solutions, Inc.David Holzman, Skyworks Solutions, Inc.Juan Velasquez, Skyworks Solutions
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Tiku, Shiban
Skyworks Solutions, Inc.-
Plating Showerhead System for Improved Backside Wafer Plating
Jens Riege, Skyworks Solutions, Inc.Heather Knoedler, Skyworks SolutionsShiban Tiku, Skyworks Solutions, Inc.Nercy Ebrahimi, Skyworks Solution Inc. -
Collector Contact Optimization in GaAs HBT Manufacturing
Lam Luu-Henderson, Skyworks Solutions Inc.Daniel WeaverHeather Knoedler, Skyworks SolutionsShiban Tiku, Skyworks Solutions, Inc.
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Tran, P.
Global Communication Semiconductors, Inc.-
Managing Process Diversity for Opto Wafer Fabrication in a Photonics Foundry
S. Wang, Global Communication Semiconductors, Inc.F. Monzon, Global Communication Semiconductors, LLCP. Chen, Global Communication Semiconductors, Inc.J. Chen, Global Communication Semiconductors, Inc.D. Kumar, Global Communication Semiconductors, Inc.P. Lao, Global Communication Semiconductors, Inc.J. Pepper, Global Communication Semiconductors, Inc.P. Tran, Global Communication Semiconductors, Inc.M. Chen, Global Communication Semiconductors, LLCD. Hou, Global Communication Semiconductors, LLC
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Tsai, Shu-Hsiao
WIN Semiconductors Corp-
The Study of Heterojunction Bipolar Transistors for High Ruggedness Performance
Szu-Ju Li, WIN Semiconductors Corp.Cheng-Kuo Lin, WIN Semiconductors CorpShu-Hsiao Tsai, WIN Semiconductors CorpBing-San Hong, WIN Semiconductors Corp.Dennis William, WIN Semiconductors Corp.
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Tsuchiya, Tadayoshi
Hitachi Cable-
Role of Buffer Layers of High Power GaAs MESFETs for Higher Output Power
Junichiro Takeda, Hitachi CableYohei Otoki, SCIOCSTadayoshi Tsuchiya, Hitachi CableTakeshi Meguro, Hitachi CableYukio Sasaki, Hitachi Cable
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Tsukino, Shinji
Sony Semiconductor-
The Green Activity of Back Grinding Process
Shinji Tsukino, Sony SemiconductorNorio Sakaguchi, Sony SemiconductorSeiji Tsunematsu, Sony SemiconductorMitsuhiro Ooki, Sony SemiconductorOsamu Sakamoto, Sony Semiconductor
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Tsunematsu, Seiji
Sony Semiconductor-
The Green Activity of Back Grinding Process
Shinji Tsukino, Sony SemiconductorNorio Sakaguchi, Sony SemiconductorSeiji Tsunematsu, Sony SemiconductorMitsuhiro Ooki, Sony SemiconductorOsamu Sakamoto, Sony Semiconductor
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Urfer, Mark
Avago Technologies-
Shuffle Up and Deal: the Use of Wafer Randomization as a Yield and Process Analysis Tool
Albert Wang, Avago TechnologiesMark Urfer, Avago TechnologiesSteve Shevenock, Avago Technologies
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van Raay, F.
Fraunhofer Institute for Applied Solid State Physics-
From Epitaxy to Backside Process: Reproducible AlGaN/GaN HEMT Technology for Reliable and Rugged Power Devices
W. Bronner, Fraunhofer Institute for Applied Solid State PhysicsP. Waltereit, Fraunhofer InstituteS. Müller, Fraunhofer InstituteM. Dammann, Fraunhofer Institute for Applied Solid State PhysicsR. Kiefer, Fraunhofer Institute for Applied Solid State PhysicsPh. Dennler, Fraunhofer Institute for Applied Solid State PhysicsF. van Raay, Fraunhofer Institute for Applied Solid State PhysicsM. Mußer, Fraunhofer Institute for Applied Solid State PhysicsR. Quay, Fraunhofer Institute for Applied Solid State PhysicsM. Mikulla, Fraunhofer Institute
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Vatanapradit, Songponn
IQE RF LLC-
A Statistical Study of AlGaN/GaN HEMT Uniformity with Various Buffer and Barrier Structures
Xiang Gao, IQE RF LLCDaniel Gorka, IQE RF LLCSongponn Vatanapradit, IQE RF LLCMing Pan, Veeco Instruments
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Velasquez, Juan
Skyworks Solutions-
Overall Equipment Efficiency Improvement for GaAs Fab Evaporators
Jesus Teran, Skyworks Solutions, Inc.Daniel WeaverHeather Knoedler, Skyworks SolutionsLam Luu, Skyworks Solutions, Inc.Richard BingleBrian Alvarez, Skyworks Solutions, Inc.Joshua Doria, Skyworks Solutions, Inc.David Holzman, Skyworks Solutions, Inc.Juan Velasquez, Skyworks Solutions
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Ventosa, C.
UCLA-
Engineered Substrates: Alternative Technologies using Materials Integration
M.S. Goorsky, University of California, Los Angeles, CA USAM. Jackson, UCLAM. Joshi, UCLAC. Ventosa, UCLAX. Kuo, UCLAD. Fong, UCLA
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Vitarelli, Jim
Evans Analytical Group-
Rapid Characterization of Vertical Threading Dislocations in GaN Using Dedicated Scanning Transmission Electron Microscopy
Chunzhi Jitty Gu, Evans Analytical GroupMike Salmon, Evans Analytical GroupJim Vitarelli, Evans Analytical Group
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Walkinshaw, Martin
PETEC-
Introduction to the PETEC Flexible Electronics Centre and Technology Challenges
Mike Clausen, PETECBela Green, PETECMartin Walkinshaw, PETECSimon Ogier, PETEC
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Waltereit, P.
Fraunhofer Institute-
From Epitaxy to Backside Process: Reproducible AlGaN/GaN HEMT Technology for Reliable and Rugged Power Devices
W. Bronner, Fraunhofer Institute for Applied Solid State PhysicsP. Waltereit, Fraunhofer InstituteS. Müller, Fraunhofer InstituteM. Dammann, Fraunhofer Institute for Applied Solid State PhysicsR. Kiefer, Fraunhofer Institute for Applied Solid State PhysicsPh. Dennler, Fraunhofer Institute for Applied Solid State PhysicsF. van Raay, Fraunhofer Institute for Applied Solid State PhysicsM. Mußer, Fraunhofer Institute for Applied Solid State PhysicsR. Quay, Fraunhofer Institute for Applied Solid State PhysicsM. Mikulla, Fraunhofer Institute
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Wan, J.
Dow Corning Corporation-
Advances in SiC Substrates for Power and Energy Applications
M.J. Loboda, Dow Corning CorporationG. Chung, Dow Corning CorporationE. Carlson, Dow Corning CorporationR. Drachev, Dow Corning CorporationD. Hansen, Dow Corning CorporationE. Sanchez, Dow Corning CorporationJ. Wan, Dow Corning CorporationJ. Zhang, Dow Corning Corporation
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Wang, Albert
Avago Technologies-
Shuffle Up and Deal: the Use of Wafer Randomization as a Yield and Process Analysis Tool
Albert Wang, Avago TechnologiesMark Urfer, Avago TechnologiesSteve Shevenock, Avago Technologies
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Wang, S.
Global Communication Semiconductors, Inc.-
Managing Process Diversity for Opto Wafer Fabrication in a Photonics Foundry
S. Wang, Global Communication Semiconductors, Inc.F. Monzon, Global Communication Semiconductors, LLCP. Chen, Global Communication Semiconductors, Inc.J. Chen, Global Communication Semiconductors, Inc.D. Kumar, Global Communication Semiconductors, Inc.P. Lao, Global Communication Semiconductors, Inc.J. Pepper, Global Communication Semiconductors, Inc.P. Tran, Global Communication Semiconductors, Inc.M. Chen, Global Communication Semiconductors, LLCD. Hou, Global Communication Semiconductors, LLC
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Weaver, Daniel
-
Overall Equipment Efficiency Improvement for GaAs Fab Evaporators
Jesus Teran, Skyworks Solutions, Inc.Daniel WeaverHeather Knoedler, Skyworks SolutionsLam Luu, Skyworks Solutions, Inc.Richard BingleBrian Alvarez, Skyworks Solutions, Inc.Joshua Doria, Skyworks Solutions, Inc.David Holzman, Skyworks Solutions, Inc.Juan Velasquez, Skyworks Solutions -
Collector Contact Optimization in GaAs HBT Manufacturing
Lam Luu-Henderson, Skyworks Solutions Inc.Daniel WeaverHeather Knoedler, Skyworks SolutionsShiban Tiku, Skyworks Solutions, Inc.
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Weimar, Andreas
Osram-
High Brightness LEDs: Manufacturing and Applications
Andreas Weimar, Osram
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William, Dennis
WIN Semiconductors Corp.-
The Study of Heterojunction Bipolar Transistors for High Ruggedness Performance
Szu-Ju Li, WIN Semiconductors Corp.Cheng-Kuo Lin, WIN Semiconductors CorpShu-Hsiao Tsai, WIN Semiconductors CorpBing-San Hong, WIN Semiconductors Corp.Dennis William, WIN Semiconductors Corp.
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Wolfe, D.
Global Communication Semiconductors, LLC-
Process Control Improvements for Critical PECVD SiNx Thin Films
F. Monzon, Global Communication Semiconductors, LLCF. Li, Global Communication Semiconductors, LLCD. Wolfe, Global Communication Semiconductors, LLCT. Dang, Global Communication Semiconductors, LLCM. Chen, Global Communication Semiconductors, LLC
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Wu, David
WIN Semiconductors Corp-
The Demonstration of Enhancement/Depletion-Mode pHEMT Technology with Optimized E-mode Characteristics for Better Yield
Jhih-Han Du, WIN Semiconductors CorpFu-Nung Chen, WIN Semiconductors CorpDavid Wu, WIN Semiconductors CorpKang-Lin Peng, WIN Semiconductors CorpChen-An Hsieh, WIN Semiconductors CorpTsung-Jung Yeh, WIN Semiconductors Corp
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Yamamura, Takuji
Toshiba Corporation-
A Difference of Thermal Design between GaN and GaAs
Takuji Yamamura, Toshiba CorporationKazutaka Takagi, Toshiba Corp.
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Yang, Howie
TriQuint Semiconductor,TX-
The Use of a Structured Approach to Solve Yield Limiting Defects in a Compound Semiconductor Factory
Jan CampbellQizhi HeHowie Yang, TriQuint Semiconductor,TXMartin IvieJohn Gibbon, QorvoDarrel Lupo, TriQuint Semiconductor,TXDario Nappa, TriQuint Semiconductor,TXJerry Beene, TriQuint Semiconductor,TX
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Yeh, Tsung-Jung
WIN Semiconductors Corp-
The Demonstration of Enhancement/Depletion-Mode pHEMT Technology with Optimized E-mode Characteristics for Better Yield
Jhih-Han Du, WIN Semiconductors CorpFu-Nung Chen, WIN Semiconductors CorpDavid Wu, WIN Semiconductors CorpKang-Lin Peng, WIN Semiconductors CorpChen-An Hsieh, WIN Semiconductors CorpTsung-Jung Yeh, WIN Semiconductors Corp
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Young, Morris
AXT, Inc-
China’s Fast Growing Role in the Future of Compound Semiconductor Technology and Manufacturing
Morris Young, AXT, Inc
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Zaitsev, Sergey
Group4 Labs, Inc.-
Material Studies of GaN on Diamond
Sergey Zaitsev, Group4 Labs, Inc.Frank Lowe, Akash Systems, San Francisco, CA, USADaniel Francis, Akash Systems, San Francisco, CA, USAFirooz Faili, Element Six Technologies, Santa Clara, CA
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Zhang, J.
Dow Corning Corporation-
Advances in SiC Substrates for Power and Energy Applications
M.J. Loboda, Dow Corning CorporationG. Chung, Dow Corning CorporationE. Carlson, Dow Corning CorporationR. Drachev, Dow Corning CorporationD. Hansen, Dow Corning CorporationE. Sanchez, Dow Corning CorporationJ. Wan, Dow Corning CorporationJ. Zhang, Dow Corning Corporation
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Zhang, Yun
Institute of Semiconductors, Chinese Academy of Sciences, Beijing-
GaN/InGaN Heterojunction Bipolar Transistors with Collector Current Density > 20 kA/cm2
Yun Zhang, Institute of Semiconductors, Chinese Academy of Sciences, BeijingYi-Che Lee, Georgia Institute of TechnologyZachary Lochner, Georgia Institute of TechnologyHee Jin Kim, Lumileds LLCJae-Hyun Ryou, Georgia Institute of TechnologyRussell D. Dupuis, Georgia Institute of Technology, Atlanta, GA
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Zhou, Amy
TriQuint Semiconductor, TX-
Optimization and Characterization of a Photo Definable BCB for HV3S and HVHBT Technologies
Jerry Brown, TriQuint Semiconductor, TXAmy Zhou, TriQuint Semiconductor, TX
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