-
Suda, J.
Institute of Materials and Systems for Sustainability, Nagoya University-
11.5.2023 GaN substrate cut-out process and GaN on GaN device thinning process with laser slicing
A. Tanaka, Institute of Materials and Systems for Sustainability, Nagoya UniversityK. Matsushima, Institute of Materials and Systems for Sustainability, Nagoya UniversityT. Aratani, Hamamatsu Photonics K.KK. Hara, Hamamatsu Photonics K.KD. Kawaguchi, Hamamatsu Photonics K.KH. Watanabe, Institute of Materials and Systems for Sustainability, Nagoya UniversityT. Kanemura, Institute of Materials and Systems for Sustainability, Nagoya UniversityY. Nagasato, MIRISE Technologies CorporationM. Nagaya, MIRISE Technologies CorporationYoshio Honda, Institute of Materials and Systems for Sustainability, Nagoya UniversityA. Wakejima, Nagoya Institute of TechnologyY. Ando, Institute of Materials and Systems for Sustainability, Nagoya UniversityS. Onda, Institute of Materials and Systems for Sustainability, Nagoya UniversityJ. Suda, Institute of Materials and Systems for Sustainability, Nagoya University
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A. Mastro, Michael
U.S. Naval Research Laboratory-
10.5.2023 Accuracy of Machine Learning Models on Predicting the Properties of Vertical GaN Diodes
James Gallagher, U.S. Naval Research LaboratoryMichael A. Mastro, U.S. Naval Research LaboratoryMona Ebrish, Vanderbilt University, Nashville, TNAlan Jacobs, U.S. Naval Research LaboratoryBrendan. P. Gunning, Sandia National Labs, Albuquerque, NMRobert Kaplar, Sandia National Labs, Albuquerque, NM
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Abdallah, Zeina
University of Bristol-
12.3.2023 Characterization of a Novel Thermal Interface Material based on Nanoparticles for High Power Device Package Assembly
Zeina Abdallah, University of BristolJames Pomeroy, University of BristolNicolas Blasakis, Adamant Composite Ltd.Athanasios Baltopoulos, Adamant Composite Ltd.Antonios Vavouliotis, Adamant Composite Ltd.Martin Kuball, University of Bristol
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Adachi, F.
Sumiden Semiconductor Materials Co., Ltd.,-
17.2.2023 Development of Laser Diode Grade Si-doped 8-inch GaAs Substrates
K. Shibata, Sumiden Semiconductor Materials Co., Ltd.,K. Aoyama, Sumiden Semiconductor Materials Co., Ltd.,M Nishioka, Sumiden Semiconductor Materials Co., Ltd.,K. Hashio, Sumiden Semiconductor Materials Co., Ltd.,F. Adachi, Sumiden Semiconductor Materials Co., Ltd.,S. Fujita, Sumiden Semiconductor Materials Co., Ltd., Sumitomo Electric Industries, LtdYoshiaki Hagi, Sumiden Semiconductor Materials Co., Ltd., Sumitomo Electric Industries, Ltd, ItamiTomonori Morishita, Sumiden Semiconductor Materials Co., Ltd., Sumitomo Electric Industries, Ltd
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Afroz, Shamima
Northrop Grumman -
Ahmed, Khaled
Intel Corporation -
Ahn, Dal
Soonchunhyang University, Korea-
4.3.2023 GaN based 2-stage Wide Band Doherty PA for 3.4-3.8 GHz Using Hybrid Integration with IPDs on HPSI SiC Substrate
Sangmin Lee, Wavice Inc.: Now with Global Communication Semiconductors LLC, Torrance, CAJinman Jin, Wavice Inc.Inseop Kim, Wavice Inc.,Hyeyoung Jung, Wavice Inc.,Seo Koo, Soonchunhyang University, KoreaDal Ahn, Soonchunhyang University, Korea
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Akhavan, Vahid
PulseForge Corp.-
3.3.2023 Photonic Debonding for Wafer-Level Packaging
Vikram Turkani, PulseForge Corp.Vahid Akhavan, PulseForge Corp.Kurt Schroder, PulseForge Corp.Luke Prenger, Brewer Science, Inc.Xavier Martinez, Brewer Science, Inc.
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Aktas, O.
Sandia National Labs, Albuquerque, NM-
9.4.2023 Scalable Manufacturing of Planar, Large-Area 1.2kV and 3.3kV Vertical GaN PiN Diodes
Alan Jacobs, U.S. Naval Research LaboratoryMona Ebrish, NRC Postdoc Fellow Residing at the U.S. Naval Research LaboratoryJames Gallagher, U.S. Naval Research LaboratoryMarko J. Tadjer, U.S. Naval Research LaboratoryJames Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLJennifer K. Hite, Naval Research LaboratoryN. Mahadik, U.S. Naval Research LaboratoryRobert Kaplar, Sandia National Labs, Albuquerque, NMO. Aktas, Sandia National Labs, Albuquerque, NM
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Alema, Fikadu
Agnitron Technology Incorporated, Chanhassen, MN 55317, USA-
7.2.2023 Fabrication and Analysis of β-Ga2O3 Schottky Diodes with Drift Layer Grown by MOCVD on (001) Substrate
Prakash P. Sundaram, University of Minnesota, Minneapolis, MN 55455, USAFengdeng Liu, University of Minnesota, Minneapolis, MN 55455, USAFikadu Alema, Agnitron Technology Incorporated, Chanhassen, MN 55317, USAAndrei Osinsky, Agnitron Technology Incorporated, Chanhassen, MN 55317, USABharat Jalan, University of Minnesota, Minneapolis, MN 55455, USASteven J. Koester, University of Minnesota, Minneapolis, MN 55455, USA -
18.7.2023 Manufacturable processes and performance characteristics of few-layer hexagonal boron nitride-based templates on sapphire
Tim Vogt, Agnitron Technology, IncVitali Soukhoveev, Agnitron Technology Incorporated, Chanhassen, MN 55317, USAFikadu Alema, Agnitron Technology Incorporated, Chanhassen, MN 55317, USAAndrei Osinsky, Agnitron Technology Incorporated, Chanhassen, MN 55317, USA
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Allford, Craig
Cardiff University-
14.2.2023 Assessment of 1.3-?m InAs QD Edge-Emitting Lasers Grown on Large Area GaAs Substrates
Sara Gillgrass, Cardiff UniversityCraig Allford, Cardiff UniversityMukul Debnath, IQE plcAndrew Clark, IQE, Cardiff, UKPeter M. Smowton, Cardiff University, IQE plc -
18.4.2023 Characterisation Techniques for On-Wafer Testing of VCSELs in Volume Manufacture
Jack Baker, Cardiff UniversityC. Hentschel, Cardiff UniversityCraig Allford, Cardiff UniversitySara Gillgrass, Cardiff UniversityJ. Iwan Davies, IQE plcSamuel Shutts, Cardiff University. IQE plcPeter M. Smowton, Cardiff University, IQE plc
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Almeida, Carlos
Semilab SDI -
Amann, M.
United Monolithic Semiconductors – GmbH -
Anderson, Travis J.
U.S. Naval Research Laboratory-
8.3.2023 Heterogeneous Integration of Gallium Nitride HEMTs with Single Crystal Diamond Substrates via Micro-transfer Printing for Thermal Management
James Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLAndy Xie, QorvoShawn Mack, U.S. Naval Research LaboratoryD. Scott Katzer, U.S. Naval Research LaboratoryMarko J. Tadjer, U.S. Naval Research LaboratoryTravis J. Anderson, U.S. Naval Research LaboratoryBrian Downey, US Naval Research LaboratoryDavid J Meyer, U.S. Naval Research Laboratory, Washington, DC -
9.4.2023 Scalable Manufacturing of Planar, Large-Area 1.2kV and 3.3kV Vertical GaN PiN Diodes
Alan Jacobs, U.S. Naval Research LaboratoryMona Ebrish, NRC Postdoc Fellow Residing at the U.S. Naval Research LaboratoryJames Gallagher, U.S. Naval Research LaboratoryMarko J. Tadjer, U.S. Naval Research LaboratoryJames Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLJennifer K. Hite, Naval Research LaboratoryN. Mahadik, U.S. Naval Research LaboratoryRobert Kaplar, Sandia National Labs, Albuquerque, NMO. Aktas, Sandia National Labs, Albuquerque, NM -
10.5.2023 Accuracy of Machine Learning Models on Predicting the Properties of Vertical GaN Diodes
James Gallagher, U.S. Naval Research LaboratoryMichael A. Mastro, U.S. Naval Research LaboratoryMona Ebrish, Vanderbilt University, Nashville, TNAlan Jacobs, U.S. Naval Research LaboratoryBrendan. P. Gunning, Sandia National Labs, Albuquerque, NMRobert Kaplar, Sandia National Labs, Albuquerque, NM -
11.3.2023 Structural and Electrical Characterization of Schottky Barrier Diodes on 100 mm HVPE β-Ga2O3 Epiwafer Technology
Marko J. Tadjer, U.S. Naval Research LaboratoryJames Gallagher, ASEE Postdoctoral Fellow Residing at NRLN. Mahadik, U.S. Naval Research LaboratoryHannah N. Masten, National Research Council Postdoctoral Fellow, Residing at NRLJames Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLAkito Kuramata, Novel Crystal Technology, Inc -
11.4.2023 Nanocrystalline Diamond-Capped β-(AlxGa1-x)2O3/Ga2O3 Heterostructure FieldEffect Transistor
Hannah N. Masten, National Research Council Postdoctoral Fellow, Residing at NRLJames Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLTatyana Feygelson, U. S. Naval Research LaboratoryJoseph Spencer, U.S. Naval Research LaboratoryTatyana I. Feygelson, American Society for Engineering Education, United States Naval Research Lab. Universidad Politecnica de MadridJennifer K. Hite, Naval Research LaboratoryDaniel Pennachio, U.S. Naval Research Laboratory, Washington DCAlan Jacobs, U.S. Naval Research LaboratoryBoris Feygelson, U.S. Naval Research LaboratoryKohei Sasaki, Novel Crystal TechnologyAkito Kuramata, Novel Crystal Technology, IncPai-Ying Liao, Purdue UniversityPeide D. Ye, Purdue UniversityBradford Pate, Naval Research LaboratoryTravis J. Anderson, U.S. Naval Research LaboratoryMarko J. Tadjer, U.S. Naval Research Laboratory -
15.5.2023 Scalable Selective Area Doping for Manufacturing of Planar Vertical Power GaN Devices
Alan Jacobs, U.S. Naval Research LaboratoryBoris N. Feigelson, Naval Research LaboratoryJennifer Hite, U.S. Naval Research LaboratoryJoseph Spencer, U.S. Naval Research LaboratoryMarko Tadjer, U.S. Naval Research LaboratoryDaniel G. Georgiev, University of Toledo, Toledo OHRaghav Khanna, University of Toledo, Toledo OHMarko J. Tadjer, U.S. Naval Research LaboratoryTravis J. Anderson, U.S. Naval Research Laboratory
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Ando, Y.
Institute of Materials and Systems for Sustainability, Nagoya University-
11.5.2023 GaN substrate cut-out process and GaN on GaN device thinning process with laser slicing
A. Tanaka, Institute of Materials and Systems for Sustainability, Nagoya UniversityK. Matsushima, Institute of Materials and Systems for Sustainability, Nagoya UniversityT. Aratani, Hamamatsu Photonics K.KK. Hara, Hamamatsu Photonics K.KD. Kawaguchi, Hamamatsu Photonics K.KH. Watanabe, Institute of Materials and Systems for Sustainability, Nagoya UniversityT. Kanemura, Institute of Materials and Systems for Sustainability, Nagoya UniversityY. Nagasato, MIRISE Technologies CorporationM. Nagaya, MIRISE Technologies CorporationYoshio Honda, Institute of Materials and Systems for Sustainability, Nagoya UniversityA. Wakejima, Nagoya Institute of TechnologyY. Ando, Institute of Materials and Systems for Sustainability, Nagoya UniversityS. Onda, Institute of Materials and Systems for Sustainability, Nagoya UniversityJ. Suda, Institute of Materials and Systems for Sustainability, Nagoya University
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Aoyama, K.
Sumiden Semiconductor Materials Co., Ltd.,-
17.2.2023 Development of Laser Diode Grade Si-doped 8-inch GaAs Substrates
K. Shibata, Sumiden Semiconductor Materials Co., Ltd.,K. Aoyama, Sumiden Semiconductor Materials Co., Ltd.,M Nishioka, Sumiden Semiconductor Materials Co., Ltd.,K. Hashio, Sumiden Semiconductor Materials Co., Ltd.,F. Adachi, Sumiden Semiconductor Materials Co., Ltd.,S. Fujita, Sumiden Semiconductor Materials Co., Ltd., Sumitomo Electric Industries, LtdYoshiaki Hagi, Sumiden Semiconductor Materials Co., Ltd., Sumitomo Electric Industries, Ltd, ItamiTomonori Morishita, Sumiden Semiconductor Materials Co., Ltd., Sumitomo Electric Industries, Ltd
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Aratani, T.
Hamamatsu Photonics K.K-
11.5.2023 GaN substrate cut-out process and GaN on GaN device thinning process with laser slicing
A. Tanaka, Institute of Materials and Systems for Sustainability, Nagoya UniversityK. Matsushima, Institute of Materials and Systems for Sustainability, Nagoya UniversityT. Aratani, Hamamatsu Photonics K.KK. Hara, Hamamatsu Photonics K.KD. Kawaguchi, Hamamatsu Photonics K.KH. Watanabe, Institute of Materials and Systems for Sustainability, Nagoya UniversityT. Kanemura, Institute of Materials and Systems for Sustainability, Nagoya UniversityY. Nagasato, MIRISE Technologies CorporationM. Nagaya, MIRISE Technologies CorporationYoshio Honda, Institute of Materials and Systems for Sustainability, Nagoya UniversityA. Wakejima, Nagoya Institute of TechnologyY. Ando, Institute of Materials and Systems for Sustainability, Nagoya UniversityS. Onda, Institute of Materials and Systems for Sustainability, Nagoya UniversityJ. Suda, Institute of Materials and Systems for Sustainability, Nagoya University
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Arias, Andrea
Teledyne Scientific Company-
4.2.2023 Design and Fabrication of Millimeter-Wave GaN HEMTs
Keisuke Shinohara, Teledyne Scientific CompanyDean Regan, Teledyne Scientific CompanyCasey King, Teledyne Scientific CompanyEric Regan, Teledyne Scientific CompanyPetra Rowell, Teledyne Scientific CompanyAndrea Arias, Teledyne Scientific CompanyAndrew Carter, Teledyne Scientific CompanyJoshua Bergman, Teledyne Scientific CompanyMiguel Urteaga, Teledyne Scientific CompanyBerinder Brar, Teledyne Scientific Company
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Armitage, Rob
Lumileds LLC-
16.1.2023 Technical and Manufacturing Challenges in MicroLED Processes
Hee Jin Kim, Lumileds LLCRob Armitage, Lumileds LLCJoseph Flemish, Lumileds LLCZhongmin Ren, Lumileds LLCMark Holmes, Lumileds LLC -
16.3.2023 Design and Performance of P-side down Green Tunnel-Junction LEDs
Sheikh Ifatur Rahman, The Ohio State University, Columbus, OhioRob Armitage, Lumileds LLCSiddharth Rajan, Ohio State University
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Arnaud, A.
STMicroelectronics-
14.1.2023 Colloidal Quantum Dot Image Sensor Technology
Jonathan Steckel, ST MicroelectronicsJ. Arnaud, STMicroelectronicsA. G. Pattantyus-Abraham, STMicroelectronicsA, Singh, STMicroelectronicsE. Josse, STMicroelectronicsM. Bidaud, STMicroelectronicsJ. Meitzner, STMicroelectronicsM. Sarmiento, STMicroelectronicsA. Arnaud, STMicroelectronicsE. Mazeleyrat, STMicroelectronicsH. Wehbe-Alause, STMicroelectronicsK. Rochereau, STMicroelectronics
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Arnaud, J.
STMicroelectronics-
14.1.2023 Colloidal Quantum Dot Image Sensor Technology
Jonathan Steckel, ST MicroelectronicsJ. Arnaud, STMicroelectronicsA. G. Pattantyus-Abraham, STMicroelectronicsA, Singh, STMicroelectronicsE. Josse, STMicroelectronicsM. Bidaud, STMicroelectronicsJ. Meitzner, STMicroelectronicsM. Sarmiento, STMicroelectronicsA. Arnaud, STMicroelectronicsE. Mazeleyrat, STMicroelectronicsH. Wehbe-Alause, STMicroelectronicsK. Rochereau, STMicroelectronics
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Ashraf, Huma
KLA Corporation (SPTS Division)-
18.8.2023 Determining the impact of facet roughness on etched facet InP laser devices operating at telecom wavelengths, making comparisons to theoretical models.
Tristan T. Burman, Cardiff UniversityJash Patel, KLA CorporationHuma Ashraf, KLA Corporation (SPTS Division)Tarran Grange, KLA CorporationSamuel Shutts, Cardiff University. IQE plcPeter M. Smowton, Cardiff University, IQE plc
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Atwimah, Samuel
University of Toledo, Toledo OH-
18.15.2023 Characterization of Optically Modulated Semi-Insulating GaN Photoconductive Semiconductor Switches
Geoffrey Foster, Jacobs Inc., Washington DCAndrew Koehler, U. S. Naval Research LaboratoryKarl D. Hobart, U.S. Naval Research LaboratorySadab Mahmud, University of Toledo, Toledo OHSamuel Atwimah, University of Toledo, Toledo OHRaghav Khanna, University of Toledo, Toledo OHTravis J. Anderson, U.S. Naval Research Laboratory
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Baker, Jack
Cardiff University-
18.4.2023 Characterisation Techniques for On-Wafer Testing of VCSELs in Volume Manufacture
Jack Baker, Cardiff UniversityC. Hentschel, Cardiff UniversityCraig Allford, Cardiff UniversitySara Gillgrass, Cardiff UniversityJ. Iwan Davies, IQE plcSamuel Shutts, Cardiff University. IQE plcPeter M. Smowton, Cardiff University, IQE plc
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Balandan, Marietta L.
Skyworks Solutions Inc.,-
10.1.2023 Mechanisms and Control of Photolithography Hotspots in Compound Semiconductor Manufacturing
Mark J. Miller, Skyworks Solutions Inc.Marietta L. Balandan, Skyworks Solutions Inc.,Aida J. Castro, Skyworks Solutions, Inc.Lorain Ross, Skyworks Solutions, Inc.M. Arif Zeeshan, Skyworks Solutions Inc.
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Baltopoulos, Athanasios
Adamant Composite Ltd.-
12.3.2023 Characterization of a Novel Thermal Interface Material based on Nanoparticles for High Power Device Package Assembly
Zeina Abdallah, University of BristolJames Pomeroy, University of BristolNicolas Blasakis, Adamant Composite Ltd.Athanasios Baltopoulos, Adamant Composite Ltd.Antonios Vavouliotis, Adamant Composite Ltd.Martin Kuball, University of Bristol
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Barnes, Andrew
European Space Agency-
4.4.2023 Origin of Transconductance roll-off in mmWave AlGaN/GaN HEMTs
Terirama Thingujam, University of BristolMichael J Uren, University of BristolNiklas Rorsman, Chalmers University of TechnologyMatthew Smith, University of BristolAndrew Barnes, European Space AgencyMichele Brondi, Akkodis for European Space Agency (ESA)Martin Kuball, University of Bristol
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Barnett, Richard
KLA Corporation (SPTS Division)-
11.2.2023 High selectivity GaN to AlGaN etching for HEMT devices
Will Worster, Swansea UniversityWill Worster, KLA Corporation (SPTS Division)Richard Barnett, KLA Corporation (SPTS Division)Jih-Wen Chou, PSMC (8” Tech Dev Center)Robin Chistine Hwang, PSMC (8” Tech Dev Center)Yen-Ling Chuang, PSMC (Fab 8B)Jia-Wei Hsu, PSMC (Fab 8B)
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Baron, Thierry
Univ. Grenoble Alpes-
17.1.2023 Large Diameter Epi-Ready InP on Si (InPOSi) Substrates
Bruno Ghyselen, SOITECFrançois-Xavier Darras, SOITECOdile Mourey, SOITECChristelle Navone, Univ. Grenoble AlpesLoic Sanchez, Univ. Grenoble AlpesChristine Di Nardo, Univ. Grenoble AlpesCarla Crobu, Univ. Grenoble AlpesLaura Toselli, Univ. Grenoble AlpesBaptiste Rousset, Univ. Grenoble AlpesFrédéric Milesi, Univ. Grenoble AlpesLaurence Gabette, Univ. Grenoble AlpesFrank Fournel, Univ. Grenoble AlpesJean Decobert, III-V LabClaire Besancon, III-V LabMickael Martin, Univ. Grenoble AlpesJeremy Moeyaert, Univ. Grenoble AlpesThierry Baron, Univ. Grenoble Alpes
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Bathurst, L.
Crystal Sonic Inc.-
11.6.2023 Sonic Lift-off (SLO) to Enable Substrate Reuse and Lower Manufacturing Cost
P. Guimerá Coll, Crystal Sonic Inc.T. Black, Crystal Sonic Inc.A.P. Merkle, Crystal Sonic Inc.L. Bathurst, Crystal Sonic Inc.M. Bertoni, Crystal Sonic Inc.
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Beheshti, Mohammadsadegh
Skyworks Solutions Inc.-
10.2.2023 Reduction in Scattered Particles Contamination in Inductively Coupled Plasma Etching Systems for High Volume High Yield Production
Mohammadsadegh Beheshti, Skyworks Solutions Inc.Samuel Mony, Skyworks Solutions, Inc.Nercy Ebrahimi, Skyworks Solution Inc.Tom Brown, Skyworks Solutions, Inc.
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Bellotti, J.
Coherent Corp. -
Bergman, Joshua
Teledyne Scientific Company-
4.2.2023 Design and Fabrication of Millimeter-Wave GaN HEMTs
Keisuke Shinohara, Teledyne Scientific CompanyDean Regan, Teledyne Scientific CompanyCasey King, Teledyne Scientific CompanyEric Regan, Teledyne Scientific CompanyPetra Rowell, Teledyne Scientific CompanyAndrea Arias, Teledyne Scientific CompanyAndrew Carter, Teledyne Scientific CompanyJoshua Bergman, Teledyne Scientific CompanyMiguel Urteaga, Teledyne Scientific CompanyBerinder Brar, Teledyne Scientific Company
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Berndorfer, T.
United Monolithic Semiconductors – GmbH -
Bertoni, M.
Crystal Sonic Inc.-
11.6.2023 Sonic Lift-off (SLO) to Enable Substrate Reuse and Lower Manufacturing Cost
P. Guimerá Coll, Crystal Sonic Inc.T. Black, Crystal Sonic Inc.A.P. Merkle, Crystal Sonic Inc.L. Bathurst, Crystal Sonic Inc.M. Bertoni, Crystal Sonic Inc.
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-
Besancon, Claire
III-V Lab-
17.1.2023 Large Diameter Epi-Ready InP on Si (InPOSi) Substrates
Bruno Ghyselen, SOITECFrançois-Xavier Darras, SOITECOdile Mourey, SOITECChristelle Navone, Univ. Grenoble AlpesLoic Sanchez, Univ. Grenoble AlpesChristine Di Nardo, Univ. Grenoble AlpesCarla Crobu, Univ. Grenoble AlpesLaura Toselli, Univ. Grenoble AlpesBaptiste Rousset, Univ. Grenoble AlpesFrédéric Milesi, Univ. Grenoble AlpesLaurence Gabette, Univ. Grenoble AlpesFrank Fournel, Univ. Grenoble AlpesJean Decobert, III-V LabClaire Besancon, III-V LabMickael Martin, Univ. Grenoble AlpesJeremy Moeyaert, Univ. Grenoble AlpesThierry Baron, Univ. Grenoble Alpes
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Bidaud, M.
STMicroelectronics-
14.1.2023 Colloidal Quantum Dot Image Sensor Technology
Jonathan Steckel, ST MicroelectronicsJ. Arnaud, STMicroelectronicsA. G. Pattantyus-Abraham, STMicroelectronicsA, Singh, STMicroelectronicsE. Josse, STMicroelectronicsM. Bidaud, STMicroelectronicsJ. Meitzner, STMicroelectronicsM. Sarmiento, STMicroelectronicsA. Arnaud, STMicroelectronicsE. Mazeleyrat, STMicroelectronicsH. Wehbe-Alause, STMicroelectronicsK. Rochereau, STMicroelectronics
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Black, T.
Crystal Sonic Inc.-
11.6.2023 Sonic Lift-off (SLO) to Enable Substrate Reuse and Lower Manufacturing Cost
P. Guimerá Coll, Crystal Sonic Inc.T. Black, Crystal Sonic Inc.A.P. Merkle, Crystal Sonic Inc.L. Bathurst, Crystal Sonic Inc.M. Bertoni, Crystal Sonic Inc.
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Blanck, H.
United Monolithic Semiconductors Germany -
Blasakis, Nicolas
Adamant Composite Ltd.-
12.3.2023 Characterization of a Novel Thermal Interface Material based on Nanoparticles for High Power Device Package Assembly
Zeina Abdallah, University of BristolJames Pomeroy, University of BristolNicolas Blasakis, Adamant Composite Ltd.Athanasios Baltopoulos, Adamant Composite Ltd.Antonios Vavouliotis, Adamant Composite Ltd.Martin Kuball, University of Bristol
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Bohm, T.
United Monolithic Semiconductors – GmbH -
Boyer, J. T.
National Renewable Energy Laboratory-
17.4.2023 Comparison of Heterointerface Growth Procedures using High-Growth-Rate Hydride Vapor Phase Epitaxy
Aaron Ptak, National Renewable Energy LaboratoryJ. T. Boyer, National Renewable Energy LaboratoryA. K. Braun, Colorado School of MinesA. N. Perna, National Renewable Energy LaboratoryKevin Schulte, National Renewable Energy LaboratoryJohn Simon, National Renewable Energy Laboratory -
17.5.2023 Morphology Control of Growth by Hydride Vapor Phase Epitaxy on Faceted GaAs Substrates Produced by Controlled Spalling for Low Cost III-V devices
A. K. Braun, Colorado School of MinesJ. T. Boyer, National Renewable Energy LaboratoryWilliam E. McMahon, National Renewable Energy LaboratoryKevin Schulte, National Renewable Energy LaboratoryJohn Simon, National Renewable Energy LaboratoryCorinne E. Packard, Colorado School of Mines, National Renewable Energy LaboratoryAaron Ptak, National Renewable Energy Laboratory
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Brar, Berinder
Teledyne Scientific Company-
4.2.2023 Design and Fabrication of Millimeter-Wave GaN HEMTs
Keisuke Shinohara, Teledyne Scientific CompanyDean Regan, Teledyne Scientific CompanyCasey King, Teledyne Scientific CompanyEric Regan, Teledyne Scientific CompanyPetra Rowell, Teledyne Scientific CompanyAndrea Arias, Teledyne Scientific CompanyAndrew Carter, Teledyne Scientific CompanyJoshua Bergman, Teledyne Scientific CompanyMiguel Urteaga, Teledyne Scientific CompanyBerinder Brar, Teledyne Scientific Company
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Braun, A. K.
Colorado School of Mines-
17.4.2023 Comparison of Heterointerface Growth Procedures using High-Growth-Rate Hydride Vapor Phase Epitaxy
Aaron Ptak, National Renewable Energy LaboratoryJ. T. Boyer, National Renewable Energy LaboratoryA. K. Braun, Colorado School of MinesA. N. Perna, National Renewable Energy LaboratoryKevin Schulte, National Renewable Energy LaboratoryJohn Simon, National Renewable Energy Laboratory -
17.5.2023 Morphology Control of Growth by Hydride Vapor Phase Epitaxy on Faceted GaAs Substrates Produced by Controlled Spalling for Low Cost III-V devices
A. K. Braun, Colorado School of MinesJ. T. Boyer, National Renewable Energy LaboratoryWilliam E. McMahon, National Renewable Energy LaboratoryKevin Schulte, National Renewable Energy LaboratoryJohn Simon, National Renewable Energy LaboratoryCorinne E. Packard, Colorado School of Mines, National Renewable Energy LaboratoryAaron Ptak, National Renewable Energy Laboratory
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Britz, David A.
Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USA-
3.4.2023 Advanced Carbon film for high-voltage power, high-performance SiC devices
Ludovico Megalini, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAYi Zheng, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USARicky Fang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAPratim Palit,, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJinghe Yang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAQintao Zhang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJang Seok Oh, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USABryan Turner, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USASamphy Hong, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJiao Yang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJoseph Lee, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAGopal Prabhu, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAAswin Prathap Pitchiya, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USADavid A. Britz, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USARaghav Sreenivasan, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAStephen Krause, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAMichael Chudzik, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USATamara Fidler, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, GermanyPatrick Schmid, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, GermanyBas Derksema, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, Germany
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Brondi, Michele
Akkodis for European Space Agency (ESA)-
4.4.2023 Origin of Transconductance roll-off in mmWave AlGaN/GaN HEMTs
Terirama Thingujam, University of BristolMichael J Uren, University of BristolNiklas Rorsman, Chalmers University of TechnologyMatthew Smith, University of BristolAndrew Barnes, European Space AgencyMichele Brondi, Akkodis for European Space Agency (ESA)Martin Kuball, University of Bristol
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Brown, David
HRL Laboratories, LLC.-
3.5.2023 Transfer and Implementation of AFRL 140nm Technology on 6-in GaN on SiC
Wen Zhu, BAE Systems IncDavid Brown, HRL Laboratories, LLC.Puneet Srivastava, BAE Systems IncKanin Chu, BAE Systems Inc
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Brown, Tom
Skyworks Solutions, Inc.-
10.2.2023 Reduction in Scattered Particles Contamination in Inductively Coupled Plasma Etching Systems for High Volume High Yield Production
Mohammadsadegh Beheshti, Skyworks Solutions Inc.Samuel Mony, Skyworks Solutions, Inc.Nercy Ebrahimi, Skyworks Solution Inc.Tom Brown, Skyworks Solutions, Inc.
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Brunner, Frank
Ferdinand-Braun-Institut (FBH)-
9.3.2023 Drift Region Epitaxy Development and Characterization for High Blocking Strength and Low Specific Resistance in Vertical GaN Based Devices
Eldad Bahat Treidel, Ferdinand-Braun-Institut (FBH)Frank Brunner, Ferdinand-Braun-Institut (FBH)Enrico Brusaterra, Ferdinand-Braun-Institut (FBH)Mihaela Wolf, Ferdinand-Braun-Institut (FBH)Andreas Thies, Ferdinand-Braun-InstitutJ. Würfl, Ferdinand-Braun-Institut (FBH)Oliver Hilt, Ferdinand-Braun-Institut (FBH)
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Brusaterra, Enrico
Ferdinand-Braun-Institut (FBH)-
9.3.2023 Drift Region Epitaxy Development and Characterization for High Blocking Strength and Low Specific Resistance in Vertical GaN Based Devices
Eldad Bahat Treidel, Ferdinand-Braun-Institut (FBH)Frank Brunner, Ferdinand-Braun-Institut (FBH)Enrico Brusaterra, Ferdinand-Braun-Institut (FBH)Mihaela Wolf, Ferdinand-Braun-Institut (FBH)Andreas Thies, Ferdinand-Braun-InstitutJ. Würfl, Ferdinand-Braun-Institut (FBH)Oliver Hilt, Ferdinand-Braun-Institut (FBH)
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Bryie, Randy
Skyworks Solutions, Inc.-
5.3.2023 Integration of Nichrome Process as a Competitive Alternative to Tantalum Nitride for Thin Film Resistors in Compound Semiconductors
Stephanie Y. Chang, Skyworks Solutions, Inc.Shiban Tiku, Skyworks Solutions, Inc.Tom Brown, Skyworks Solutions, Inc.Lam Luu, Skyworks Solutions, Inc.Manohar Krishnappa, Skyworks Solutions, Inc.Randy Bryie, Skyworks Solutions, Inc.Nercy Ebrahimi, Skyworks Solution Inc.
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Burey, C.
Yole Developpment -
Burman, Tristan T.
Cardiff University-
18.8.2023 Determining the impact of facet roughness on etched facet InP laser devices operating at telecom wavelengths, making comparisons to theoretical models.
Tristan T. Burman, Cardiff UniversityJash Patel, KLA CorporationHuma Ashraf, KLA Corporation (SPTS Division)Tarran Grange, KLA CorporationSamuel Shutts, Cardiff University. IQE plcPeter M. Smowton, Cardiff University, IQE plc
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Carter, Andrew
Teledyne Scientific Company-
4.2.2023 Design and Fabrication of Millimeter-Wave GaN HEMTs
Keisuke Shinohara, Teledyne Scientific CompanyDean Regan, Teledyne Scientific CompanyCasey King, Teledyne Scientific CompanyEric Regan, Teledyne Scientific CompanyPetra Rowell, Teledyne Scientific CompanyAndrea Arias, Teledyne Scientific CompanyAndrew Carter, Teledyne Scientific CompanyJoshua Bergman, Teledyne Scientific CompanyMiguel Urteaga, Teledyne Scientific CompanyBerinder Brar, Teledyne Scientific Company
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Castro, Aida J.
Skyworks Solutions, Inc.-
10.1.2023 Mechanisms and Control of Photolithography Hotspots in Compound Semiconductor Manufacturing
Mark J. Miller, Skyworks Solutions Inc.Marietta L. Balandan, Skyworks Solutions Inc.,Aida J. Castro, Skyworks Solutions, Inc.Lorain Ross, Skyworks Solutions, Inc.M. Arif Zeeshan, Skyworks Solutions Inc.
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Chabak, Kelson
Air Force Research Laboratory, Sensors Directorate-
12.2.2023 High Temperature Studies of 140 nm T-gate AlGaN/GaN HEMT Devices
Ahmad Islam, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAAdam Miesle, KBR Inc.Nicholas P. Sepelak, KBR, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAHanwool Lee, KBR Inc.Dennis E. Walker Jr., Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH,N. Miller, Air Force Research LaboratoryMatt Grupen, Air Force Research Laboratory, Sensors DirectorateKyle Liddy, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAAntonio Crespo, Air Force Research Laboratory, Sensors DirectorateGary Hughes, Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OHWenjuan Zhu, University of Illinois, UrbanaKelson Chabak, Air Force Research Laboratory, Sensors DirectorateAndrew J. Green, Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH,
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Chang, J.
Northrop Grumman Mission Center -
Chang, Kuo-Jen
National Chung-Shan Institute of Science and Technology-
18.16.2023 Electrical and Thermal Performance Analysis of AlGaN/GaN HEMT without Voltage-Blocking Buffer Layer Design
Chong Rong Huang, Chang Gung UniversityHsien-Chin Chiu, Chang Gung UniversityChia-Hao Liu, Chang Gung UniversityHsiang-Chun Wang, Chang Gung UniversityChao-Wei Chiu, Chang Gung UniversityHsuan-Ling Kao, Chang Gung University,Chih-Tien Chen, National Chung-Shan Institute of Science and TechnologyKuo-Jen Chang, National Chung-Shan Institute of Science and Technology
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Chang, Stephanie Y.
Skyworks Solutions, Inc.-
5.3.2023 Integration of Nichrome Process as a Competitive Alternative to Tantalum Nitride for Thin Film Resistors in Compound Semiconductors
Stephanie Y. Chang, Skyworks Solutions, Inc.Shiban Tiku, Skyworks Solutions, Inc.Tom Brown, Skyworks Solutions, Inc.Lam Luu, Skyworks Solutions, Inc.Manohar Krishnappa, Skyworks Solutions, Inc.Randy Bryie, Skyworks Solutions, Inc.Nercy Ebrahimi, Skyworks Solution Inc.
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Chao, Chien-Hsian
Chang Gung University-
18.10.2023 RF and Power Characteristics of AlGaN/AlN/GaN HEMTs on Mn-Doped Freestanding GaN substrate
Chien-Hsian Chao, Chang Gung UniversityHsien-Chin Chiu, Chang Gung UniversityHsiang-Chun Wang, Chang Gung UniversityChong Rong Haung, Chang Gung UniversityChen Kang Chuang, Chang Gung UniversityYang Ching Ho, Chang Gung University
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Chen, Chih-Tien
National Chung-Shan Institute of Science and Technology-
18.16.2023 Electrical and Thermal Performance Analysis of AlGaN/GaN HEMT without Voltage-Blocking Buffer Layer Design
Chong Rong Huang, Chang Gung UniversityHsien-Chin Chiu, Chang Gung UniversityChia-Hao Liu, Chang Gung UniversityHsiang-Chun Wang, Chang Gung UniversityChao-Wei Chiu, Chang Gung UniversityHsuan-Ling Kao, Chang Gung University,Chih-Tien Chen, National Chung-Shan Institute of Science and TechnologyKuo-Jen Chang, National Chung-Shan Institute of Science and Technology
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Chen, Kuan-Hua
WIN Semiconductors Corp.-
18.9.2023 3-D Derived Structure Electromagnetic Simulation for Enhancement Mode Low Noise pHEMT Technology.
Kuan-Hua Chen, WIN Semiconductors Corp.Shou-Hsien Weng, WIN Semiconductors Corp.Shih-Wei Chen, WIN Semiconductors Corp.Chi-Ming Lin, WIN Semiconductors Corp.Jia-Shyan Wu, WIN Semiconductors Corp.Chi-Hsiang Kuo, WIN Semiconductors Corp
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Chen, Shih-Wei
WIN Semiconductors Corp.-
18.9.2023 3-D Derived Structure Electromagnetic Simulation for Enhancement Mode Low Noise pHEMT Technology.
Kuan-Hua Chen, WIN Semiconductors Corp.Shou-Hsien Weng, WIN Semiconductors Corp.Shih-Wei Chen, WIN Semiconductors Corp.Chi-Ming Lin, WIN Semiconductors Corp.Jia-Shyan Wu, WIN Semiconductors Corp.Chi-Hsiang Kuo, WIN Semiconductors Corp
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Cheng, Hao-Tien
National Taiwan University-
14.5.2023 Reliability assessment of HTOL stressed VCSELs with camera-based beam profilers
Hao-Tien Cheng, National Taiwan UniversityTaixian Zhang, LiVe OptronicsYun-Cheng Yang, National Taiwan UniversityTe-Hua Liu, National Taiwan UniversityChao-Hsin Wu, National Taiwan University -
16.4.2023 1.55 μm DFB Laser with ns-level pulses for LiDAR
Te-Hua Liu, National Taiwan UniversityHong-Ye Lin, National Taiwan UniversityHao-Tien Cheng, National Taiwan UniversityChao-Hsin Wu, National Taiwan University
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Cheng, Kezia
Skyworks Solutions Inc. -
Chiang, Chao-Ching
University of Florida, Gainesville, FL-
18.3.2023 Temperature Independence of Dynamic Switching in 4.8 A /3.6 kV NiO/β-Ga2O3 High Power Rectifiers
Jian-Sian Li, University of Florida, Gainesville, FLChao-Ching Chiang, University of Florida, Gainesville, FLXinyi Xia, University of Florida, Gainesville, FLCheng-Tse Tsai, University of Florida, Gainesville, FLYu-Te Liao, University of Florida, Gainesville, FLStephen Pearton, University of Florida -
18.11.2023 Ionization Thresholds and Residue Removal in Inductively Coupled Etching of NiO/Ga2O3 with Ar and BCl3
Chao-Ching Chiang, University of Florida, Gainesville, FLXinyi Xia, University of Florida, Gainesville, FLJian-Sian Li, University of Florida, Gainesville, FLFan Ren, University of FloridaStephen Pearton, University of Florida
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Chiu, Chao-Wei
Chang Gung University -
Chiu, Hsien-Chin
Chang Gung University-
18.10.2023 RF and Power Characteristics of AlGaN/AlN/GaN HEMTs on Mn-Doped Freestanding GaN substrate
Chien-Hsian Chao, Chang Gung UniversityHsien-Chin Chiu, Chang Gung UniversityHsiang-Chun Wang, Chang Gung UniversityChong Rong Haung, Chang Gung UniversityChen Kang Chuang, Chang Gung UniversityYang Ching Ho, Chang Gung University
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Chiu, P.
Yole Developpement, France-
13.3.2023 The Dawn of The InP Market in Consumer Applications
Ali Jaffal, Yole GroupP. Chiu, Yole Developpement, FranceM. Vallo, Yole DeveloppmentE. Dogmus, Yole Developpement, FranceC. Troadec, Yole Developpement, France
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Chou, Jih-Wen
PSMC (8” Tech Dev Center)-
11.2.2023 High selectivity GaN to AlGaN etching for HEMT devices
Will Worster, Swansea UniversityWill Worster, KLA Corporation (SPTS Division)Richard Barnett, KLA Corporation (SPTS Division)Jih-Wen Chou, PSMC (8” Tech Dev Center)Robin Chistine Hwang, PSMC (8” Tech Dev Center)Yen-Ling Chuang, PSMC (Fab 8B)Jia-Wei Hsu, PSMC (Fab 8B)
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Chowdhury, S.
Stanford University, Stanford, CA; University of Bristol, Bristol, UK-
12.1.2023 Thermal management in GaN-devices for increased power density
Mohamadali Malakoutian, Stanford University, Stanford, CA,Xiang Zheng, University of Bristol, BristolMartin Kuball, University of BristolS. Chowdhury, Stanford University, Stanford, CA; University of Bristol, Bristol, UK
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Chu, Kanin
BAE Systems Inc-
3.5.2023 Transfer and Implementation of AFRL 140nm Technology on 6-in GaN on SiC
Wen Zhu, BAE Systems IncDavid Brown, HRL Laboratories, LLC.Puneet Srivastava, BAE Systems IncKanin Chu, BAE Systems Inc
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Chuang, Chen Kang
Chang Gung University-
18.10.2023 RF and Power Characteristics of AlGaN/AlN/GaN HEMTs on Mn-Doped Freestanding GaN substrate
Chien-Hsian Chao, Chang Gung UniversityHsien-Chin Chiu, Chang Gung UniversityHsiang-Chun Wang, Chang Gung UniversityChong Rong Haung, Chang Gung UniversityChen Kang Chuang, Chang Gung UniversityYang Ching Ho, Chang Gung University
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Chuang, Yen-Ling
PSMC (Fab 8B)-
11.2.2023 High selectivity GaN to AlGaN etching for HEMT devices
Will Worster, Swansea UniversityWill Worster, KLA Corporation (SPTS Division)Richard Barnett, KLA Corporation (SPTS Division)Jih-Wen Chou, PSMC (8” Tech Dev Center)Robin Chistine Hwang, PSMC (8” Tech Dev Center)Yen-Ling Chuang, PSMC (Fab 8B)Jia-Wei Hsu, PSMC (Fab 8B)
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Chudzik , Michael
Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USA-
3.4.2023 Advanced Carbon film for high-voltage power, high-performance SiC devices
Ludovico Megalini, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAYi Zheng, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USARicky Fang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAPratim Palit,, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJinghe Yang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAQintao Zhang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJang Seok Oh, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USABryan Turner, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USASamphy Hong, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJiao Yang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJoseph Lee, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAGopal Prabhu, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAAswin Prathap Pitchiya, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USADavid A. Britz, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USARaghav Sreenivasan, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAStephen Krause, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAMichael Chudzik, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USATamara Fidler, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, GermanyPatrick Schmid, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, GermanyBas Derksema, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, Germany
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Clark, Andrew
IQE, Cardiff, UK-
14.2.2023 Assessment of 1.3-?m InAs QD Edge-Emitting Lasers Grown on Large Area GaAs Substrates
Sara Gillgrass, Cardiff UniversityCraig Allford, Cardiff UniversityMukul Debnath, IQE plcAndrew Clark, IQE, Cardiff, UKPeter M. Smowton, Cardiff University, IQE plc
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Coll, P. Guimerá
Crystal Sonic Inc.-
11.6.2023 Sonic Lift-off (SLO) to Enable Substrate Reuse and Lower Manufacturing Cost
P. Guimerá Coll, Crystal Sonic Inc.T. Black, Crystal Sonic Inc.A.P. Merkle, Crystal Sonic Inc.L. Bathurst, Crystal Sonic Inc.M. Bertoni, Crystal Sonic Inc.
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Correia, Stelio
OSRAM Group, Regensburg, Germany-
3.1.2023 Plasma Dicing of thin-film LEDs
Heribert Zull, OSRAM Group, Regensburg, GermanyMahsa Norouzi Kalkani, OSRAM Group, Regensburg, GermanyStelio Correia, OSRAM Group, Regensburg, GermanyMathias Kaempf, OSRAM Group, Regensburg, GermanyMartin Strassburg, OSRAM Group, Regensburg, Germany
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Cowles, John
Analog Devices-
1.1.2023 Digitization and Edge Processing Redefine the Roles of Semiconductor and Packaging Technologies for Future Defense Platforms
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Crespo, Antonio
Air Force Research Laboratory, Sensors Directorate-
12.2.2023 High Temperature Studies of 140 nm T-gate AlGaN/GaN HEMT Devices
Ahmad Islam, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAAdam Miesle, KBR Inc.Nicholas P. Sepelak, KBR, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAHanwool Lee, KBR Inc.Dennis E. Walker Jr., Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH,N. Miller, Air Force Research LaboratoryMatt Grupen, Air Force Research Laboratory, Sensors DirectorateKyle Liddy, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAAntonio Crespo, Air Force Research Laboratory, Sensors DirectorateGary Hughes, Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OHWenjuan Zhu, University of Illinois, UrbanaKelson Chabak, Air Force Research Laboratory, Sensors DirectorateAndrew J. Green, Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH,
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Crobu, Carla
Univ. Grenoble Alpes-
17.1.2023 Large Diameter Epi-Ready InP on Si (InPOSi) Substrates
Bruno Ghyselen, SOITECFrançois-Xavier Darras, SOITECOdile Mourey, SOITECChristelle Navone, Univ. Grenoble AlpesLoic Sanchez, Univ. Grenoble AlpesChristine Di Nardo, Univ. Grenoble AlpesCarla Crobu, Univ. Grenoble AlpesLaura Toselli, Univ. Grenoble AlpesBaptiste Rousset, Univ. Grenoble AlpesFrédéric Milesi, Univ. Grenoble AlpesLaurence Gabette, Univ. Grenoble AlpesFrank Fournel, Univ. Grenoble AlpesJean Decobert, III-V LabClaire Besancon, III-V LabMickael Martin, Univ. Grenoble AlpesJeremy Moeyaert, Univ. Grenoble AlpesThierry Baron, Univ. Grenoble Alpes
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Crum, Darren
Naval Surface Warfare Center Crane -
D. Martin, Quinn
MACOM Technology Solutions-
8.2.2023 Diamond-Metal Composite Package for High Power RF Device
Quinn D. Martin, MACOM Technology Solutions
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Darras, François-Xavier
SOITEC-
17.1.2023 Large Diameter Epi-Ready InP on Si (InPOSi) Substrates
Bruno Ghyselen, SOITECFrançois-Xavier Darras, SOITECOdile Mourey, SOITECChristelle Navone, Univ. Grenoble AlpesLoic Sanchez, Univ. Grenoble AlpesChristine Di Nardo, Univ. Grenoble AlpesCarla Crobu, Univ. Grenoble AlpesLaura Toselli, Univ. Grenoble AlpesBaptiste Rousset, Univ. Grenoble AlpesFrédéric Milesi, Univ. Grenoble AlpesLaurence Gabette, Univ. Grenoble AlpesFrank Fournel, Univ. Grenoble AlpesJean Decobert, III-V LabClaire Besancon, III-V LabMickael Martin, Univ. Grenoble AlpesJeremy Moeyaert, Univ. Grenoble AlpesThierry Baron, Univ. Grenoble Alpes
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Davies, J. Iwan
IQE plc-
18.4.2023 Characterisation Techniques for On-Wafer Testing of VCSELs in Volume Manufacture
Jack Baker, Cardiff UniversityC. Hentschel, Cardiff UniversityCraig Allford, Cardiff UniversitySara Gillgrass, Cardiff UniversityJ. Iwan Davies, IQE plcSamuel Shutts, Cardiff University. IQE plcPeter M. Smowton, Cardiff University, IQE plc
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Debnath, Mukul
IQE plc-
14.2.2023 Assessment of 1.3-?m InAs QD Edge-Emitting Lasers Grown on Large Area GaAs Substrates
Sara Gillgrass, Cardiff UniversityCraig Allford, Cardiff UniversityMukul Debnath, IQE plcAndrew Clark, IQE, Cardiff, UKPeter M. Smowton, Cardiff University, IQE plc
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Decobert, Jean
III-V Lab-
17.1.2023 Large Diameter Epi-Ready InP on Si (InPOSi) Substrates
Bruno Ghyselen, SOITECFrançois-Xavier Darras, SOITECOdile Mourey, SOITECChristelle Navone, Univ. Grenoble AlpesLoic Sanchez, Univ. Grenoble AlpesChristine Di Nardo, Univ. Grenoble AlpesCarla Crobu, Univ. Grenoble AlpesLaura Toselli, Univ. Grenoble AlpesBaptiste Rousset, Univ. Grenoble AlpesFrédéric Milesi, Univ. Grenoble AlpesLaurence Gabette, Univ. Grenoble AlpesFrank Fournel, Univ. Grenoble AlpesJean Decobert, III-V LabClaire Besancon, III-V LabMickael Martin, Univ. Grenoble AlpesJeremy Moeyaert, Univ. Grenoble AlpesThierry Baron, Univ. Grenoble Alpes
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Decoutere, Stefaan
Imec, Leuven, Belgium-
7.5.2023 Improving the yield for GaN-on-Si HEMT devices for power applications
D. Fahle, AIXTRON SE GermanyC. Mauder, AIXTRON SEH. Hahn, AIXTRON SEZ. Gao, AIXTRON SENiels Posthuma, ImecStefaan Decoutere, Imec, Leuven, Belgium
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Denis, P.
United Monolithic Semiconductors – GmbH -
Derksema, Bas
Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, Germany-
3.4.2023 Advanced Carbon film for high-voltage power, high-performance SiC devices
Ludovico Megalini, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAYi Zheng, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USARicky Fang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAPratim Palit,, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJinghe Yang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAQintao Zhang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJang Seok Oh, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USABryan Turner, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USASamphy Hong, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJiao Yang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJoseph Lee, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAGopal Prabhu, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAAswin Prathap Pitchiya, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USADavid A. Britz, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USARaghav Sreenivasan, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAStephen Krause, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAMichael Chudzik, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USATamara Fidler, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, GermanyPatrick Schmid, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, GermanyBas Derksema, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, Germany
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Di Nardo, Christine
Univ. Grenoble Alpes-
17.1.2023 Large Diameter Epi-Ready InP on Si (InPOSi) Substrates
Bruno Ghyselen, SOITECFrançois-Xavier Darras, SOITECOdile Mourey, SOITECChristelle Navone, Univ. Grenoble AlpesLoic Sanchez, Univ. Grenoble AlpesChristine Di Nardo, Univ. Grenoble AlpesCarla Crobu, Univ. Grenoble AlpesLaura Toselli, Univ. Grenoble AlpesBaptiste Rousset, Univ. Grenoble AlpesFrédéric Milesi, Univ. Grenoble AlpesLaurence Gabette, Univ. Grenoble AlpesFrank Fournel, Univ. Grenoble AlpesJean Decobert, III-V LabClaire Besancon, III-V LabMickael Martin, Univ. Grenoble AlpesJeremy Moeyaert, Univ. Grenoble AlpesThierry Baron, Univ. Grenoble Alpes
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Dodson, G.
Kyma Technologies-
11.1.2023 HVPE-Based Gallium Oxide Epiwafer Development
J.H. Leach, Kyma TechnologiesKevin Udwary, Kyma TechnologiesG. Dodson, Kyma TechnologiesH.A. Splawn, Kyma Technologies, Inc.
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Dogmus, E.
Yole Developpement, France-
13.3.2023 The Dawn of The InP Market in Consumer Applications
Ali Jaffal, Yole GroupP. Chiu, Yole Developpement, FranceM. Vallo, Yole DeveloppmentE. Dogmus, Yole Developpement, FranceC. Troadec, Yole Developpement, France
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DOGMUS, Ezgi
Yole Développement-
13.3.2023 The Dawn of The InP Market in Consumer Applications
Ali Jaffal, Yole GroupP. Chiu, Yole Developpement, FranceM. Vallo, Yole DeveloppmentE. Dogmus, Yole Developpement, FranceC. Troadec, Yole Developpement, France
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Downey, Brian
US Naval Research Laboratory-
8.3.2023 Heterogeneous Integration of Gallium Nitride HEMTs with Single Crystal Diamond Substrates via Micro-transfer Printing for Thermal Management
James Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLAndy Xie, QorvoShawn Mack, U.S. Naval Research LaboratoryD. Scott Katzer, U.S. Naval Research LaboratoryMarko J. Tadjer, U.S. Naval Research LaboratoryTravis J. Anderson, U.S. Naval Research LaboratoryBrian Downey, US Naval Research LaboratoryDavid J Meyer, U.S. Naval Research Laboratory, Washington, DC
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Dryden, Daniel M.
KBR, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USA-
7.3.2023 Scaled ?-Ga2O3 MOSFETs with Pulsed Laser Deposition-Regrown Ohmics
Daniel M. Dryden, KBR, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAHyung Min Jeon, KBR Inc.,Kyle Liddy, Air Force Research LaboratoryAhmad Islam, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USADennis E. Walker Jr., Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH,Jeremiah C. Williams, Air Force Research Laboratory, Sensors DirectorateNicholas P. Sepelak, KBR, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USANolan S. Hendricks, Air Force Research Laboratory, Sensors DirectorateKevin Leedy, Air Force Research Laboratory, Sensors DirectorateKelson Chabak, Air Force Research Laboratory, Sensors DirectorateAndrew J. Green, Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH,
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Ebrahimi, Nercy
Skyworks Solution Inc.-
10.2.2023 Reduction in Scattered Particles Contamination in Inductively Coupled Plasma Etching Systems for High Volume High Yield Production
Mohammadsadegh Beheshti, Skyworks Solutions Inc.Samuel Mony, Skyworks Solutions, Inc.Nercy Ebrahimi, Skyworks Solution Inc.Tom Brown, Skyworks Solutions, Inc.
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Ebrish, Mona
NRC Postdoc Fellow Residing at the U.S. Naval Research Laboratory-
9.4.2023 Scalable Manufacturing of Planar, Large-Area 1.2kV and 3.3kV Vertical GaN PiN Diodes
Alan Jacobs, U.S. Naval Research LaboratoryMona Ebrish, NRC Postdoc Fellow Residing at the U.S. Naval Research LaboratoryJames Gallagher, U.S. Naval Research LaboratoryMarko J. Tadjer, U.S. Naval Research LaboratoryJames Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLJennifer K. Hite, Naval Research LaboratoryN. Mahadik, U.S. Naval Research LaboratoryRobert Kaplar, Sandia National Labs, Albuquerque, NMO. Aktas, Sandia National Labs, Albuquerque, NM -
10.5.2023 Accuracy of Machine Learning Models on Predicting the Properties of Vertical GaN Diodes
James Gallagher, U.S. Naval Research LaboratoryMichael A. Mastro, U.S. Naval Research LaboratoryMona Ebrish, Vanderbilt University, Nashville, TNAlan Jacobs, U.S. Naval Research LaboratoryBrendan. P. Gunning, Sandia National Labs, Albuquerque, NMRobert Kaplar, Sandia National Labs, Albuquerque, NM
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Ebrish, Mona
Vanderbilt University, Nashville, TN-
9.4.2023 Scalable Manufacturing of Planar, Large-Area 1.2kV and 3.3kV Vertical GaN PiN Diodes
Alan Jacobs, U.S. Naval Research LaboratoryMona Ebrish, NRC Postdoc Fellow Residing at the U.S. Naval Research LaboratoryJames Gallagher, U.S. Naval Research LaboratoryMarko J. Tadjer, U.S. Naval Research LaboratoryJames Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLJennifer K. Hite, Naval Research LaboratoryN. Mahadik, U.S. Naval Research LaboratoryRobert Kaplar, Sandia National Labs, Albuquerque, NMO. Aktas, Sandia National Labs, Albuquerque, NM
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Espenhahn, Leah
University of Illinois at Urbana-Champaign-
14.3.2023 Silicon Anti-Phase Optical Coatings for High-Power, Single-Mode Operation in Vertical-Cavity Surface-Emitting Lasers
Kevin P. Pikul, University of Illinois Urbana-ChampagneLeah Espenhahn, University of Illinois at Urbana-ChampaignPatrick Su, University of Illinois at Urbana-ChampaignMark Kraman, University of Illinois Urbana-ChampagneJohn M Dallesasse, University of Illinois at Urbana-Champaign
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Fahle, D.
AIXTRON SE Germany-
7.5.2023 Improving the yield for GaN-on-Si HEMT devices for power applications
D. Fahle, AIXTRON SE GermanyC. Mauder, AIXTRON SEH. Hahn, AIXTRON SEZ. Gao, AIXTRON SENiels Posthuma, ImecStefaan Decoutere, Imec, Leuven, Belgium
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Fang, Ricky
Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USA-
3.4.2023 Advanced Carbon film for high-voltage power, high-performance SiC devices
Ludovico Megalini, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAYi Zheng, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USARicky Fang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAPratim Palit,, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJinghe Yang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAQintao Zhang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJang Seok Oh, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USABryan Turner, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USASamphy Hong, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJiao Yang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJoseph Lee, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAGopal Prabhu, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAAswin Prathap Pitchiya, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USADavid A. Britz, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USARaghav Sreenivasan, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAStephen Krause, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAMichael Chudzik, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USATamara Fidler, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, GermanyPatrick Schmid, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, GermanyBas Derksema, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, Germany
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Faria, Mario
Tignis, Inc. -
Feng, Milton
University of Illinois, Urbana-Champaign-
14.4.2023 Developing Single-Mode VCSEL for Extending High-Speed PAM4 Transmitting Distance in SMF-28 Fiber Up to 1 km and 70 °C
Haonan Wu, University of Illinois at Urbana-ChampaignDufei Wu, University of Illinois at Urbana ChampaignXin Yu, University of Illinois at Urbana-ChampaignMilton Feng, University of Illinois, Urbana-Champaign
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Feygelson, Boris
U.S. Naval Research Laboratory-
11.4.2023 Nanocrystalline Diamond-Capped β-(AlxGa1-x)2O3/Ga2O3 Heterostructure FieldEffect Transistor
Hannah N. Masten, National Research Council Postdoctoral Fellow, Residing at NRLJames Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLTatyana Feygelson, U. S. Naval Research LaboratoryJoseph Spencer, U.S. Naval Research LaboratoryTatyana I. Feygelson, American Society for Engineering Education, United States Naval Research Lab. Universidad Politecnica de MadridJennifer K. Hite, Naval Research LaboratoryDaniel Pennachio, U.S. Naval Research Laboratory, Washington DCAlan Jacobs, U.S. Naval Research LaboratoryBoris Feygelson, U.S. Naval Research LaboratoryKohei Sasaki, Novel Crystal TechnologyAkito Kuramata, Novel Crystal Technology, IncPai-Ying Liao, Purdue UniversityPeide D. Ye, Purdue UniversityBradford Pate, Naval Research LaboratoryTravis J. Anderson, U.S. Naval Research LaboratoryMarko J. Tadjer, U.S. Naval Research Laboratory
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Feygelson, Tatyana
U. S. Naval Research Laboratory-
11.4.2023 Nanocrystalline Diamond-Capped β-(AlxGa1-x)2O3/Ga2O3 Heterostructure FieldEffect Transistor
Hannah N. Masten, National Research Council Postdoctoral Fellow, Residing at NRLJames Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLTatyana Feygelson, U. S. Naval Research LaboratoryJoseph Spencer, U.S. Naval Research LaboratoryTatyana I. Feygelson, American Society for Engineering Education, United States Naval Research Lab. Universidad Politecnica de MadridJennifer K. Hite, Naval Research LaboratoryDaniel Pennachio, U.S. Naval Research Laboratory, Washington DCAlan Jacobs, U.S. Naval Research LaboratoryBoris Feygelson, U.S. Naval Research LaboratoryKohei Sasaki, Novel Crystal TechnologyAkito Kuramata, Novel Crystal Technology, IncPai-Ying Liao, Purdue UniversityPeide D. Ye, Purdue UniversityBradford Pate, Naval Research LaboratoryTravis J. Anderson, U.S. Naval Research LaboratoryMarko J. Tadjer, U.S. Naval Research Laboratory
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Feygelson, Tatyana I.
American Society for Engineering Education, United States Naval Research Lab. Universidad Politecnica de Madrid-
11.4.2023 Nanocrystalline Diamond-Capped β-(AlxGa1-x)2O3/Ga2O3 Heterostructure FieldEffect Transistor
Hannah N. Masten, National Research Council Postdoctoral Fellow, Residing at NRLJames Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLTatyana Feygelson, U. S. Naval Research LaboratoryJoseph Spencer, U.S. Naval Research LaboratoryTatyana I. Feygelson, American Society for Engineering Education, United States Naval Research Lab. Universidad Politecnica de MadridJennifer K. Hite, Naval Research LaboratoryDaniel Pennachio, U.S. Naval Research Laboratory, Washington DCAlan Jacobs, U.S. Naval Research LaboratoryBoris Feygelson, U.S. Naval Research LaboratoryKohei Sasaki, Novel Crystal TechnologyAkito Kuramata, Novel Crystal Technology, IncPai-Ying Liao, Purdue UniversityPeide D. Ye, Purdue UniversityBradford Pate, Naval Research LaboratoryTravis J. Anderson, U.S. Naval Research LaboratoryMarko J. Tadjer, U.S. Naval Research Laboratory
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Fidler, Tamara
Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, Germany-
3.4.2023 Advanced Carbon film for high-voltage power, high-performance SiC devices
Ludovico Megalini, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAYi Zheng, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USARicky Fang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAPratim Palit,, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJinghe Yang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAQintao Zhang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJang Seok Oh, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USABryan Turner, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USASamphy Hong, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJiao Yang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJoseph Lee, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAGopal Prabhu, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAAswin Prathap Pitchiya, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USADavid A. Britz, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USARaghav Sreenivasan, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAStephen Krause, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAMichael Chudzik, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USATamara Fidler, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, GermanyPatrick Schmid, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, GermanyBas Derksema, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, Germany
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Flemish, Joseph
Lumileds LLC-
16.1.2023 Technical and Manufacturing Challenges in MicroLED Processes
Hee Jin Kim, Lumileds LLCRob Armitage, Lumileds LLCJoseph Flemish, Lumileds LLCZhongmin Ren, Lumileds LLCMark Holmes, Lumileds LLC
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Foster, Geoffrey
Jacobs Inc., Washington DC-
18.15.2023 Characterization of Optically Modulated Semi-Insulating GaN Photoconductive Semiconductor Switches
Geoffrey Foster, Jacobs Inc., Washington DCAndrew Koehler, U. S. Naval Research LaboratoryKarl D. Hobart, U.S. Naval Research LaboratorySadab Mahmud, University of Toledo, Toledo OHSamuel Atwimah, University of Toledo, Toledo OHRaghav Khanna, University of Toledo, Toledo OHTravis J. Anderson, U.S. Naval Research Laboratory
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Fournel, Frank
Univ. Grenoble Alpes-
17.1.2023 Large Diameter Epi-Ready InP on Si (InPOSi) Substrates
Bruno Ghyselen, SOITECFrançois-Xavier Darras, SOITECOdile Mourey, SOITECChristelle Navone, Univ. Grenoble AlpesLoic Sanchez, Univ. Grenoble AlpesChristine Di Nardo, Univ. Grenoble AlpesCarla Crobu, Univ. Grenoble AlpesLaura Toselli, Univ. Grenoble AlpesBaptiste Rousset, Univ. Grenoble AlpesFrédéric Milesi, Univ. Grenoble AlpesLaurence Gabette, Univ. Grenoble AlpesFrank Fournel, Univ. Grenoble AlpesJean Decobert, III-V LabClaire Besancon, III-V LabMickael Martin, Univ. Grenoble AlpesJeremy Moeyaert, Univ. Grenoble AlpesThierry Baron, Univ. Grenoble Alpes
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Fujita, S.
Sumiden Semiconductor Materials Co., Ltd., Sumitomo Electric Industries, Ltd-
17.2.2023 Development of Laser Diode Grade Si-doped 8-inch GaAs Substrates
K. Shibata, Sumiden Semiconductor Materials Co., Ltd.,K. Aoyama, Sumiden Semiconductor Materials Co., Ltd.,M Nishioka, Sumiden Semiconductor Materials Co., Ltd.,K. Hashio, Sumiden Semiconductor Materials Co., Ltd.,F. Adachi, Sumiden Semiconductor Materials Co., Ltd.,S. Fujita, Sumiden Semiconductor Materials Co., Ltd., Sumitomo Electric Industries, LtdYoshiaki Hagi, Sumiden Semiconductor Materials Co., Ltd., Sumitomo Electric Industries, Ltd, ItamiTomonori Morishita, Sumiden Semiconductor Materials Co., Ltd., Sumitomo Electric Industries, Ltd
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Fukunaga, H.
FRIS, Tohoku University-
8.5.2023 Atomic Diffusion Bonding Using AlN and Al2O3 Films
T. Saito, Canon ANELVA CorporationH. Makita, Canon ANELVA CorporationY. Suzuki, Canon ANELVA CorporationY. Kozuka, Canon ANELVA CorporationA. Muraoka, Canon ANELVA CorporationH. Fukunaga, FRIS, Tohoku UniversityM. Uomoto, FRIS, Tohoku UniversityT. Shimatsu, FRIS, Tohoku University
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Gabette, Laurence
Univ. Grenoble Alpes-
17.1.2023 Large Diameter Epi-Ready InP on Si (InPOSi) Substrates
Bruno Ghyselen, SOITECFrançois-Xavier Darras, SOITECOdile Mourey, SOITECChristelle Navone, Univ. Grenoble AlpesLoic Sanchez, Univ. Grenoble AlpesChristine Di Nardo, Univ. Grenoble AlpesCarla Crobu, Univ. Grenoble AlpesLaura Toselli, Univ. Grenoble AlpesBaptiste Rousset, Univ. Grenoble AlpesFrédéric Milesi, Univ. Grenoble AlpesLaurence Gabette, Univ. Grenoble AlpesFrank Fournel, Univ. Grenoble AlpesJean Decobert, III-V LabClaire Besancon, III-V LabMickael Martin, Univ. Grenoble AlpesJeremy Moeyaert, Univ. Grenoble AlpesThierry Baron, Univ. Grenoble Alpes
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Gallagher, James
U.S. Naval Research Laboratory-
9.4.2023 Scalable Manufacturing of Planar, Large-Area 1.2kV and 3.3kV Vertical GaN PiN Diodes
Alan Jacobs, U.S. Naval Research LaboratoryMona Ebrish, NRC Postdoc Fellow Residing at the U.S. Naval Research LaboratoryJames Gallagher, U.S. Naval Research LaboratoryMarko J. Tadjer, U.S. Naval Research LaboratoryJames Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLJennifer K. Hite, Naval Research LaboratoryN. Mahadik, U.S. Naval Research LaboratoryRobert Kaplar, Sandia National Labs, Albuquerque, NMO. Aktas, Sandia National Labs, Albuquerque, NM -
10.5.2023 Accuracy of Machine Learning Models on Predicting the Properties of Vertical GaN Diodes
James Gallagher, U.S. Naval Research LaboratoryMichael A. Mastro, U.S. Naval Research LaboratoryMona Ebrish, Vanderbilt University, Nashville, TNAlan Jacobs, U.S. Naval Research LaboratoryBrendan. P. Gunning, Sandia National Labs, Albuquerque, NMRobert Kaplar, Sandia National Labs, Albuquerque, NM -
11.3.2023 Structural and Electrical Characterization of Schottky Barrier Diodes on 100 mm HVPE β-Ga2O3 Epiwafer Technology
Marko J. Tadjer, U.S. Naval Research LaboratoryJames Gallagher, ASEE Postdoctoral Fellow Residing at NRLN. Mahadik, U.S. Naval Research LaboratoryHannah N. Masten, National Research Council Postdoctoral Fellow, Residing at NRLJames Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLAkito Kuramata, Novel Crystal Technology, Inc
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Gallagher, James
ASEE Postdoctoral Fellow Residing at NRL-
10.5.2023 Accuracy of Machine Learning Models on Predicting the Properties of Vertical GaN Diodes
James Gallagher, U.S. Naval Research LaboratoryMichael A. Mastro, U.S. Naval Research LaboratoryMona Ebrish, Vanderbilt University, Nashville, TNAlan Jacobs, U.S. Naval Research LaboratoryBrendan. P. Gunning, Sandia National Labs, Albuquerque, NMRobert Kaplar, Sandia National Labs, Albuquerque, NM
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Gao, Z.
AIXTRON SE-
7.5.2023 Improving the yield for GaN-on-Si HEMT devices for power applications
D. Fahle, AIXTRON SE GermanyC. Mauder, AIXTRON SEH. Hahn, AIXTRON SEZ. Gao, AIXTRON SENiels Posthuma, ImecStefaan Decoutere, Imec, Leuven, Belgium
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Gedzberg, G.
Coherent Corp. -
Georgiev, Daniel G.
University of Toledo, Toledo OH-
15.5.2023 Scalable Selective Area Doping for Manufacturing of Planar Vertical Power GaN Devices
Alan Jacobs, U.S. Naval Research LaboratoryBoris N. Feigelson, Naval Research LaboratoryJennifer Hite, U.S. Naval Research LaboratoryJoseph Spencer, U.S. Naval Research LaboratoryMarko Tadjer, U.S. Naval Research LaboratoryDaniel G. Georgiev, University of Toledo, Toledo OHRaghav Khanna, University of Toledo, Toledo OHMarko J. Tadjer, U.S. Naval Research LaboratoryTravis J. Anderson, U.S. Naval Research Laboratory
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Ghorbel, V. Aymen
Yole Developpment -
Ghyselen, Bruno
SOITEC-
17.1.2023 Large Diameter Epi-Ready InP on Si (InPOSi) Substrates
Bruno Ghyselen, SOITECFrançois-Xavier Darras, SOITECOdile Mourey, SOITECChristelle Navone, Univ. Grenoble AlpesLoic Sanchez, Univ. Grenoble AlpesChristine Di Nardo, Univ. Grenoble AlpesCarla Crobu, Univ. Grenoble AlpesLaura Toselli, Univ. Grenoble AlpesBaptiste Rousset, Univ. Grenoble AlpesFrédéric Milesi, Univ. Grenoble AlpesLaurence Gabette, Univ. Grenoble AlpesFrank Fournel, Univ. Grenoble AlpesJean Decobert, III-V LabClaire Besancon, III-V LabMickael Martin, Univ. Grenoble AlpesJeremy Moeyaert, Univ. Grenoble AlpesThierry Baron, Univ. Grenoble Alpes
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Gillgrass, Sara
Cardiff University-
14.2.2023 Assessment of 1.3-?m InAs QD Edge-Emitting Lasers Grown on Large Area GaAs Substrates
Sara Gillgrass, Cardiff UniversityCraig Allford, Cardiff UniversityMukul Debnath, IQE plcAndrew Clark, IQE, Cardiff, UKPeter M. Smowton, Cardiff University, IQE plc -
18.4.2023 Characterisation Techniques for On-Wafer Testing of VCSELs in Volume Manufacture
Jack Baker, Cardiff UniversityC. Hentschel, Cardiff UniversityCraig Allford, Cardiff UniversitySara Gillgrass, Cardiff UniversityJ. Iwan Davies, IQE plcSamuel Shutts, Cardiff University. IQE plcPeter M. Smowton, Cardiff University, IQE plc
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Grange, Tarran
KLA Corporation-
18.8.2023 Determining the impact of facet roughness on etched facet InP laser devices operating at telecom wavelengths, making comparisons to theoretical models.
Tristan T. Burman, Cardiff UniversityJash Patel, KLA CorporationHuma Ashraf, KLA Corporation (SPTS Division)Tarran Grange, KLA CorporationSamuel Shutts, Cardiff University. IQE plcPeter M. Smowton, Cardiff University, IQE plc
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Grisafe, G.
Northrop Grumman Mission Center -
Grupen, Matt
Air Force Research Laboratory, Sensors Directorate-
12.2.2023 High Temperature Studies of 140 nm T-gate AlGaN/GaN HEMT Devices
Ahmad Islam, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAAdam Miesle, KBR Inc.Nicholas P. Sepelak, KBR, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAHanwool Lee, KBR Inc.Dennis E. Walker Jr., Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH,N. Miller, Air Force Research LaboratoryMatt Grupen, Air Force Research Laboratory, Sensors DirectorateKyle Liddy, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAAntonio Crespo, Air Force Research Laboratory, Sensors DirectorateGary Hughes, Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OHWenjuan Zhu, University of Illinois, UrbanaKelson Chabak, Air Force Research Laboratory, Sensors DirectorateAndrew J. Green, Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH,
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Gunning, Brendan. P.
Sandia National Labs, Albuquerque, NM-
10.5.2023 Accuracy of Machine Learning Models on Predicting the Properties of Vertical GaN Diodes
James Gallagher, U.S. Naval Research LaboratoryMichael A. Mastro, U.S. Naval Research LaboratoryMona Ebrish, Vanderbilt University, Nashville, TNAlan Jacobs, U.S. Naval Research LaboratoryBrendan. P. Gunning, Sandia National Labs, Albuquerque, NMRobert Kaplar, Sandia National Labs, Albuquerque, NM
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Hagi, Yoshiaki
Sumiden Semiconductor Materials Co., Ltd., Sumitomo Electric Industries, Ltd, Itami-
17.2.2023 Development of Laser Diode Grade Si-doped 8-inch GaAs Substrates
K. Shibata, Sumiden Semiconductor Materials Co., Ltd.,K. Aoyama, Sumiden Semiconductor Materials Co., Ltd.,M Nishioka, Sumiden Semiconductor Materials Co., Ltd.,K. Hashio, Sumiden Semiconductor Materials Co., Ltd.,F. Adachi, Sumiden Semiconductor Materials Co., Ltd.,S. Fujita, Sumiden Semiconductor Materials Co., Ltd., Sumitomo Electric Industries, LtdYoshiaki Hagi, Sumiden Semiconductor Materials Co., Ltd., Sumitomo Electric Industries, Ltd, ItamiTomonori Morishita, Sumiden Semiconductor Materials Co., Ltd., Sumitomo Electric Industries, Ltd
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Hahn, H.
AIXTRON SE -
Hara, K.
Hamamatsu Photonics K.K-
11.5.2023 GaN substrate cut-out process and GaN on GaN device thinning process with laser slicing
A. Tanaka, Institute of Materials and Systems for Sustainability, Nagoya UniversityK. Matsushima, Institute of Materials and Systems for Sustainability, Nagoya UniversityT. Aratani, Hamamatsu Photonics K.KK. Hara, Hamamatsu Photonics K.KD. Kawaguchi, Hamamatsu Photonics K.KH. Watanabe, Institute of Materials and Systems for Sustainability, Nagoya UniversityT. Kanemura, Institute of Materials and Systems for Sustainability, Nagoya UniversityY. Nagasato, MIRISE Technologies CorporationM. Nagaya, MIRISE Technologies CorporationYoshio Honda, Institute of Materials and Systems for Sustainability, Nagoya UniversityA. Wakejima, Nagoya Institute of TechnologyY. Ando, Institute of Materials and Systems for Sustainability, Nagoya UniversityS. Onda, Institute of Materials and Systems for Sustainability, Nagoya UniversityJ. Suda, Institute of Materials and Systems for Sustainability, Nagoya University
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Hashio, K.
Sumiden Semiconductor Materials Co., Ltd.,-
17.2.2023 Development of Laser Diode Grade Si-doped 8-inch GaAs Substrates
K. Shibata, Sumiden Semiconductor Materials Co., Ltd.,K. Aoyama, Sumiden Semiconductor Materials Co., Ltd.,M Nishioka, Sumiden Semiconductor Materials Co., Ltd.,K. Hashio, Sumiden Semiconductor Materials Co., Ltd.,F. Adachi, Sumiden Semiconductor Materials Co., Ltd.,S. Fujita, Sumiden Semiconductor Materials Co., Ltd., Sumitomo Electric Industries, LtdYoshiaki Hagi, Sumiden Semiconductor Materials Co., Ltd., Sumitomo Electric Industries, Ltd, ItamiTomonori Morishita, Sumiden Semiconductor Materials Co., Ltd., Sumitomo Electric Industries, Ltd
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Hasnine, Md
Qorvo Inc-
18.6.2023 The Application of High-Volume Manufacturing Heterogeneous Packaging Technology to Simplify Highly Complex Systems
D. Robertson, Qorvo IncMd Hasnine, Qorvo IncG. Kent, Qorvo IncN. Salazar, Qorvo IncB. Rosario, Qorvo IncS. Morris, Qorvo Inc
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Hassan, A.
COHERENT - INNOViON-
5.1.2023 Isolation in Compound Semiconductors and the Risk of Neutron Generation with Implantation of Light Ions
J. A. Turcaud, Coherent Corp.C. Heckman, COHERENT - INNOViONV. Heckman, COHERENT - INNOViONA. Hassan, COHERENT - INNOViONR. Pong, COHERENT - INNOViONJ. Schuur, Coherent Corp.
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Haung, Chong Rong
Chang Gung University-
18.10.2023 RF and Power Characteristics of AlGaN/AlN/GaN HEMTs on Mn-Doped Freestanding GaN substrate
Chien-Hsian Chao, Chang Gung UniversityHsien-Chin Chiu, Chang Gung UniversityHsiang-Chun Wang, Chang Gung UniversityChong Rong Haung, Chang Gung UniversityChen Kang Chuang, Chang Gung UniversityYang Ching Ho, Chang Gung University
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Hawke, Joshua
Naval Surface Warfare Center Crane -
Heckman, C.
COHERENT - INNOViON-
5.1.2023 Isolation in Compound Semiconductors and the Risk of Neutron Generation with Implantation of Light Ions
J. A. Turcaud, Coherent Corp.C. Heckman, COHERENT - INNOViONV. Heckman, COHERENT - INNOViONA. Hassan, COHERENT - INNOViONR. Pong, COHERENT - INNOViONJ. Schuur, Coherent Corp.
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Heckman, V.
COHERENT - INNOViON-
5.1.2023 Isolation in Compound Semiconductors and the Risk of Neutron Generation with Implantation of Light Ions
J. A. Turcaud, Coherent Corp.C. Heckman, COHERENT - INNOViONV. Heckman, COHERENT - INNOViONA. Hassan, COHERENT - INNOViONR. Pong, COHERENT - INNOViONJ. Schuur, Coherent Corp.
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Hendricks, Nolan S.
Air Force Research Laboratory, Sensors Directorate-
7.3.2023 Scaled ?-Ga2O3 MOSFETs with Pulsed Laser Deposition-Regrown Ohmics
Daniel M. Dryden, KBR, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAHyung Min Jeon, KBR Inc.,Kyle Liddy, Air Force Research LaboratoryAhmad Islam, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USADennis E. Walker Jr., Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH,Jeremiah C. Williams, Air Force Research Laboratory, Sensors DirectorateNicholas P. Sepelak, KBR, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USANolan S. Hendricks, Air Force Research Laboratory, Sensors DirectorateKevin Leedy, Air Force Research Laboratory, Sensors DirectorateKelson Chabak, Air Force Research Laboratory, Sensors DirectorateAndrew J. Green, Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH,
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Hentschel, C.
Cardiff University-
18.4.2023 Characterisation Techniques for On-Wafer Testing of VCSELs in Volume Manufacture
Jack Baker, Cardiff UniversityC. Hentschel, Cardiff UniversityCraig Allford, Cardiff UniversitySara Gillgrass, Cardiff UniversityJ. Iwan Davies, IQE plcSamuel Shutts, Cardiff University. IQE plcPeter M. Smowton, Cardiff University, IQE plc
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Herlocker, Jonathan L.
Tignis, Inc.-
10.4.2023 Learnings from Multiple Implementations of Closed Loop AI/ML Controllers for Semiconductor Manufacturing
Francis A. Ortega, Tignis, Inc.Eric Holzer, Tignis, Inc.Mario Faria, Tignis, Inc.Jonathan L. Herlocker, Tignis, Inc.
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Hilt, Oliver
Ferdinand-Braun-Institut (FBH)-
9.3.2023 Drift Region Epitaxy Development and Characterization for High Blocking Strength and Low Specific Resistance in Vertical GaN Based Devices
Eldad Bahat Treidel, Ferdinand-Braun-Institut (FBH)Frank Brunner, Ferdinand-Braun-Institut (FBH)Enrico Brusaterra, Ferdinand-Braun-Institut (FBH)Mihaela Wolf, Ferdinand-Braun-Institut (FBH)Andreas Thies, Ferdinand-Braun-InstitutJ. Würfl, Ferdinand-Braun-Institut (FBH)Oliver Hilt, Ferdinand-Braun-Institut (FBH)
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Hite, Jennifer
U.S. Naval Research Laboratory-
9.4.2023 Scalable Manufacturing of Planar, Large-Area 1.2kV and 3.3kV Vertical GaN PiN Diodes
Alan Jacobs, U.S. Naval Research LaboratoryMona Ebrish, NRC Postdoc Fellow Residing at the U.S. Naval Research LaboratoryJames Gallagher, U.S. Naval Research LaboratoryMarko J. Tadjer, U.S. Naval Research LaboratoryJames Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLJennifer K. Hite, Naval Research LaboratoryN. Mahadik, U.S. Naval Research LaboratoryRobert Kaplar, Sandia National Labs, Albuquerque, NMO. Aktas, Sandia National Labs, Albuquerque, NM -
11.4.2023 Nanocrystalline Diamond-Capped β-(AlxGa1-x)2O3/Ga2O3 Heterostructure FieldEffect Transistor
Hannah N. Masten, National Research Council Postdoctoral Fellow, Residing at NRLJames Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLTatyana Feygelson, U. S. Naval Research LaboratoryJoseph Spencer, U.S. Naval Research LaboratoryTatyana I. Feygelson, American Society for Engineering Education, United States Naval Research Lab. Universidad Politecnica de MadridJennifer K. Hite, Naval Research LaboratoryDaniel Pennachio, U.S. Naval Research Laboratory, Washington DCAlan Jacobs, U.S. Naval Research LaboratoryBoris Feygelson, U.S. Naval Research LaboratoryKohei Sasaki, Novel Crystal TechnologyAkito Kuramata, Novel Crystal Technology, IncPai-Ying Liao, Purdue UniversityPeide D. Ye, Purdue UniversityBradford Pate, Naval Research LaboratoryTravis J. Anderson, U.S. Naval Research LaboratoryMarko J. Tadjer, U.S. Naval Research Laboratory -
15.5.2023 Scalable Selective Area Doping for Manufacturing of Planar Vertical Power GaN Devices
Alan Jacobs, U.S. Naval Research LaboratoryBoris N. Feigelson, Naval Research LaboratoryJennifer Hite, U.S. Naval Research LaboratoryJoseph Spencer, U.S. Naval Research LaboratoryMarko Tadjer, U.S. Naval Research LaboratoryDaniel G. Georgiev, University of Toledo, Toledo OHRaghav Khanna, University of Toledo, Toledo OHMarko J. Tadjer, U.S. Naval Research LaboratoryTravis J. Anderson, U.S. Naval Research Laboratory
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Ho, Yang Ching
Chang Gung University-
18.10.2023 RF and Power Characteristics of AlGaN/AlN/GaN HEMTs on Mn-Doped Freestanding GaN substrate
Chien-Hsian Chao, Chang Gung UniversityHsien-Chin Chiu, Chang Gung UniversityHsiang-Chun Wang, Chang Gung UniversityChong Rong Haung, Chang Gung UniversityChen Kang Chuang, Chang Gung UniversityYang Ching Ho, Chang Gung University
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Hobart, Karl D.
U.S. Naval Research Laboratory-
8.3.2023 Heterogeneous Integration of Gallium Nitride HEMTs with Single Crystal Diamond Substrates via Micro-transfer Printing for Thermal Management
James Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLAndy Xie, QorvoShawn Mack, U.S. Naval Research LaboratoryD. Scott Katzer, U.S. Naval Research LaboratoryMarko J. Tadjer, U.S. Naval Research LaboratoryTravis J. Anderson, U.S. Naval Research LaboratoryBrian Downey, US Naval Research LaboratoryDavid J Meyer, U.S. Naval Research Laboratory, Washington, DC -
9.4.2023 Scalable Manufacturing of Planar, Large-Area 1.2kV and 3.3kV Vertical GaN PiN Diodes
Alan Jacobs, U.S. Naval Research LaboratoryMona Ebrish, NRC Postdoc Fellow Residing at the U.S. Naval Research LaboratoryJames Gallagher, U.S. Naval Research LaboratoryMarko J. Tadjer, U.S. Naval Research LaboratoryJames Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLJennifer K. Hite, Naval Research LaboratoryN. Mahadik, U.S. Naval Research LaboratoryRobert Kaplar, Sandia National Labs, Albuquerque, NMO. Aktas, Sandia National Labs, Albuquerque, NM -
10.5.2023 Accuracy of Machine Learning Models on Predicting the Properties of Vertical GaN Diodes
James Gallagher, U.S. Naval Research LaboratoryMichael A. Mastro, U.S. Naval Research LaboratoryMona Ebrish, Vanderbilt University, Nashville, TNAlan Jacobs, U.S. Naval Research LaboratoryBrendan. P. Gunning, Sandia National Labs, Albuquerque, NMRobert Kaplar, Sandia National Labs, Albuquerque, NM -
11.4.2023 Nanocrystalline Diamond-Capped β-(AlxGa1-x)2O3/Ga2O3 Heterostructure FieldEffect Transistor
Hannah N. Masten, National Research Council Postdoctoral Fellow, Residing at NRLJames Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLTatyana Feygelson, U. S. Naval Research LaboratoryJoseph Spencer, U.S. Naval Research LaboratoryTatyana I. Feygelson, American Society for Engineering Education, United States Naval Research Lab. Universidad Politecnica de MadridJennifer K. Hite, Naval Research LaboratoryDaniel Pennachio, U.S. Naval Research Laboratory, Washington DCAlan Jacobs, U.S. Naval Research LaboratoryBoris Feygelson, U.S. Naval Research LaboratoryKohei Sasaki, Novel Crystal TechnologyAkito Kuramata, Novel Crystal Technology, IncPai-Ying Liao, Purdue UniversityPeide D. Ye, Purdue UniversityBradford Pate, Naval Research LaboratoryTravis J. Anderson, U.S. Naval Research LaboratoryMarko J. Tadjer, U.S. Naval Research Laboratory -
15.3.2023 Characterization of Nitridated Ga2O3 for GaN-on-Ga2O3 Power Device Applications
Matthew Landi, University of Illinois at Urbana-ChampaignFrank Kelly, University of Illinois at Urbana-ChampaignRiley Vesto, University of Illinois at Urbana-ChampaignMarko J. Tadjer, U.S. Naval Research LaboratoryKyekyoon Kim, University of Illinois at Urbana-Champaign -
15.5.2023 Scalable Selective Area Doping for Manufacturing of Planar Vertical Power GaN Devices
Alan Jacobs, U.S. Naval Research LaboratoryBoris N. Feigelson, Naval Research LaboratoryJennifer Hite, U.S. Naval Research LaboratoryJoseph Spencer, U.S. Naval Research LaboratoryMarko Tadjer, U.S. Naval Research LaboratoryDaniel G. Georgiev, University of Toledo, Toledo OHRaghav Khanna, University of Toledo, Toledo OHMarko J. Tadjer, U.S. Naval Research LaboratoryTravis J. Anderson, U.S. Naval Research Laboratory -
11.3.2023 Structural and Electrical Characterization of Schottky Barrier Diodes on 100 mm HVPE β-Ga2O3 Epiwafer Technology
Marko J. Tadjer, U.S. Naval Research LaboratoryJames Gallagher, ASEE Postdoctoral Fellow Residing at NRLN. Mahadik, U.S. Naval Research LaboratoryHannah N. Masten, National Research Council Postdoctoral Fellow, Residing at NRLJames Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLAkito Kuramata, Novel Crystal Technology, Inc -
18.15.2023 Characterization of Optically Modulated Semi-Insulating GaN Photoconductive Semiconductor Switches
Geoffrey Foster, Jacobs Inc., Washington DCAndrew Koehler, U. S. Naval Research LaboratoryKarl D. Hobart, U.S. Naval Research LaboratorySadab Mahmud, University of Toledo, Toledo OHSamuel Atwimah, University of Toledo, Toledo OHRaghav Khanna, University of Toledo, Toledo OHTravis J. Anderson, U.S. Naval Research Laboratory
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Hohlfeld, Olaf
Infineon Technologies AG-
8.1.2023 Perspective of power module packaging technology
Olaf Hohlfeld, Infineon Technologies AG
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Holmes, Mark
Lumileds LLC-
16.1.2023 Technical and Manufacturing Challenges in MicroLED Processes
Hee Jin Kim, Lumileds LLCRob Armitage, Lumileds LLCJoseph Flemish, Lumileds LLCZhongmin Ren, Lumileds LLCMark Holmes, Lumileds LLC
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Holzer, Eric
Tignis, Inc.-
10.4.2023 Learnings from Multiple Implementations of Closed Loop AI/ML Controllers for Semiconductor Manufacturing
Francis A. Ortega, Tignis, Inc.Eric Holzer, Tignis, Inc.Mario Faria, Tignis, Inc.Jonathan L. Herlocker, Tignis, Inc.
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Honda, Yoshio
Institute of Materials and Systems for Sustainability, Nagoya University -
Hong, Samphy
Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USA-
3.4.2023 Advanced Carbon film for high-voltage power, high-performance SiC devices
Ludovico Megalini, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAYi Zheng, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USARicky Fang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAPratim Palit,, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJinghe Yang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAQintao Zhang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJang Seok Oh, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USABryan Turner, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USASamphy Hong, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJiao Yang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJoseph Lee, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAGopal Prabhu, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAAswin Prathap Pitchiya, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USADavid A. Britz, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USARaghav Sreenivasan, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAStephen Krause, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAMichael Chudzik, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USATamara Fidler, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, GermanyPatrick Schmid, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, GermanyBas Derksema, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, Germany
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Howell, R.
Northrop Grumman (MS), Linthicum, MD -
Hsu, Jia-Wei
PSMC (Fab 8B)-
11.2.2023 High selectivity GaN to AlGaN etching for HEMT devices
Will Worster, Swansea UniversityWill Worster, KLA Corporation (SPTS Division)Richard Barnett, KLA Corporation (SPTS Division)Jih-Wen Chou, PSMC (8” Tech Dev Center)Robin Chistine Hwang, PSMC (8” Tech Dev Center)Yen-Ling Chuang, PSMC (Fab 8B)Jia-Wei Hsu, PSMC (Fab 8B)
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Hsu, Ming-Zheng
Fab Epi, Win Semiconductors Corp.-
17.3.2023 MOCVD 8 inches GaAs HBT Manufacture Evaluation
Tzu-Wei Tseng, Fab Epi, Win Semiconductors Corp.Ching-Che Hung, Fab Epi, Win Semiconductors Corp.Po-Lun Tseng, Fab Epi, Win Semiconductors Corp.Ming-Zheng Hsu, Fab Epi, Win Semiconductors Corp.
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Huang, Chong Rong
Chang Gung University-
18.16.2023 Electrical and Thermal Performance Analysis of AlGaN/GaN HEMT without Voltage-Blocking Buffer Layer Design
Chong Rong Huang, Chang Gung UniversityHsien-Chin Chiu, Chang Gung UniversityChia-Hao Liu, Chang Gung UniversityHsiang-Chun Wang, Chang Gung UniversityChao-Wei Chiu, Chang Gung UniversityHsuan-Ling Kao, Chang Gung University,Chih-Tien Chen, National Chung-Shan Institute of Science and TechnologyKuo-Jen Chang, National Chung-Shan Institute of Science and Technology
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Hugger, Alexander
United Monolithic Semiconductors GmbH, Ulm -
Hughes, Gary
Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH-
12.2.2023 High Temperature Studies of 140 nm T-gate AlGaN/GaN HEMT Devices
Ahmad Islam, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAAdam Miesle, KBR Inc.Nicholas P. Sepelak, KBR, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAHanwool Lee, KBR Inc.Dennis E. Walker Jr., Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH,N. Miller, Air Force Research LaboratoryMatt Grupen, Air Force Research Laboratory, Sensors DirectorateKyle Liddy, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAAntonio Crespo, Air Force Research Laboratory, Sensors DirectorateGary Hughes, Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OHWenjuan Zhu, University of Illinois, UrbanaKelson Chabak, Air Force Research Laboratory, Sensors DirectorateAndrew J. Green, Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH,
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Hung, Ching-Che
Fab Epi, Win Semiconductors Corp.-
17.3.2023 MOCVD 8 inches GaAs HBT Manufacture Evaluation
Tzu-Wei Tseng, Fab Epi, Win Semiconductors Corp.Ching-Che Hung, Fab Epi, Win Semiconductors Corp.Po-Lun Tseng, Fab Epi, Win Semiconductors Corp.Ming-Zheng Hsu, Fab Epi, Win Semiconductors Corp.
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Hwang, Robin Chistine
PSMC (8” Tech Dev Center)-
11.2.2023 High selectivity GaN to AlGaN etching for HEMT devices
Will Worster, Swansea UniversityWill Worster, KLA Corporation (SPTS Division)Richard Barnett, KLA Corporation (SPTS Division)Jih-Wen Chou, PSMC (8” Tech Dev Center)Robin Chistine Hwang, PSMC (8” Tech Dev Center)Yen-Ling Chuang, PSMC (Fab 8B)Jia-Wei Hsu, PSMC (Fab 8B)
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Islam, Ahmad
Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USA-
7.3.2023 Scaled ?-Ga2O3 MOSFETs with Pulsed Laser Deposition-Regrown Ohmics
Daniel M. Dryden, KBR, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAHyung Min Jeon, KBR Inc.,Kyle Liddy, Air Force Research LaboratoryAhmad Islam, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USADennis E. Walker Jr., Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH,Jeremiah C. Williams, Air Force Research Laboratory, Sensors DirectorateNicholas P. Sepelak, KBR, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USANolan S. Hendricks, Air Force Research Laboratory, Sensors DirectorateKevin Leedy, Air Force Research Laboratory, Sensors DirectorateKelson Chabak, Air Force Research Laboratory, Sensors DirectorateAndrew J. Green, Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH, -
12.2.2023 High Temperature Studies of 140 nm T-gate AlGaN/GaN HEMT Devices
Ahmad Islam, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAAdam Miesle, KBR Inc.Nicholas P. Sepelak, KBR, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAHanwool Lee, KBR Inc.Dennis E. Walker Jr., Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH,N. Miller, Air Force Research LaboratoryMatt Grupen, Air Force Research Laboratory, Sensors DirectorateKyle Liddy, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAAntonio Crespo, Air Force Research Laboratory, Sensors DirectorateGary Hughes, Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OHWenjuan Zhu, University of Illinois, UrbanaKelson Chabak, Air Force Research Laboratory, Sensors DirectorateAndrew J. Green, Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH,
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Ito, Taichi
Precious Metals Materials Division, Matsuda Sangyo Co., Ltd.-
5.4.2023 Gold-Assisted Deposition of a Material with Low Spitting by a New Carbon Removal Process
Taichi Ito, Precious Metals Materials Division, Matsuda Sangyo Co., Ltd.Kiyofumi Kodera, Precious Metals Materials Division, Matsuda Sangyo Co., Ltd.Yuichiro Shindo, Matsuda Sangyo Co., Ltd.
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J Meyer, David
U.S. Naval Research Laboratory, Washington, DC-
8.3.2023 Heterogeneous Integration of Gallium Nitride HEMTs with Single Crystal Diamond Substrates via Micro-transfer Printing for Thermal Management
James Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLAndy Xie, QorvoShawn Mack, U.S. Naval Research LaboratoryD. Scott Katzer, U.S. Naval Research LaboratoryMarko J. Tadjer, U.S. Naval Research LaboratoryTravis J. Anderson, U.S. Naval Research LaboratoryBrian Downey, US Naval Research LaboratoryDavid J Meyer, U.S. Naval Research Laboratory, Washington, DC
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J. Green, Andrew
Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH, -
Jacobs, Alan
U.S. Naval Research Laboratory-
9.4.2023 Scalable Manufacturing of Planar, Large-Area 1.2kV and 3.3kV Vertical GaN PiN Diodes
Alan Jacobs, U.S. Naval Research LaboratoryMona Ebrish, NRC Postdoc Fellow Residing at the U.S. Naval Research LaboratoryJames Gallagher, U.S. Naval Research LaboratoryMarko J. Tadjer, U.S. Naval Research LaboratoryJames Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLJennifer K. Hite, Naval Research LaboratoryN. Mahadik, U.S. Naval Research LaboratoryRobert Kaplar, Sandia National Labs, Albuquerque, NMO. Aktas, Sandia National Labs, Albuquerque, NM -
10.5.2023 Accuracy of Machine Learning Models on Predicting the Properties of Vertical GaN Diodes
James Gallagher, U.S. Naval Research LaboratoryMichael A. Mastro, U.S. Naval Research LaboratoryMona Ebrish, Vanderbilt University, Nashville, TNAlan Jacobs, U.S. Naval Research LaboratoryBrendan. P. Gunning, Sandia National Labs, Albuquerque, NMRobert Kaplar, Sandia National Labs, Albuquerque, NM -
11.4.2023 Nanocrystalline Diamond-Capped β-(AlxGa1-x)2O3/Ga2O3 Heterostructure FieldEffect Transistor
Hannah N. Masten, National Research Council Postdoctoral Fellow, Residing at NRLJames Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLTatyana Feygelson, U. S. Naval Research LaboratoryJoseph Spencer, U.S. Naval Research LaboratoryTatyana I. Feygelson, American Society for Engineering Education, United States Naval Research Lab. Universidad Politecnica de MadridJennifer K. Hite, Naval Research LaboratoryDaniel Pennachio, U.S. Naval Research Laboratory, Washington DCAlan Jacobs, U.S. Naval Research LaboratoryBoris Feygelson, U.S. Naval Research LaboratoryKohei Sasaki, Novel Crystal TechnologyAkito Kuramata, Novel Crystal Technology, IncPai-Ying Liao, Purdue UniversityPeide D. Ye, Purdue UniversityBradford Pate, Naval Research LaboratoryTravis J. Anderson, U.S. Naval Research LaboratoryMarko J. Tadjer, U.S. Naval Research Laboratory -
15.5.2023 Scalable Selective Area Doping for Manufacturing of Planar Vertical Power GaN Devices
Alan Jacobs, U.S. Naval Research LaboratoryBoris N. Feigelson, Naval Research LaboratoryJennifer Hite, U.S. Naval Research LaboratoryJoseph Spencer, U.S. Naval Research LaboratoryMarko Tadjer, U.S. Naval Research LaboratoryDaniel G. Georgiev, University of Toledo, Toledo OHRaghav Khanna, University of Toledo, Toledo OHMarko J. Tadjer, U.S. Naval Research LaboratoryTravis J. Anderson, U.S. Naval Research Laboratory
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Jaffal, Ali
Yole Group-
13.3.2023 The Dawn of The InP Market in Consumer Applications
Ali Jaffal, Yole GroupP. Chiu, Yole Developpement, FranceM. Vallo, Yole DeveloppmentE. Dogmus, Yole Developpement, FranceC. Troadec, Yole Developpement, France
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Jalan, Bharat
University of Minnesota, Minneapolis, MN 55455, USA-
7.2.2023 Fabrication and Analysis of β-Ga2O3 Schottky Diodes with Drift Layer Grown by MOCVD on (001) Substrate
Prakash P. Sundaram, University of Minnesota, Minneapolis, MN 55455, USAFengdeng Liu, University of Minnesota, Minneapolis, MN 55455, USAFikadu Alema, Agnitron Technology Incorporated, Chanhassen, MN 55317, USAAndrei Osinsky, Agnitron Technology Incorporated, Chanhassen, MN 55317, USABharat Jalan, University of Minnesota, Minneapolis, MN 55455, USASteven J. Koester, University of Minnesota, Minneapolis, MN 55455, USA
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Jeon, Hyung Min
KBR Inc.,-
7.3.2023 Scaled ?-Ga2O3 MOSFETs with Pulsed Laser Deposition-Regrown Ohmics
Daniel M. Dryden, KBR, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAHyung Min Jeon, KBR Inc.,Kyle Liddy, Air Force Research LaboratoryAhmad Islam, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USADennis E. Walker Jr., Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH,Jeremiah C. Williams, Air Force Research Laboratory, Sensors DirectorateNicholas P. Sepelak, KBR, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USANolan S. Hendricks, Air Force Research Laboratory, Sensors DirectorateKevin Leedy, Air Force Research Laboratory, Sensors DirectorateKelson Chabak, Air Force Research Laboratory, Sensors DirectorateAndrew J. Green, Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH,
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Jin, Jinman
Wavice Inc.-
1.4.2023 Production of High-Reliability 150mm GaN HEMT for 5G Base Station
Kazuaki Matsuura, Sumitomo Electric Device Innovations USAT. Watanabe, Sumitomo Electric Device Innovations JapanT. Kosaka, Sumitomo Electric Device Innovations, JapanS. Kitajima, Sumitomo Electric Device Innovations, JapanP. Mushini, Coherent Corp.J. Bellotti, Coherent Corp.G. Gedzberg, Coherent Corp.
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Jin Kim, Hee
Lumileds LLC-
16.1.2023 Technical and Manufacturing Challenges in MicroLED Processes
Hee Jin Kim, Lumileds LLCRob Armitage, Lumileds LLCJoseph Flemish, Lumileds LLCZhongmin Ren, Lumileds LLCMark Holmes, Lumileds LLC
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Jo, Hyeon-Bhin
School of Electronic and Electrical Engineering, Kyungpook National University-
2.5.2023 Lg = 25 nm In0.8Ga0.2As/In0.52Al0.48As High-Electron Mobility Transistors on InP Substrate with Both fT and fmax in Excess of 700 GHz
In-Geun Lee, Kyungpook National UniversityHyeon-Bhin Jo, School of Electronic and Electrical Engineering, Kyungpook National UniversityWan-Soo Park, Kyungpook National UniversityJi-Hoon Yoo, School of Electronic and Electrical Engineering, Kyungpook National UniversityJacob Yun, QSITed Kim, QSITakuya Tsutsumi, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaHiroki Sugiyama, NTT Device Technology Laboratories, NTT Corporation, Kanagawa, JapanJae-Hak Lee, Kyungpook National UniversityDae-Hyun Kim, Kyungpook National University -
18.14.2023 A new methodology to extract saturation velocity of In0.53Ga0.47As QW HEMTs
Hyo-Jin Kim, Kyungpook National UniversityJi-Hoon Yoo, School of Electronic and Electrical Engineering, Kyungpook National UniversityWan-Soo Park, Kyungpook National UniversityHyeon-Bhin Jo, School of Electronic and Electrical Engineering, Kyungpook National UniversityIn-Geun Lee, Kyungpook National UniversityTae-Woo Kim, University of Ulsan, Ulsan, South KoreaSang-Kuk Kim, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaYong-Hyun Kim, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaJacob Yun, QSITed Kim, QSITakuya Tsutsumi, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaHiroki Sugiyama, NTT Device Technology Laboratories, NTT Corporation, Kanagawa, JapanHideaki Matsuzaki, NTT Device Technology Laboratories, NTT Corporation, Kanagawa, JapanJae-Hak Lee, Kyungpook National UniversityDae-Hyun Kim, Kyungpook National University
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Josse, E.
STMicroelectronics-
14.1.2023 Colloidal Quantum Dot Image Sensor Technology
Jonathan Steckel, ST MicroelectronicsJ. Arnaud, STMicroelectronicsA. G. Pattantyus-Abraham, STMicroelectronicsA, Singh, STMicroelectronicsE. Josse, STMicroelectronicsM. Bidaud, STMicroelectronicsJ. Meitzner, STMicroelectronicsM. Sarmiento, STMicroelectronicsA. Arnaud, STMicroelectronicsE. Mazeleyrat, STMicroelectronicsH. Wehbe-Alause, STMicroelectronicsK. Rochereau, STMicroelectronics
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Jung, Hyeyoung
Wavice Inc.,-
4.3.2023 GaN based 2-stage Wide Band Doherty PA for 3.4-3.8 GHz Using Hybrid Integration with IPDs on HPSI SiC Substrate
Sangmin Lee, Wavice Inc.: Now with Global Communication Semiconductors LLC, Torrance, CAJinman Jin, Wavice Inc.Inseop Kim, Wavice Inc.,Hyeyoung Jung, Wavice Inc.,Seo Koo, Soonchunhyang University, KoreaDal Ahn, Soonchunhyang University, Korea
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K. Hite, Jennifer
Naval Research Laboratory-
9.4.2023 Scalable Manufacturing of Planar, Large-Area 1.2kV and 3.3kV Vertical GaN PiN Diodes
Alan Jacobs, U.S. Naval Research LaboratoryMona Ebrish, NRC Postdoc Fellow Residing at the U.S. Naval Research LaboratoryJames Gallagher, U.S. Naval Research LaboratoryMarko J. Tadjer, U.S. Naval Research LaboratoryJames Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLJennifer K. Hite, Naval Research LaboratoryN. Mahadik, U.S. Naval Research LaboratoryRobert Kaplar, Sandia National Labs, Albuquerque, NMO. Aktas, Sandia National Labs, Albuquerque, NM -
15.5.2023 Scalable Selective Area Doping for Manufacturing of Planar Vertical Power GaN Devices
Alan Jacobs, U.S. Naval Research LaboratoryBoris N. Feigelson, Naval Research LaboratoryJennifer Hite, U.S. Naval Research LaboratoryJoseph Spencer, U.S. Naval Research LaboratoryMarko Tadjer, U.S. Naval Research LaboratoryDaniel G. Georgiev, University of Toledo, Toledo OHRaghav Khanna, University of Toledo, Toledo OHMarko J. Tadjer, U.S. Naval Research LaboratoryTravis J. Anderson, U.S. Naval Research Laboratory
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K. Tiku, Shiban
Skyworks Solutions, Inc. -
Kaempf, Mathias
OSRAM Group, Regensburg, Germany-
3.1.2023 Plasma Dicing of thin-film LEDs
Heribert Zull, OSRAM Group, Regensburg, GermanyMahsa Norouzi Kalkani, OSRAM Group, Regensburg, GermanyStelio Correia, OSRAM Group, Regensburg, GermanyMathias Kaempf, OSRAM Group, Regensburg, GermanyMartin Strassburg, OSRAM Group, Regensburg, Germany
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Kalra, Nitin
BAE Systems-
18.2.2023 Photoresist Softbake Oven Qualification
Nitin Kalra, BAE SystemsJames Mortellaro, BAE Systems Inc.James Martel, BAE Systems Inc.Xiaoping Yang, BAE Systems Inc.
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Kanemura, T.
Institute of Materials and Systems for Sustainability, Nagoya University-
11.5.2023 GaN substrate cut-out process and GaN on GaN device thinning process with laser slicing
A. Tanaka, Institute of Materials and Systems for Sustainability, Nagoya UniversityK. Matsushima, Institute of Materials and Systems for Sustainability, Nagoya UniversityT. Aratani, Hamamatsu Photonics K.KK. Hara, Hamamatsu Photonics K.KD. Kawaguchi, Hamamatsu Photonics K.KH. Watanabe, Institute of Materials and Systems for Sustainability, Nagoya UniversityT. Kanemura, Institute of Materials and Systems for Sustainability, Nagoya UniversityY. Nagasato, MIRISE Technologies CorporationM. Nagaya, MIRISE Technologies CorporationYoshio Honda, Institute of Materials and Systems for Sustainability, Nagoya UniversityA. Wakejima, Nagoya Institute of TechnologyY. Ando, Institute of Materials and Systems for Sustainability, Nagoya UniversityS. Onda, Institute of Materials and Systems for Sustainability, Nagoya UniversityJ. Suda, Institute of Materials and Systems for Sustainability, Nagoya University
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Kang, Gyuhyeok
Kumoh National Institute of Technology-
18.13.2023 Design and Optimization of 1.2 kV SiC Trench MOSFETs Using a Tilted Ion Implantation Process for High Breakdown Voltage
Yeongeun Park, Kumoh National Institute of TechnologyHyowon Yoon, Kumoh National Institute of TechnologyChaeyun Kim, Kumoh National Institute of TechnologyGyuhyeok Kang, Kumoh National Institute of TechnologyOgyun Seok, Kumoh National Institute of Technology
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Kao, Hsuan-Ling
Chang Gung University, -
Kaplar, Robert
Sandia National Labs, Albuquerque, NM-
9.4.2023 Scalable Manufacturing of Planar, Large-Area 1.2kV and 3.3kV Vertical GaN PiN Diodes
Alan Jacobs, U.S. Naval Research LaboratoryMona Ebrish, NRC Postdoc Fellow Residing at the U.S. Naval Research LaboratoryJames Gallagher, U.S. Naval Research LaboratoryMarko J. Tadjer, U.S. Naval Research LaboratoryJames Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLJennifer K. Hite, Naval Research LaboratoryN. Mahadik, U.S. Naval Research LaboratoryRobert Kaplar, Sandia National Labs, Albuquerque, NMO. Aktas, Sandia National Labs, Albuquerque, NM -
10.5.2023 Accuracy of Machine Learning Models on Predicting the Properties of Vertical GaN Diodes
James Gallagher, U.S. Naval Research LaboratoryMichael A. Mastro, U.S. Naval Research LaboratoryMona Ebrish, Vanderbilt University, Nashville, TNAlan Jacobs, U.S. Naval Research LaboratoryBrendan. P. Gunning, Sandia National Labs, Albuquerque, NMRobert Kaplar, Sandia National Labs, Albuquerque, NM
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Kashyap, A.
Renesas Electronics America, CA, USA-
6.3.2023 Power Semiconductor Considerations for xEV applications
D. Risbud, Renesas Electronics America, CA, USAA. Kashyap, Renesas Electronics America, CA, USA
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Kawaguchi, D.
Hamamatsu Photonics K.K-
11.5.2023 GaN substrate cut-out process and GaN on GaN device thinning process with laser slicing
A. Tanaka, Institute of Materials and Systems for Sustainability, Nagoya UniversityK. Matsushima, Institute of Materials and Systems for Sustainability, Nagoya UniversityT. Aratani, Hamamatsu Photonics K.KK. Hara, Hamamatsu Photonics K.KD. Kawaguchi, Hamamatsu Photonics K.KH. Watanabe, Institute of Materials and Systems for Sustainability, Nagoya UniversityT. Kanemura, Institute of Materials and Systems for Sustainability, Nagoya UniversityY. Nagasato, MIRISE Technologies CorporationM. Nagaya, MIRISE Technologies CorporationYoshio Honda, Institute of Materials and Systems for Sustainability, Nagoya UniversityA. Wakejima, Nagoya Institute of TechnologyY. Ando, Institute of Materials and Systems for Sustainability, Nagoya UniversityS. Onda, Institute of Materials and Systems for Sustainability, Nagoya UniversityJ. Suda, Institute of Materials and Systems for Sustainability, Nagoya University
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Kelly, Frank
University of Illinois at Urbana-Champaign-
15.3.2023 Characterization of Nitridated Ga2O3 for GaN-on-Ga2O3 Power Device Applications
Matthew Landi, University of Illinois at Urbana-ChampaignFrank Kelly, University of Illinois at Urbana-ChampaignRiley Vesto, University of Illinois at Urbana-ChampaignMarko J. Tadjer, U.S. Naval Research LaboratoryKyekyoon Kim, University of Illinois at Urbana-Champaign
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Kent, G.
Qorvo Inc-
18.6.2023 The Application of High-Volume Manufacturing Heterogeneous Packaging Technology to Simplify Highly Complex Systems
D. Robertson, Qorvo IncMd Hasnine, Qorvo IncG. Kent, Qorvo IncN. Salazar, Qorvo IncB. Rosario, Qorvo IncS. Morris, Qorvo Inc
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Khanna, Raghav
University of Toledo, Toledo OH-
15.5.2023 Scalable Selective Area Doping for Manufacturing of Planar Vertical Power GaN Devices
Alan Jacobs, U.S. Naval Research LaboratoryBoris N. Feigelson, Naval Research LaboratoryJennifer Hite, U.S. Naval Research LaboratoryJoseph Spencer, U.S. Naval Research LaboratoryMarko Tadjer, U.S. Naval Research LaboratoryDaniel G. Georgiev, University of Toledo, Toledo OHRaghav Khanna, University of Toledo, Toledo OHMarko J. Tadjer, U.S. Naval Research LaboratoryTravis J. Anderson, U.S. Naval Research Laboratory -
18.15.2023 Characterization of Optically Modulated Semi-Insulating GaN Photoconductive Semiconductor Switches
Geoffrey Foster, Jacobs Inc., Washington DCAndrew Koehler, U. S. Naval Research LaboratoryKarl D. Hobart, U.S. Naval Research LaboratorySadab Mahmud, University of Toledo, Toledo OHSamuel Atwimah, University of Toledo, Toledo OHRaghav Khanna, University of Toledo, Toledo OHTravis J. Anderson, U.S. Naval Research Laboratory
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Kim, Chaeyun
Kumoh National Institute of Technology-
12.4.2023 Analysis of the effects of Gamma-ray irradiation on SiC MOSFETs
Chaeyun Kim, Kumoh National Institute of TechnologyHyowon Yoon, Kumoh National Institute of TechnologyYeongeun Park, Kumoh National Institute of TechnologyDong-Seok Kim, Korea Atomic Energy Research Institute, Republic of KoreaOgyun Seok, Kumoh National Institute of Technology -
18.13.2023 Design and Optimization of 1.2 kV SiC Trench MOSFETs Using a Tilted Ion Implantation Process for High Breakdown Voltage
Yeongeun Park, Kumoh National Institute of TechnologyHyowon Yoon, Kumoh National Institute of TechnologyChaeyun Kim, Kumoh National Institute of TechnologyGyuhyeok Kang, Kumoh National Institute of TechnologyOgyun Seok, Kumoh National Institute of Technology
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Kim, Dae-Hyun
Kyungpook National University-
2.5.2023 Lg = 25 nm In0.8Ga0.2As/In0.52Al0.48As High-Electron Mobility Transistors on InP Substrate with Both fT and fmax in Excess of 700 GHz
In-Geun Lee, Kyungpook National UniversityHyeon-Bhin Jo, School of Electronic and Electrical Engineering, Kyungpook National UniversityWan-Soo Park, Kyungpook National UniversityJi-Hoon Yoo, School of Electronic and Electrical Engineering, Kyungpook National UniversityJacob Yun, QSITed Kim, QSITakuya Tsutsumi, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaHiroki Sugiyama, NTT Device Technology Laboratories, NTT Corporation, Kanagawa, JapanJae-Hak Lee, Kyungpook National UniversityDae-Hyun Kim, Kyungpook National University -
18.12.2023 Analytical model for the source resistance in advanced InxGa1-xAs/In0.52Al0.48As quantum-well high-electron-mobility transistors
Ji-Hoon Yoo, School of Electronic and Electrical Engineering, Kyungpook National UniversityJae-Hak Lee, Kyungpook National UniversityYong-Hyun Kim, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaSang-Kuk Kim, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaJacob Yun, QSITed Kim, QSIIn-Geun Lee, Kyungpook National UniversityDae-Hyun Kim, Kyungpook National University -
18.14.2023 A new methodology to extract saturation velocity of In0.53Ga0.47As QW HEMTs
Hyo-Jin Kim, Kyungpook National UniversityJi-Hoon Yoo, School of Electronic and Electrical Engineering, Kyungpook National UniversityWan-Soo Park, Kyungpook National UniversityHyeon-Bhin Jo, School of Electronic and Electrical Engineering, Kyungpook National UniversityIn-Geun Lee, Kyungpook National UniversityTae-Woo Kim, University of Ulsan, Ulsan, South KoreaSang-Kuk Kim, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaYong-Hyun Kim, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaJacob Yun, QSITed Kim, QSITakuya Tsutsumi, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaHiroki Sugiyama, NTT Device Technology Laboratories, NTT Corporation, Kanagawa, JapanHideaki Matsuzaki, NTT Device Technology Laboratories, NTT Corporation, Kanagawa, JapanJae-Hak Lee, Kyungpook National UniversityDae-Hyun Kim, Kyungpook National University
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Kim, Dong-Seok
Korea Atomic Energy Research Institute, Republic of Korea-
12.4.2023 Analysis of the effects of Gamma-ray irradiation on SiC MOSFETs
Chaeyun Kim, Kumoh National Institute of TechnologyHyowon Yoon, Kumoh National Institute of TechnologyYeongeun Park, Kumoh National Institute of TechnologyDong-Seok Kim, Korea Atomic Energy Research Institute, Republic of KoreaOgyun Seok, Kumoh National Institute of Technology
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Kim, Dongyoung
University of New York Polytechnic Institute Colleges of Nanoscale Science and Engineering-
12.5.2023 Short-circuit Failure Mechanisms of 1.2 kV 4H-SiC MOSFETs under Different Drain Voltages
Dongyoung Kim, University of New York Polytechnic Institute Colleges of Nanoscale Science and EngineeringWoongje Sung, University of New York Polytechnic Institute Colleges of Nanoscale Science and Engineering
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Kim, Hyo-Jin
Kyungpook National University-
18.14.2023 A new methodology to extract saturation velocity of In0.53Ga0.47As QW HEMTs
Hyo-Jin Kim, Kyungpook National UniversityJi-Hoon Yoo, School of Electronic and Electrical Engineering, Kyungpook National UniversityWan-Soo Park, Kyungpook National UniversityHyeon-Bhin Jo, School of Electronic and Electrical Engineering, Kyungpook National UniversityIn-Geun Lee, Kyungpook National UniversityTae-Woo Kim, University of Ulsan, Ulsan, South KoreaSang-Kuk Kim, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaYong-Hyun Kim, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaJacob Yun, QSITed Kim, QSITakuya Tsutsumi, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaHiroki Sugiyama, NTT Device Technology Laboratories, NTT Corporation, Kanagawa, JapanHideaki Matsuzaki, NTT Device Technology Laboratories, NTT Corporation, Kanagawa, JapanJae-Hak Lee, Kyungpook National UniversityDae-Hyun Kim, Kyungpook National University
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Kim, Inseop
Wavice Inc.,-
4.3.2023 GaN based 2-stage Wide Band Doherty PA for 3.4-3.8 GHz Using Hybrid Integration with IPDs on HPSI SiC Substrate
Sangmin Lee, Wavice Inc.: Now with Global Communication Semiconductors LLC, Torrance, CAJinman Jin, Wavice Inc.Inseop Kim, Wavice Inc.,Hyeyoung Jung, Wavice Inc.,Seo Koo, Soonchunhyang University, KoreaDal Ahn, Soonchunhyang University, Korea
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Kim, Kyekyoon
University of Illinois at Urbana-Champaign-
15.3.2023 Characterization of Nitridated Ga2O3 for GaN-on-Ga2O3 Power Device Applications
Matthew Landi, University of Illinois at Urbana-ChampaignFrank Kelly, University of Illinois at Urbana-ChampaignRiley Vesto, University of Illinois at Urbana-ChampaignMarko J. Tadjer, U.S. Naval Research LaboratoryKyekyoon Kim, University of Illinois at Urbana-Champaign
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Kim, Sang-Kuk
QSI, Cheon-An, Kyunggi-do, 31044, South Korea-
18.12.2023 Analytical model for the source resistance in advanced InxGa1-xAs/In0.52Al0.48As quantum-well high-electron-mobility transistors
Ji-Hoon Yoo, School of Electronic and Electrical Engineering, Kyungpook National UniversityJae-Hak Lee, Kyungpook National UniversityYong-Hyun Kim, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaSang-Kuk Kim, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaJacob Yun, QSITed Kim, QSIIn-Geun Lee, Kyungpook National UniversityDae-Hyun Kim, Kyungpook National University -
18.14.2023 A new methodology to extract saturation velocity of In0.53Ga0.47As QW HEMTs
Hyo-Jin Kim, Kyungpook National UniversityJi-Hoon Yoo, School of Electronic and Electrical Engineering, Kyungpook National UniversityWan-Soo Park, Kyungpook National UniversityHyeon-Bhin Jo, School of Electronic and Electrical Engineering, Kyungpook National UniversityIn-Geun Lee, Kyungpook National UniversityTae-Woo Kim, University of Ulsan, Ulsan, South KoreaSang-Kuk Kim, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaYong-Hyun Kim, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaJacob Yun, QSITed Kim, QSITakuya Tsutsumi, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaHiroki Sugiyama, NTT Device Technology Laboratories, NTT Corporation, Kanagawa, JapanHideaki Matsuzaki, NTT Device Technology Laboratories, NTT Corporation, Kanagawa, JapanJae-Hak Lee, Kyungpook National UniversityDae-Hyun Kim, Kyungpook National University
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Kim, Tae-Woo
University of Ulsan, Ulsan, South Korea-
2.5.2023 Lg = 25 nm In0.8Ga0.2As/In0.52Al0.48As High-Electron Mobility Transistors on InP Substrate with Both fT and fmax in Excess of 700 GHz
In-Geun Lee, Kyungpook National UniversityHyeon-Bhin Jo, School of Electronic and Electrical Engineering, Kyungpook National UniversityWan-Soo Park, Kyungpook National UniversityJi-Hoon Yoo, School of Electronic and Electrical Engineering, Kyungpook National UniversityJacob Yun, QSITed Kim, QSITakuya Tsutsumi, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaHiroki Sugiyama, NTT Device Technology Laboratories, NTT Corporation, Kanagawa, JapanJae-Hak Lee, Kyungpook National UniversityDae-Hyun Kim, Kyungpook National University -
18.14.2023 A new methodology to extract saturation velocity of In0.53Ga0.47As QW HEMTs
Hyo-Jin Kim, Kyungpook National UniversityJi-Hoon Yoo, School of Electronic and Electrical Engineering, Kyungpook National UniversityWan-Soo Park, Kyungpook National UniversityHyeon-Bhin Jo, School of Electronic and Electrical Engineering, Kyungpook National UniversityIn-Geun Lee, Kyungpook National UniversityTae-Woo Kim, University of Ulsan, Ulsan, South KoreaSang-Kuk Kim, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaYong-Hyun Kim, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaJacob Yun, QSITed Kim, QSITakuya Tsutsumi, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaHiroki Sugiyama, NTT Device Technology Laboratories, NTT Corporation, Kanagawa, JapanHideaki Matsuzaki, NTT Device Technology Laboratories, NTT Corporation, Kanagawa, JapanJae-Hak Lee, Kyungpook National UniversityDae-Hyun Kim, Kyungpook National University
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Kim, Ted
QSI-
2.5.2023 Lg = 25 nm In0.8Ga0.2As/In0.52Al0.48As High-Electron Mobility Transistors on InP Substrate with Both fT and fmax in Excess of 700 GHz
In-Geun Lee, Kyungpook National UniversityHyeon-Bhin Jo, School of Electronic and Electrical Engineering, Kyungpook National UniversityWan-Soo Park, Kyungpook National UniversityJi-Hoon Yoo, School of Electronic and Electrical Engineering, Kyungpook National UniversityJacob Yun, QSITed Kim, QSITakuya Tsutsumi, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaHiroki Sugiyama, NTT Device Technology Laboratories, NTT Corporation, Kanagawa, JapanJae-Hak Lee, Kyungpook National UniversityDae-Hyun Kim, Kyungpook National University -
18.12.2023 Analytical model for the source resistance in advanced InxGa1-xAs/In0.52Al0.48As quantum-well high-electron-mobility transistors
Ji-Hoon Yoo, School of Electronic and Electrical Engineering, Kyungpook National UniversityJae-Hak Lee, Kyungpook National UniversityYong-Hyun Kim, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaSang-Kuk Kim, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaJacob Yun, QSITed Kim, QSIIn-Geun Lee, Kyungpook National UniversityDae-Hyun Kim, Kyungpook National University -
18.14.2023 A new methodology to extract saturation velocity of In0.53Ga0.47As QW HEMTs
Hyo-Jin Kim, Kyungpook National UniversityJi-Hoon Yoo, School of Electronic and Electrical Engineering, Kyungpook National UniversityWan-Soo Park, Kyungpook National UniversityHyeon-Bhin Jo, School of Electronic and Electrical Engineering, Kyungpook National UniversityIn-Geun Lee, Kyungpook National UniversityTae-Woo Kim, University of Ulsan, Ulsan, South KoreaSang-Kuk Kim, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaYong-Hyun Kim, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaJacob Yun, QSITed Kim, QSITakuya Tsutsumi, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaHiroki Sugiyama, NTT Device Technology Laboratories, NTT Corporation, Kanagawa, JapanHideaki Matsuzaki, NTT Device Technology Laboratories, NTT Corporation, Kanagawa, JapanJae-Hak Lee, Kyungpook National UniversityDae-Hyun Kim, Kyungpook National University
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Kim, Yong-Hyun
QSI, Cheon-An, Kyunggi-do, 31044, South Korea-
18.12.2023 Analytical model for the source resistance in advanced InxGa1-xAs/In0.52Al0.48As quantum-well high-electron-mobility transistors
Ji-Hoon Yoo, School of Electronic and Electrical Engineering, Kyungpook National UniversityJae-Hak Lee, Kyungpook National UniversityYong-Hyun Kim, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaSang-Kuk Kim, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaJacob Yun, QSITed Kim, QSIIn-Geun Lee, Kyungpook National UniversityDae-Hyun Kim, Kyungpook National University -
18.14.2023 A new methodology to extract saturation velocity of In0.53Ga0.47As QW HEMTs
Hyo-Jin Kim, Kyungpook National UniversityJi-Hoon Yoo, School of Electronic and Electrical Engineering, Kyungpook National UniversityWan-Soo Park, Kyungpook National UniversityHyeon-Bhin Jo, School of Electronic and Electrical Engineering, Kyungpook National UniversityIn-Geun Lee, Kyungpook National UniversityTae-Woo Kim, University of Ulsan, Ulsan, South KoreaSang-Kuk Kim, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaYong-Hyun Kim, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaJacob Yun, QSITed Kim, QSITakuya Tsutsumi, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaHiroki Sugiyama, NTT Device Technology Laboratories, NTT Corporation, Kanagawa, JapanHideaki Matsuzaki, NTT Device Technology Laboratories, NTT Corporation, Kanagawa, JapanJae-Hak Lee, Kyungpook National UniversityDae-Hyun Kim, Kyungpook National University
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King, Casey
Teledyne Scientific Company-
4.2.2023 Design and Fabrication of Millimeter-Wave GaN HEMTs
Keisuke Shinohara, Teledyne Scientific CompanyDean Regan, Teledyne Scientific CompanyCasey King, Teledyne Scientific CompanyEric Regan, Teledyne Scientific CompanyPetra Rowell, Teledyne Scientific CompanyAndrea Arias, Teledyne Scientific CompanyAndrew Carter, Teledyne Scientific CompanyJoshua Bergman, Teledyne Scientific CompanyMiguel Urteaga, Teledyne Scientific CompanyBerinder Brar, Teledyne Scientific Company
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Kitajima, S.
Sumitomo Electric Device Innovations, Japan -
Kodera, Kiyofumi
Precious Metals Materials Division, Matsuda Sangyo Co., Ltd.-
5.4.2023 Gold-Assisted Deposition of a Material with Low Spitting by a New Carbon Removal Process
Taichi Ito, Precious Metals Materials Division, Matsuda Sangyo Co., Ltd.Kiyofumi Kodera, Precious Metals Materials Division, Matsuda Sangyo Co., Ltd.Yuichiro Shindo, Matsuda Sangyo Co., Ltd.
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Koehler, Andrew
U. S. Naval Research Laboratory-
9.3.2023 Drift Region Epitaxy Development and Characterization for High Blocking Strength and Low Specific Resistance in Vertical GaN Based Devices
Eldad Bahat Treidel, Ferdinand-Braun-Institut (FBH)Frank Brunner, Ferdinand-Braun-Institut (FBH)Enrico Brusaterra, Ferdinand-Braun-Institut (FBH)Mihaela Wolf, Ferdinand-Braun-Institut (FBH)Andreas Thies, Ferdinand-Braun-InstitutJ. Würfl, Ferdinand-Braun-Institut (FBH)Oliver Hilt, Ferdinand-Braun-Institut (FBH) -
9.4.2023 Scalable Manufacturing of Planar, Large-Area 1.2kV and 3.3kV Vertical GaN PiN Diodes
Alan Jacobs, U.S. Naval Research LaboratoryMona Ebrish, NRC Postdoc Fellow Residing at the U.S. Naval Research LaboratoryJames Gallagher, U.S. Naval Research LaboratoryMarko J. Tadjer, U.S. Naval Research LaboratoryJames Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLJennifer K. Hite, Naval Research LaboratoryN. Mahadik, U.S. Naval Research LaboratoryRobert Kaplar, Sandia National Labs, Albuquerque, NMO. Aktas, Sandia National Labs, Albuquerque, NM
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Koester, Steven J.
University of Minnesota, Minneapolis, MN 55455, USA-
7.2.2023 Fabrication and Analysis of β-Ga2O3 Schottky Diodes with Drift Layer Grown by MOCVD on (001) Substrate
Prakash P. Sundaram, University of Minnesota, Minneapolis, MN 55455, USAFengdeng Liu, University of Minnesota, Minneapolis, MN 55455, USAFikadu Alema, Agnitron Technology Incorporated, Chanhassen, MN 55317, USAAndrei Osinsky, Agnitron Technology Incorporated, Chanhassen, MN 55317, USABharat Jalan, University of Minnesota, Minneapolis, MN 55455, USASteven J. Koester, University of Minnesota, Minneapolis, MN 55455, USA
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Kong, Gary
Innoscience America, Santa Clara, United States-
6.2.2023 How to get GaN power devices into mainstream, high volume power management applications?
Jan Šonský, Innoscience Europe, Philipssite 5b1, Leuven, BelgiumThomas Zhao, Innoscience, Zhuhai, Guangdong Province, P.R. ChinaGary Kong, Innoscience America, Santa Clara, United StatesDavid Zhou, Innoscience, Suzhou, Jiangsu Province, P.R. ChinaFelix Wang, Innoscience, Zhuhai, Guangdong Province, P.R. China
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Koo, Seo
Soonchunhyang University, Korea-
4.3.2023 GaN based 2-stage Wide Band Doherty PA for 3.4-3.8 GHz Using Hybrid Integration with IPDs on HPSI SiC Substrate
Sangmin Lee, Wavice Inc.: Now with Global Communication Semiconductors LLC, Torrance, CAJinman Jin, Wavice Inc.Inseop Kim, Wavice Inc.,Hyeyoung Jung, Wavice Inc.,Seo Koo, Soonchunhyang University, KoreaDal Ahn, Soonchunhyang University, Korea
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Kosaka, T.
Sumitomo Electric Device Innovations, Japan -
Kozuka, Y.
Canon ANELVA Corporation-
8.5.2023 Atomic Diffusion Bonding Using AlN and Al2O3 Films
T. Saito, Canon ANELVA CorporationH. Makita, Canon ANELVA CorporationY. Suzuki, Canon ANELVA CorporationY. Kozuka, Canon ANELVA CorporationA. Muraoka, Canon ANELVA CorporationH. Fukunaga, FRIS, Tohoku UniversityM. Uomoto, FRIS, Tohoku UniversityT. Shimatsu, FRIS, Tohoku University
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Kraman, Mark
University of Illinois Urbana-Champagne-
14.2.2023 Assessment of 1.3-?m InAs QD Edge-Emitting Lasers Grown on Large Area GaAs Substrates
Sara Gillgrass, Cardiff UniversityCraig Allford, Cardiff UniversityMukul Debnath, IQE plcAndrew Clark, IQE, Cardiff, UKPeter M. Smowton, Cardiff University, IQE plc
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Krause, Stephen
Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USA-
3.4.2023 Advanced Carbon film for high-voltage power, high-performance SiC devices
Ludovico Megalini, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAYi Zheng, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USARicky Fang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAPratim Palit,, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJinghe Yang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAQintao Zhang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJang Seok Oh, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USABryan Turner, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USASamphy Hong, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJiao Yang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJoseph Lee, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAGopal Prabhu, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAAswin Prathap Pitchiya, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USADavid A. Britz, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USARaghav Sreenivasan, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAStephen Krause, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAMichael Chudzik, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USATamara Fidler, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, GermanyPatrick Schmid, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, GermanyBas Derksema, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, Germany
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Krishnappa, Manohar
Skyworks Solutions, Inc.-
5.3.2023 Integration of Nichrome Process as a Competitive Alternative to Tantalum Nitride for Thin Film Resistors in Compound Semiconductors
Stephanie Y. Chang, Skyworks Solutions, Inc.Shiban Tiku, Skyworks Solutions, Inc.Tom Brown, Skyworks Solutions, Inc.Lam Luu, Skyworks Solutions, Inc.Manohar Krishnappa, Skyworks Solutions, Inc.Randy Bryie, Skyworks Solutions, Inc.Nercy Ebrahimi, Skyworks Solution Inc.
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Krueger, Olaf
Ferdinand-Braun-Institut (FBH)-
10.3.2023 Optimization of Iridium RF-Sputter Process for AlGaN/GaN-based HEMT Gate Technology
I. Ostermay, Ferdinand-Braun-Institut (FBH)Sten Seifert, Ferdinand-Braun-Institut (FBH)Olaf Krueger, Ferdinand-Braun-Institut (FBH)
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Kuball, Martin
University of Bristol-
4.4.2023 Origin of Transconductance roll-off in mmWave AlGaN/GaN HEMTs
Terirama Thingujam, University of BristolMichael J Uren, University of BristolNiklas Rorsman, Chalmers University of TechnologyMatthew Smith, University of BristolAndrew Barnes, European Space AgencyMichele Brondi, Akkodis for European Space Agency (ESA)Martin Kuball, University of Bristol -
12.3.2023 Characterization of a Novel Thermal Interface Material based on Nanoparticles for High Power Device Package Assembly
Zeina Abdallah, University of BristolJames Pomeroy, University of BristolNicolas Blasakis, Adamant Composite Ltd.Athanasios Baltopoulos, Adamant Composite Ltd.Antonios Vavouliotis, Adamant Composite Ltd.Martin Kuball, University of Bristol -
15.2.2023 Selective Area Growth of B-Ga2O3
Arpit Nandi, University of BristolIndraneel Sanyal, University of BristolMartin Kuball, University of Bristol
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Kuo, Chi-Hsiang
WIN Semiconductors Corp-
18.9.2023 3-D Derived Structure Electromagnetic Simulation for Enhancement Mode Low Noise pHEMT Technology.
Kuan-Hua Chen, WIN Semiconductors Corp.Shou-Hsien Weng, WIN Semiconductors Corp.Shih-Wei Chen, WIN Semiconductors Corp.Chi-Ming Lin, WIN Semiconductors Corp.Jia-Shyan Wu, WIN Semiconductors Corp.Chi-Hsiang Kuo, WIN Semiconductors Corp
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Kuramata, A.
Novel Crystal Technology, Inc-
7.1.2023 β-Ga2O3 Crystal Growth and Device Processing
A. Kuramata, Novel Crystal Technology, IncKohei Sasaki, Novel Crystal Technology -
11.3.2023 Structural and Electrical Characterization of Schottky Barrier Diodes on 100 mm HVPE β-Ga2O3 Epiwafer Technology
Marko J. Tadjer, U.S. Naval Research LaboratoryJames Gallagher, ASEE Postdoctoral Fellow Residing at NRLN. Mahadik, U.S. Naval Research LaboratoryHannah N. Masten, National Research Council Postdoctoral Fellow, Residing at NRLJames Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLAkito Kuramata, Novel Crystal Technology, Inc -
11.4.2023 Nanocrystalline Diamond-Capped β-(AlxGa1-x)2O3/Ga2O3 Heterostructure FieldEffect Transistor
Hannah N. Masten, National Research Council Postdoctoral Fellow, Residing at NRLJames Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLTatyana Feygelson, U. S. Naval Research LaboratoryJoseph Spencer, U.S. Naval Research LaboratoryTatyana I. Feygelson, American Society for Engineering Education, United States Naval Research Lab. Universidad Politecnica de MadridJennifer K. Hite, Naval Research LaboratoryDaniel Pennachio, U.S. Naval Research Laboratory, Washington DCAlan Jacobs, U.S. Naval Research LaboratoryBoris Feygelson, U.S. Naval Research LaboratoryKohei Sasaki, Novel Crystal TechnologyAkito Kuramata, Novel Crystal Technology, IncPai-Ying Liao, Purdue UniversityPeide D. Ye, Purdue UniversityBradford Pate, Naval Research LaboratoryTravis J. Anderson, U.S. Naval Research LaboratoryMarko J. Tadjer, U.S. Naval Research Laboratory
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Kuramata, Akito
Novel Crystal Technology, Inc-
11.3.2023 Structural and Electrical Characterization of Schottky Barrier Diodes on 100 mm HVPE β-Ga2O3 Epiwafer Technology
Marko J. Tadjer, U.S. Naval Research LaboratoryJames Gallagher, ASEE Postdoctoral Fellow Residing at NRLN. Mahadik, U.S. Naval Research LaboratoryHannah N. Masten, National Research Council Postdoctoral Fellow, Residing at NRLJames Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLAkito Kuramata, Novel Crystal Technology, Inc -
11.4.2023 Nanocrystalline Diamond-Capped β-(AlxGa1-x)2O3/Ga2O3 Heterostructure FieldEffect Transistor
Hannah N. Masten, National Research Council Postdoctoral Fellow, Residing at NRLJames Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLTatyana Feygelson, U. S. Naval Research LaboratoryJoseph Spencer, U.S. Naval Research LaboratoryTatyana I. Feygelson, American Society for Engineering Education, United States Naval Research Lab. Universidad Politecnica de MadridJennifer K. Hite, Naval Research LaboratoryDaniel Pennachio, U.S. Naval Research Laboratory, Washington DCAlan Jacobs, U.S. Naval Research LaboratoryBoris Feygelson, U.S. Naval Research LaboratoryKohei Sasaki, Novel Crystal TechnologyAkito Kuramata, Novel Crystal Technology, IncPai-Ying Liao, Purdue UniversityPeide D. Ye, Purdue UniversityBradford Pate, Naval Research LaboratoryTravis J. Anderson, U.S. Naval Research LaboratoryMarko J. Tadjer, U.S. Naval Research Laboratory
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Lagowski, J.
Semilab SDI-
15.4.2023 Noncontact Measurement of Doping with Enhanced Throughput and High Precision for Wide Bandgap Wafer Manufacturing
M. Wilson, Semilab SDICarlos Almeida, Semilab SDII. Shekerov, Semilab SDIB. Schrayer, Semilab SDIA. Savtchouk, Semilab SDIB. Wilson, Semilab SDIJ. Lagowski, Semilab SDI
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Landi, Matthew
University of Illinois at Urbana-Champaign-
15.3.2023 Characterization of Nitridated Ga2O3 for GaN-on-Ga2O3 Power Device Applications
Matthew Landi, University of Illinois at Urbana-ChampaignFrank Kelly, University of Illinois at Urbana-ChampaignRiley Vesto, University of Illinois at Urbana-ChampaignMarko J. Tadjer, U.S. Naval Research LaboratoryKyekyoon Kim, University of Illinois at Urbana-Champaign
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Leach, J.H.
Kyma Technologies-
11.1.2023 HVPE-Based Gallium Oxide Epiwafer Development
J.H. Leach, Kyma TechnologiesKevin Udwary, Kyma TechnologiesG. Dodson, Kyma TechnologiesH.A. Splawn, Kyma Technologies, Inc.
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Lee, Hanwool
KBR Inc.-
12.2.2023 High Temperature Studies of 140 nm T-gate AlGaN/GaN HEMT Devices
Ahmad Islam, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAAdam Miesle, KBR Inc.Nicholas P. Sepelak, KBR, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAHanwool Lee, KBR Inc.Dennis E. Walker Jr., Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH,N. Miller, Air Force Research LaboratoryMatt Grupen, Air Force Research Laboratory, Sensors DirectorateKyle Liddy, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAAntonio Crespo, Air Force Research Laboratory, Sensors DirectorateGary Hughes, Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OHWenjuan Zhu, University of Illinois, UrbanaKelson Chabak, Air Force Research Laboratory, Sensors DirectorateAndrew J. Green, Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH,
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Lee, In-Geun
Kyungpook National University-
18.12.2023 Analytical model for the source resistance in advanced InxGa1-xAs/In0.52Al0.48As quantum-well high-electron-mobility transistors
Ji-Hoon Yoo, School of Electronic and Electrical Engineering, Kyungpook National UniversityJae-Hak Lee, Kyungpook National UniversityYong-Hyun Kim, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaSang-Kuk Kim, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaJacob Yun, QSITed Kim, QSIIn-Geun Lee, Kyungpook National UniversityDae-Hyun Kim, Kyungpook National University
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Lee, Jae-Hak
Kyungpook National University-
2.5.2023 Lg = 25 nm In0.8Ga0.2As/In0.52Al0.48As High-Electron Mobility Transistors on InP Substrate with Both fT and fmax in Excess of 700 GHz
In-Geun Lee, Kyungpook National UniversityHyeon-Bhin Jo, School of Electronic and Electrical Engineering, Kyungpook National UniversityWan-Soo Park, Kyungpook National UniversityJi-Hoon Yoo, School of Electronic and Electrical Engineering, Kyungpook National UniversityJacob Yun, QSITed Kim, QSITakuya Tsutsumi, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaHiroki Sugiyama, NTT Device Technology Laboratories, NTT Corporation, Kanagawa, JapanJae-Hak Lee, Kyungpook National UniversityDae-Hyun Kim, Kyungpook National University -
18.12.2023 Analytical model for the source resistance in advanced InxGa1-xAs/In0.52Al0.48As quantum-well high-electron-mobility transistors
Ji-Hoon Yoo, School of Electronic and Electrical Engineering, Kyungpook National UniversityJae-Hak Lee, Kyungpook National UniversityYong-Hyun Kim, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaSang-Kuk Kim, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaJacob Yun, QSITed Kim, QSIIn-Geun Lee, Kyungpook National UniversityDae-Hyun Kim, Kyungpook National University -
18.14.2023 A new methodology to extract saturation velocity of In0.53Ga0.47As QW HEMTs
Hyo-Jin Kim, Kyungpook National UniversityJi-Hoon Yoo, School of Electronic and Electrical Engineering, Kyungpook National UniversityWan-Soo Park, Kyungpook National UniversityHyeon-Bhin Jo, School of Electronic and Electrical Engineering, Kyungpook National UniversityIn-Geun Lee, Kyungpook National UniversityTae-Woo Kim, University of Ulsan, Ulsan, South KoreaSang-Kuk Kim, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaYong-Hyun Kim, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaJacob Yun, QSITed Kim, QSITakuya Tsutsumi, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaHiroki Sugiyama, NTT Device Technology Laboratories, NTT Corporation, Kanagawa, JapanHideaki Matsuzaki, NTT Device Technology Laboratories, NTT Corporation, Kanagawa, JapanJae-Hak Lee, Kyungpook National UniversityDae-Hyun Kim, Kyungpook National University
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Lee, Joseph
Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USA-
3.4.2023 Advanced Carbon film for high-voltage power, high-performance SiC devices
Ludovico Megalini, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAYi Zheng, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USARicky Fang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAPratim Palit,, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJinghe Yang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAQintao Zhang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJang Seok Oh, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USABryan Turner, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USASamphy Hong, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJiao Yang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJoseph Lee, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAGopal Prabhu, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAAswin Prathap Pitchiya, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USADavid A. Britz, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USARaghav Sreenivasan, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAStephen Krause, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAMichael Chudzik, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USATamara Fidler, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, GermanyPatrick Schmid, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, GermanyBas Derksema, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, Germany
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Lee, Sangmin
Wavice Inc.: Now with Global Communication Semiconductors LLC, Torrance, CA-
4.3.2023 GaN based 2-stage Wide Band Doherty PA for 3.4-3.8 GHz Using Hybrid Integration with IPDs on HPSI SiC Substrate
Sangmin Lee, Wavice Inc.: Now with Global Communication Semiconductors LLC, Torrance, CAJinman Jin, Wavice Inc.Inseop Kim, Wavice Inc.,Hyeyoung Jung, Wavice Inc.,Seo Koo, Soonchunhyang University, KoreaDal Ahn, Soonchunhyang University, Korea
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Leedy, Kevin
Air Force Research Laboratory, Sensors Directorate-
7.3.2023 Scaled ?-Ga2O3 MOSFETs with Pulsed Laser Deposition-Regrown Ohmics
Daniel M. Dryden, KBR, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAHyung Min Jeon, KBR Inc.,Kyle Liddy, Air Force Research LaboratoryAhmad Islam, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USADennis E. Walker Jr., Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH,Jeremiah C. Williams, Air Force Research Laboratory, Sensors DirectorateNicholas P. Sepelak, KBR, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USANolan S. Hendricks, Air Force Research Laboratory, Sensors DirectorateKevin Leedy, Air Force Research Laboratory, Sensors DirectorateKelson Chabak, Air Force Research Laboratory, Sensors DirectorateAndrew J. Green, Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH,
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Li, Jian-Sian
University of Florida, Gainesville, FL-
18.3.2023 Temperature Independence of Dynamic Switching in 4.8 A /3.6 kV NiO/β-Ga2O3 High Power Rectifiers
Jian-Sian Li, University of Florida, Gainesville, FLChao-Ching Chiang, University of Florida, Gainesville, FLXinyi Xia, University of Florida, Gainesville, FLCheng-Tse Tsai, University of Florida, Gainesville, FLYu-Te Liao, University of Florida, Gainesville, FLStephen Pearton, University of Florida -
18.11.2023 Ionization Thresholds and Residue Removal in Inductively Coupled Etching of NiO/Ga2O3 with Ar and BCl3
Chao-Ching Chiang, University of Florida, Gainesville, FLXinyi Xia, University of Florida, Gainesville, FLJian-Sian Li, University of Florida, Gainesville, FLFan Ren, University of FloridaStephen Pearton, University of Florida
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Li, Yun-Li (Charles)
PlayNitride Display Co.-
16.2.2023 Manufacturing MicroLED Display by PixeLED Solution
Ying-Tsang Liu, PlayNitride Display Co.Yun-Li (Charles) Li, PlayNitride Display Co.
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Liao, Pai-Ying
Purdue University-
11.4.2023 Nanocrystalline Diamond-Capped β-(AlxGa1-x)2O3/Ga2O3 Heterostructure FieldEffect Transistor
Hannah N. Masten, National Research Council Postdoctoral Fellow, Residing at NRLJames Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLTatyana Feygelson, U. S. Naval Research LaboratoryJoseph Spencer, U.S. Naval Research LaboratoryTatyana I. Feygelson, American Society for Engineering Education, United States Naval Research Lab. Universidad Politecnica de MadridJennifer K. Hite, Naval Research LaboratoryDaniel Pennachio, U.S. Naval Research Laboratory, Washington DCAlan Jacobs, U.S. Naval Research LaboratoryBoris Feygelson, U.S. Naval Research LaboratoryKohei Sasaki, Novel Crystal TechnologyAkito Kuramata, Novel Crystal Technology, IncPai-Ying Liao, Purdue UniversityPeide D. Ye, Purdue UniversityBradford Pate, Naval Research LaboratoryTravis J. Anderson, U.S. Naval Research LaboratoryMarko J. Tadjer, U.S. Naval Research Laboratory
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Liao, Yu-Te
University of Florida, Gainesville, FL-
18.3.2023 Temperature Independence of Dynamic Switching in 4.8 A /3.6 kV NiO/β-Ga2O3 High Power Rectifiers
Jian-Sian Li, University of Florida, Gainesville, FLChao-Ching Chiang, University of Florida, Gainesville, FLXinyi Xia, University of Florida, Gainesville, FLCheng-Tse Tsai, University of Florida, Gainesville, FLYu-Te Liao, University of Florida, Gainesville, FLStephen Pearton, University of Florida
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Liddy, Kyle
Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USA-
12.2.2023 High Temperature Studies of 140 nm T-gate AlGaN/GaN HEMT Devices
Ahmad Islam, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAAdam Miesle, KBR Inc.Nicholas P. Sepelak, KBR, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAHanwool Lee, KBR Inc.Dennis E. Walker Jr., Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH,N. Miller, Air Force Research LaboratoryMatt Grupen, Air Force Research Laboratory, Sensors DirectorateKyle Liddy, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAAntonio Crespo, Air Force Research Laboratory, Sensors DirectorateGary Hughes, Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OHWenjuan Zhu, University of Illinois, UrbanaKelson Chabak, Air Force Research Laboratory, Sensors DirectorateAndrew J. Green, Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH,
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Liddy, Kyle
Air Force Research Laboratory-
7.3.2023 Scaled ?-Ga2O3 MOSFETs with Pulsed Laser Deposition-Regrown Ohmics
Daniel M. Dryden, KBR, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAHyung Min Jeon, KBR Inc.,Kyle Liddy, Air Force Research LaboratoryAhmad Islam, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USADennis E. Walker Jr., Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH,Jeremiah C. Williams, Air Force Research Laboratory, Sensors DirectorateNicholas P. Sepelak, KBR, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USANolan S. Hendricks, Air Force Research Laboratory, Sensors DirectorateKevin Leedy, Air Force Research Laboratory, Sensors DirectorateKelson Chabak, Air Force Research Laboratory, Sensors DirectorateAndrew J. Green, Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH, -
12.2.2023 High Temperature Studies of 140 nm T-gate AlGaN/GaN HEMT Devices
Ahmad Islam, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAAdam Miesle, KBR Inc.Nicholas P. Sepelak, KBR, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAHanwool Lee, KBR Inc.Dennis E. Walker Jr., Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH,N. Miller, Air Force Research LaboratoryMatt Grupen, Air Force Research Laboratory, Sensors DirectorateKyle Liddy, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAAntonio Crespo, Air Force Research Laboratory, Sensors DirectorateGary Hughes, Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OHWenjuan Zhu, University of Illinois, UrbanaKelson Chabak, Air Force Research Laboratory, Sensors DirectorateAndrew J. Green, Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH,
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Lin, Chi-Ming
WIN Semiconductors Corp.-
18.9.2023 3-D Derived Structure Electromagnetic Simulation for Enhancement Mode Low Noise pHEMT Technology.
Kuan-Hua Chen, WIN Semiconductors Corp.Shou-Hsien Weng, WIN Semiconductors Corp.Shih-Wei Chen, WIN Semiconductors Corp.Chi-Ming Lin, WIN Semiconductors Corp.Jia-Shyan Wu, WIN Semiconductors Corp.Chi-Hsiang Kuo, WIN Semiconductors Corp
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Lin, Hong-Ye
National Taiwan University-
16.4.2023 1.55 μm DFB Laser with ns-level pulses for LiDAR
Te-Hua Liu, National Taiwan UniversityHong-Ye Lin, National Taiwan UniversityHao-Tien Cheng, National Taiwan UniversityChao-Hsin Wu, National Taiwan University
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Liu, Chia-Hao
Chang Gung University-
18.16.2023 Electrical and Thermal Performance Analysis of AlGaN/GaN HEMT without Voltage-Blocking Buffer Layer Design
Chong Rong Huang, Chang Gung UniversityHsien-Chin Chiu, Chang Gung UniversityChia-Hao Liu, Chang Gung UniversityHsiang-Chun Wang, Chang Gung UniversityChao-Wei Chiu, Chang Gung UniversityHsuan-Ling Kao, Chang Gung University,Chih-Tien Chen, National Chung-Shan Institute of Science and TechnologyKuo-Jen Chang, National Chung-Shan Institute of Science and Technology
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Liu, Fengdeng
University of Minnesota, Minneapolis, MN 55455, USA-
7.2.2023 Fabrication and Analysis of β-Ga2O3 Schottky Diodes with Drift Layer Grown by MOCVD on (001) Substrate
Prakash P. Sundaram, University of Minnesota, Minneapolis, MN 55455, USAFengdeng Liu, University of Minnesota, Minneapolis, MN 55455, USAFikadu Alema, Agnitron Technology Incorporated, Chanhassen, MN 55317, USAAndrei Osinsky, Agnitron Technology Incorporated, Chanhassen, MN 55317, USABharat Jalan, University of Minnesota, Minneapolis, MN 55455, USASteven J. Koester, University of Minnesota, Minneapolis, MN 55455, USA
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Liu, Te-Hua
National Taiwan University-
14.5.2023 Reliability assessment of HTOL stressed VCSELs with camera-based beam profilers
Hao-Tien Cheng, National Taiwan UniversityTaixian Zhang, LiVe OptronicsYun-Cheng Yang, National Taiwan UniversityTe-Hua Liu, National Taiwan UniversityChao-Hsin Wu, National Taiwan University
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Liu, Ying-Tsang
PlayNitride Display Co.-
16.2.2023 Manufacturing MicroLED Display by PixeLED Solution
Ying-Tsang Liu, PlayNitride Display Co.Yun-Li (Charles) Li, PlayNitride Display Co.
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Lowery, Andy
Epirus, Inc.-
4.1.2023 GaN as a Catalyst for Ultra-High-Power Directed Energy
Andy Lowery, Epirus, Inc.
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Lundh, James Spencer
National Research Council Postdoctoral Fellow, Residing at NRL-
8.3.2023 Heterogeneous Integration of Gallium Nitride HEMTs with Single Crystal Diamond Substrates via Micro-transfer Printing for Thermal Management
James Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLAndy Xie, QorvoShawn Mack, U.S. Naval Research LaboratoryD. Scott Katzer, U.S. Naval Research LaboratoryMarko J. Tadjer, U.S. Naval Research LaboratoryTravis J. Anderson, U.S. Naval Research LaboratoryBrian Downey, US Naval Research LaboratoryDavid J Meyer, U.S. Naval Research Laboratory, Washington, DC -
9.4.2023 Scalable Manufacturing of Planar, Large-Area 1.2kV and 3.3kV Vertical GaN PiN Diodes
Alan Jacobs, U.S. Naval Research LaboratoryMona Ebrish, NRC Postdoc Fellow Residing at the U.S. Naval Research LaboratoryJames Gallagher, U.S. Naval Research LaboratoryMarko J. Tadjer, U.S. Naval Research LaboratoryJames Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLJennifer K. Hite, Naval Research LaboratoryN. Mahadik, U.S. Naval Research LaboratoryRobert Kaplar, Sandia National Labs, Albuquerque, NMO. Aktas, Sandia National Labs, Albuquerque, NM -
11.3.2023 Structural and Electrical Characterization of Schottky Barrier Diodes on 100 mm HVPE β-Ga2O3 Epiwafer Technology
Marko J. Tadjer, U.S. Naval Research LaboratoryJames Gallagher, ASEE Postdoctoral Fellow Residing at NRLN. Mahadik, U.S. Naval Research LaboratoryHannah N. Masten, National Research Council Postdoctoral Fellow, Residing at NRLJames Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLAkito Kuramata, Novel Crystal Technology, Inc
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Luu, Lam
Skyworks Solutions, Inc. -
M Dallesasse, John
University of Illinois at Urbana-Champaign-
14.3.2023 Silicon Anti-Phase Optical Coatings for High-Power, Single-Mode Operation in Vertical-Cavity Surface-Emitting Lasers
Kevin P. Pikul, University of Illinois Urbana-ChampagneLeah Espenhahn, University of Illinois at Urbana-ChampaignPatrick Su, University of Illinois at Urbana-ChampaignMark Kraman, University of Illinois Urbana-ChampagneJohn M Dallesasse, University of Illinois at Urbana-Champaign
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Mack, Shawn
U.S. Naval Research Laboratory-
8.3.2023 Heterogeneous Integration of Gallium Nitride HEMTs with Single Crystal Diamond Substrates via Micro-transfer Printing for Thermal Management
James Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLAndy Xie, QorvoShawn Mack, U.S. Naval Research LaboratoryD. Scott Katzer, U.S. Naval Research LaboratoryMarko J. Tadjer, U.S. Naval Research LaboratoryTravis J. Anderson, U.S. Naval Research LaboratoryBrian Downey, US Naval Research LaboratoryDavid J Meyer, U.S. Naval Research Laboratory, Washington, DC
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Madel, Manfred
United Monolithic Semiconductors GmbH -
Mahadik, N.
U.S. Naval Research Laboratory-
9.4.2023 Scalable Manufacturing of Planar, Large-Area 1.2kV and 3.3kV Vertical GaN PiN Diodes
Alan Jacobs, U.S. Naval Research LaboratoryMona Ebrish, NRC Postdoc Fellow Residing at the U.S. Naval Research LaboratoryJames Gallagher, U.S. Naval Research LaboratoryMarko J. Tadjer, U.S. Naval Research LaboratoryJames Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLJennifer K. Hite, Naval Research LaboratoryN. Mahadik, U.S. Naval Research LaboratoryRobert Kaplar, Sandia National Labs, Albuquerque, NMO. Aktas, Sandia National Labs, Albuquerque, NM -
11.3.2023 Structural and Electrical Characterization of Schottky Barrier Diodes on 100 mm HVPE β-Ga2O3 Epiwafer Technology
Marko J. Tadjer, U.S. Naval Research LaboratoryJames Gallagher, ASEE Postdoctoral Fellow Residing at NRLN. Mahadik, U.S. Naval Research LaboratoryHannah N. Masten, National Research Council Postdoctoral Fellow, Residing at NRLJames Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLAkito Kuramata, Novel Crystal Technology, Inc
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Mahmud, Sadab
University of Toledo, Toledo OH-
18.15.2023 Characterization of Optically Modulated Semi-Insulating GaN Photoconductive Semiconductor Switches
Geoffrey Foster, Jacobs Inc., Washington DCAndrew Koehler, U. S. Naval Research LaboratoryKarl D. Hobart, U.S. Naval Research LaboratorySadab Mahmud, University of Toledo, Toledo OHSamuel Atwimah, University of Toledo, Toledo OHRaghav Khanna, University of Toledo, Toledo OHTravis J. Anderson, U.S. Naval Research Laboratory
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Makita, H.
Canon ANELVA Corporation-
8.5.2023 Atomic Diffusion Bonding Using AlN and Al2O3 Films
T. Saito, Canon ANELVA CorporationH. Makita, Canon ANELVA CorporationY. Suzuki, Canon ANELVA CorporationY. Kozuka, Canon ANELVA CorporationA. Muraoka, Canon ANELVA CorporationH. Fukunaga, FRIS, Tohoku UniversityM. Uomoto, FRIS, Tohoku UniversityT. Shimatsu, FRIS, Tohoku University
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Malakoutian, Mohamadali
Stanford University, Stanford, CA,-
12.1.2023 Thermal management in GaN-devices for increased power density
Mohamadali Malakoutian, Stanford University, Stanford, CA,Xiang Zheng, University of Bristol, BristolMartin Kuball, University of BristolS. Chowdhury, Stanford University, Stanford, CA; University of Bristol, Bristol, UK
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MALAQUIN, Cédric
Yole Developpement -
Martel, James
BAE Systems Inc.-
18.2.2023 Photoresist Softbake Oven Qualification
Nitin Kalra, BAE SystemsJames Mortellaro, BAE Systems Inc.James Martel, BAE Systems Inc.Xiaoping Yang, BAE Systems Inc.
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Martin, Mickael
Univ. Grenoble Alpes-
17.1.2023 Large Diameter Epi-Ready InP on Si (InPOSi) Substrates
Bruno Ghyselen, SOITECFrançois-Xavier Darras, SOITECOdile Mourey, SOITECChristelle Navone, Univ. Grenoble AlpesLoic Sanchez, Univ. Grenoble AlpesChristine Di Nardo, Univ. Grenoble AlpesCarla Crobu, Univ. Grenoble AlpesLaura Toselli, Univ. Grenoble AlpesBaptiste Rousset, Univ. Grenoble AlpesFrédéric Milesi, Univ. Grenoble AlpesLaurence Gabette, Univ. Grenoble AlpesFrank Fournel, Univ. Grenoble AlpesJean Decobert, III-V LabClaire Besancon, III-V LabMickael Martin, Univ. Grenoble AlpesJeremy Moeyaert, Univ. Grenoble AlpesThierry Baron, Univ. Grenoble Alpes
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Martinez, Xavier
Brewer Science, Inc.-
3.3.2023 Photonic Debonding for Wafer-Level Packaging
Vikram Turkani, PulseForge Corp.Vahid Akhavan, PulseForge Corp.Kurt Schroder, PulseForge Corp.Luke Prenger, Brewer Science, Inc.Xavier Martinez, Brewer Science, Inc.
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Masten, Hannah N.
National Research Council Postdoctoral Fellow, Residing at NRL-
11.3.2023 Structural and Electrical Characterization of Schottky Barrier Diodes on 100 mm HVPE β-Ga2O3 Epiwafer Technology
Marko J. Tadjer, U.S. Naval Research LaboratoryJames Gallagher, ASEE Postdoctoral Fellow Residing at NRLN. Mahadik, U.S. Naval Research LaboratoryHannah N. Masten, National Research Council Postdoctoral Fellow, Residing at NRLJames Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLAkito Kuramata, Novel Crystal Technology, Inc
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Matsushima, K.
Institute of Materials and Systems for Sustainability, Nagoya University-
11.5.2023 GaN substrate cut-out process and GaN on GaN device thinning process with laser slicing
A. Tanaka, Institute of Materials and Systems for Sustainability, Nagoya UniversityK. Matsushima, Institute of Materials and Systems for Sustainability, Nagoya UniversityT. Aratani, Hamamatsu Photonics K.KK. Hara, Hamamatsu Photonics K.KD. Kawaguchi, Hamamatsu Photonics K.KH. Watanabe, Institute of Materials and Systems for Sustainability, Nagoya UniversityT. Kanemura, Institute of Materials and Systems for Sustainability, Nagoya UniversityY. Nagasato, MIRISE Technologies CorporationM. Nagaya, MIRISE Technologies CorporationYoshio Honda, Institute of Materials and Systems for Sustainability, Nagoya UniversityA. Wakejima, Nagoya Institute of TechnologyY. Ando, Institute of Materials and Systems for Sustainability, Nagoya UniversityS. Onda, Institute of Materials and Systems for Sustainability, Nagoya UniversityJ. Suda, Institute of Materials and Systems for Sustainability, Nagoya University
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Matsuura, Kazuaki
Sumitomo Electric Device Innovations USA -
Matsuzaki, Hideaki
NTT Device Technology Laboratories, NTT Corporation, Kanagawa, Japan-
18.14.2023 A new methodology to extract saturation velocity of In0.53Ga0.47As QW HEMTs
Hyo-Jin Kim, Kyungpook National UniversityJi-Hoon Yoo, School of Electronic and Electrical Engineering, Kyungpook National UniversityWan-Soo Park, Kyungpook National UniversityHyeon-Bhin Jo, School of Electronic and Electrical Engineering, Kyungpook National UniversityIn-Geun Lee, Kyungpook National UniversityTae-Woo Kim, University of Ulsan, Ulsan, South KoreaSang-Kuk Kim, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaYong-Hyun Kim, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaJacob Yun, QSITed Kim, QSITakuya Tsutsumi, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaHiroki Sugiyama, NTT Device Technology Laboratories, NTT Corporation, Kanagawa, JapanHideaki Matsuzaki, NTT Device Technology Laboratories, NTT Corporation, Kanagawa, JapanJae-Hak Lee, Kyungpook National UniversityDae-Hyun Kim, Kyungpook National University
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Mauder, C.
AIXTRON SE-
7.5.2023 Improving the yield for GaN-on-Si HEMT devices for power applications
D. Fahle, AIXTRON SE GermanyC. Mauder, AIXTRON SEH. Hahn, AIXTRON SEZ. Gao, AIXTRON SENiels Posthuma, ImecStefaan Decoutere, Imec, Leuven, Belgium
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Mazeleyrat, E.
STMicroelectronics-
14.2.2023 Assessment of 1.3-?m InAs QD Edge-Emitting Lasers Grown on Large Area GaAs Substrates
Sara Gillgrass, Cardiff UniversityCraig Allford, Cardiff UniversityMukul Debnath, IQE plcAndrew Clark, IQE, Cardiff, UKPeter M. Smowton, Cardiff University, IQE plc
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McMahon, William E.
National Renewable Energy Laboratory-
17.5.2023 Morphology Control of Growth by Hydride Vapor Phase Epitaxy on Faceted GaAs Substrates Produced by Controlled Spalling for Low Cost III-V devices
A. K. Braun, Colorado School of MinesJ. T. Boyer, National Renewable Energy LaboratoryWilliam E. McMahon, National Renewable Energy LaboratoryKevin Schulte, National Renewable Energy LaboratoryJohn Simon, National Renewable Energy LaboratoryCorinne E. Packard, Colorado School of Mines, National Renewable Energy LaboratoryAaron Ptak, National Renewable Energy Laboratory
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Megalini, Ludovico
Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USA-
3.4.2023 Advanced Carbon film for high-voltage power, high-performance SiC devices
Ludovico Megalini, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAYi Zheng, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USARicky Fang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAPratim Palit,, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJinghe Yang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAQintao Zhang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJang Seok Oh, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USABryan Turner, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USASamphy Hong, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJiao Yang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJoseph Lee, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAGopal Prabhu, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAAswin Prathap Pitchiya, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USADavid A. Britz, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USARaghav Sreenivasan, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAStephen Krause, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAMichael Chudzik, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USATamara Fidler, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, GermanyPatrick Schmid, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, GermanyBas Derksema, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, Germany
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Meitzner, J.
STMicroelectronics-
14.1.2023 Colloidal Quantum Dot Image Sensor Technology
Jonathan Steckel, ST MicroelectronicsJ. Arnaud, STMicroelectronicsA. G. Pattantyus-Abraham, STMicroelectronicsA, Singh, STMicroelectronicsE. Josse, STMicroelectronicsM. Bidaud, STMicroelectronicsJ. Meitzner, STMicroelectronicsM. Sarmiento, STMicroelectronicsA. Arnaud, STMicroelectronicsE. Mazeleyrat, STMicroelectronicsH. Wehbe-Alause, STMicroelectronicsK. Rochereau, STMicroelectronics
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Merkle, A.P.
Crystal Sonic Inc.-
11.6.2023 Sonic Lift-off (SLO) to Enable Substrate Reuse and Lower Manufacturing Cost
P. Guimerá Coll, Crystal Sonic Inc.T. Black, Crystal Sonic Inc.A.P. Merkle, Crystal Sonic Inc.L. Bathurst, Crystal Sonic Inc.M. Bertoni, Crystal Sonic Inc.
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Miesle, Adam
KBR Inc.-
12.2.2023 High Temperature Studies of 140 nm T-gate AlGaN/GaN HEMT Devices
Ahmad Islam, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAAdam Miesle, KBR Inc.Nicholas P. Sepelak, KBR, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAHanwool Lee, KBR Inc.Dennis E. Walker Jr., Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH,N. Miller, Air Force Research LaboratoryMatt Grupen, Air Force Research Laboratory, Sensors DirectorateKyle Liddy, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAAntonio Crespo, Air Force Research Laboratory, Sensors DirectorateGary Hughes, Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OHWenjuan Zhu, University of Illinois, UrbanaKelson Chabak, Air Force Research Laboratory, Sensors DirectorateAndrew J. Green, Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH,
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Milesi, Frédéric
Univ. Grenoble Alpes-
17.1.2023 Large Diameter Epi-Ready InP on Si (InPOSi) Substrates
Bruno Ghyselen, SOITECFrançois-Xavier Darras, SOITECOdile Mourey, SOITECChristelle Navone, Univ. Grenoble AlpesLoic Sanchez, Univ. Grenoble AlpesChristine Di Nardo, Univ. Grenoble AlpesCarla Crobu, Univ. Grenoble AlpesLaura Toselli, Univ. Grenoble AlpesBaptiste Rousset, Univ. Grenoble AlpesFrédéric Milesi, Univ. Grenoble AlpesLaurence Gabette, Univ. Grenoble AlpesFrank Fournel, Univ. Grenoble AlpesJean Decobert, III-V LabClaire Besancon, III-V LabMickael Martin, Univ. Grenoble AlpesJeremy Moeyaert, Univ. Grenoble AlpesThierry Baron, Univ. Grenoble Alpes
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Miller, Mark J.
Skyworks Solutions Inc.-
10.1.2023 Mechanisms and Control of Photolithography Hotspots in Compound Semiconductor Manufacturing
Mark J. Miller, Skyworks Solutions Inc.Marietta L. Balandan, Skyworks Solutions Inc.,Aida J. Castro, Skyworks Solutions, Inc.Lorain Ross, Skyworks Solutions, Inc.M. Arif Zeeshan, Skyworks Solutions Inc.
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Miller, N.
Air Force Research Laboratory-
12.2.2023 High Temperature Studies of 140 nm T-gate AlGaN/GaN HEMT Devices
Ahmad Islam, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAAdam Miesle, KBR Inc.Nicholas P. Sepelak, KBR, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAHanwool Lee, KBR Inc.Dennis E. Walker Jr., Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH,N. Miller, Air Force Research LaboratoryMatt Grupen, Air Force Research Laboratory, Sensors DirectorateKyle Liddy, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAAntonio Crespo, Air Force Research Laboratory, Sensors DirectorateGary Hughes, Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OHWenjuan Zhu, University of Illinois, UrbanaKelson Chabak, Air Force Research Laboratory, Sensors DirectorateAndrew J. Green, Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH,
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Moeyaert, Jeremy
Univ. Grenoble Alpes-
17.1.2023 Large Diameter Epi-Ready InP on Si (InPOSi) Substrates
Bruno Ghyselen, SOITECFrançois-Xavier Darras, SOITECOdile Mourey, SOITECChristelle Navone, Univ. Grenoble AlpesLoic Sanchez, Univ. Grenoble AlpesChristine Di Nardo, Univ. Grenoble AlpesCarla Crobu, Univ. Grenoble AlpesLaura Toselli, Univ. Grenoble AlpesBaptiste Rousset, Univ. Grenoble AlpesFrédéric Milesi, Univ. Grenoble AlpesLaurence Gabette, Univ. Grenoble AlpesFrank Fournel, Univ. Grenoble AlpesJean Decobert, III-V LabClaire Besancon, III-V LabMickael Martin, Univ. Grenoble AlpesJeremy Moeyaert, Univ. Grenoble AlpesThierry Baron, Univ. Grenoble Alpes
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Mony, Samuel
Skyworks Solutions, Inc.-
10.2.2023 Reduction in Scattered Particles Contamination in Inductively Coupled Plasma Etching Systems for High Volume High Yield Production
Mohammadsadegh Beheshti, Skyworks Solutions Inc.Samuel Mony, Skyworks Solutions, Inc.Nercy Ebrahimi, Skyworks Solution Inc.Tom Brown, Skyworks Solutions, Inc.
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Morishita, Tomonori
Sumiden Semiconductor Materials Co., Ltd., Sumitomo Electric Industries, Ltd-
17.2.2023 Development of Laser Diode Grade Si-doped 8-inch GaAs Substrates
K. Shibata, Sumiden Semiconductor Materials Co., Ltd.,K. Aoyama, Sumiden Semiconductor Materials Co., Ltd.,M Nishioka, Sumiden Semiconductor Materials Co., Ltd.,K. Hashio, Sumiden Semiconductor Materials Co., Ltd.,F. Adachi, Sumiden Semiconductor Materials Co., Ltd.,S. Fujita, Sumiden Semiconductor Materials Co., Ltd., Sumitomo Electric Industries, LtdYoshiaki Hagi, Sumiden Semiconductor Materials Co., Ltd., Sumitomo Electric Industries, Ltd, ItamiTomonori Morishita, Sumiden Semiconductor Materials Co., Ltd., Sumitomo Electric Industries, Ltd
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Morris, S.
Qorvo Inc-
18.6.2023 The Application of High-Volume Manufacturing Heterogeneous Packaging Technology to Simplify Highly Complex Systems
D. Robertson, Qorvo IncMd Hasnine, Qorvo IncG. Kent, Qorvo IncN. Salazar, Qorvo IncB. Rosario, Qorvo IncS. Morris, Qorvo Inc
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Mortellaro, James
BAE Systems Inc.-
18.2.2023 Photoresist Softbake Oven Qualification
Nitin Kalra, BAE SystemsJames Mortellaro, BAE Systems Inc.James Martel, BAE Systems Inc.Xiaoping Yang, BAE Systems Inc.
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Mourey, Odile
SOITEC-
17.1.2023 Large Diameter Epi-Ready InP on Si (InPOSi) Substrates
Bruno Ghyselen, SOITECFrançois-Xavier Darras, SOITECOdile Mourey, SOITECChristelle Navone, Univ. Grenoble AlpesLoic Sanchez, Univ. Grenoble AlpesChristine Di Nardo, Univ. Grenoble AlpesCarla Crobu, Univ. Grenoble AlpesLaura Toselli, Univ. Grenoble AlpesBaptiste Rousset, Univ. Grenoble AlpesFrédéric Milesi, Univ. Grenoble AlpesLaurence Gabette, Univ. Grenoble AlpesFrank Fournel, Univ. Grenoble AlpesJean Decobert, III-V LabClaire Besancon, III-V LabMickael Martin, Univ. Grenoble AlpesJeremy Moeyaert, Univ. Grenoble AlpesThierry Baron, Univ. Grenoble Alpes
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Muraoka, A.
Canon ANELVA Corporation-
8.5.2023 Atomic Diffusion Bonding Using AlN and Al2O3 Films
T. Saito, Canon ANELVA CorporationH. Makita, Canon ANELVA CorporationY. Suzuki, Canon ANELVA CorporationY. Kozuka, Canon ANELVA CorporationA. Muraoka, Canon ANELVA CorporationH. Fukunaga, FRIS, Tohoku UniversityM. Uomoto, FRIS, Tohoku UniversityT. Shimatsu, FRIS, Tohoku University
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Mushini, P.
Coherent Corp. -
N. Feigelson, Boris
Naval Research Laboratory-
15.5.2023 Scalable Selective Area Doping for Manufacturing of Planar Vertical Power GaN Devices
Alan Jacobs, U.S. Naval Research LaboratoryBoris N. Feigelson, Naval Research LaboratoryJennifer Hite, U.S. Naval Research LaboratoryJoseph Spencer, U.S. Naval Research LaboratoryMarko Tadjer, U.S. Naval Research LaboratoryDaniel G. Georgiev, University of Toledo, Toledo OHRaghav Khanna, University of Toledo, Toledo OHMarko J. Tadjer, U.S. Naval Research LaboratoryTravis J. Anderson, U.S. Naval Research Laboratory
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Nagasato, Y.
MIRISE Technologies Corporation-
11.5.2023 GaN substrate cut-out process and GaN on GaN device thinning process with laser slicing
A. Tanaka, Institute of Materials and Systems for Sustainability, Nagoya UniversityK. Matsushima, Institute of Materials and Systems for Sustainability, Nagoya UniversityT. Aratani, Hamamatsu Photonics K.KK. Hara, Hamamatsu Photonics K.KD. Kawaguchi, Hamamatsu Photonics K.KH. Watanabe, Institute of Materials and Systems for Sustainability, Nagoya UniversityT. Kanemura, Institute of Materials and Systems for Sustainability, Nagoya UniversityY. Nagasato, MIRISE Technologies CorporationM. Nagaya, MIRISE Technologies CorporationYoshio Honda, Institute of Materials and Systems for Sustainability, Nagoya UniversityA. Wakejima, Nagoya Institute of TechnologyY. Ando, Institute of Materials and Systems for Sustainability, Nagoya UniversityS. Onda, Institute of Materials and Systems for Sustainability, Nagoya UniversityJ. Suda, Institute of Materials and Systems for Sustainability, Nagoya University
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Nagaya, M.
MIRISE Technologies Corporation-
11.5.2023 GaN substrate cut-out process and GaN on GaN device thinning process with laser slicing
A. Tanaka, Institute of Materials and Systems for Sustainability, Nagoya UniversityK. Matsushima, Institute of Materials and Systems for Sustainability, Nagoya UniversityT. Aratani, Hamamatsu Photonics K.KK. Hara, Hamamatsu Photonics K.KD. Kawaguchi, Hamamatsu Photonics K.KH. Watanabe, Institute of Materials and Systems for Sustainability, Nagoya UniversityT. Kanemura, Institute of Materials and Systems for Sustainability, Nagoya UniversityY. Nagasato, MIRISE Technologies CorporationM. Nagaya, MIRISE Technologies CorporationYoshio Honda, Institute of Materials and Systems for Sustainability, Nagoya UniversityA. Wakejima, Nagoya Institute of TechnologyY. Ando, Institute of Materials and Systems for Sustainability, Nagoya UniversityS. Onda, Institute of Materials and Systems for Sustainability, Nagoya UniversityJ. Suda, Institute of Materials and Systems for Sustainability, Nagoya University
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Nandi, Arpit
University of Bristol-
15.2.2023 Selective Area Growth of B-Ga2O3
Arpit Nandi, University of BristolIndraneel Sanyal, University of BristolMartin Kuball, University of Bristol
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Navone, Christelle
Univ. Grenoble Alpes-
17.1.2023 Large Diameter Epi-Ready InP on Si (InPOSi) Substrates
Bruno Ghyselen, SOITECFrançois-Xavier Darras, SOITECOdile Mourey, SOITECChristelle Navone, Univ. Grenoble AlpesLoic Sanchez, Univ. Grenoble AlpesChristine Di Nardo, Univ. Grenoble AlpesCarla Crobu, Univ. Grenoble AlpesLaura Toselli, Univ. Grenoble AlpesBaptiste Rousset, Univ. Grenoble AlpesFrédéric Milesi, Univ. Grenoble AlpesLaurence Gabette, Univ. Grenoble AlpesFrank Fournel, Univ. Grenoble AlpesJean Decobert, III-V LabClaire Besancon, III-V LabMickael Martin, Univ. Grenoble AlpesJeremy Moeyaert, Univ. Grenoble AlpesThierry Baron, Univ. Grenoble Alpes
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Nishioka, M
Sumiden Semiconductor Materials Co., Ltd.,-
17.2.2023 Development of Laser Diode Grade Si-doped 8-inch GaAs Substrates
K. Shibata, Sumiden Semiconductor Materials Co., Ltd.,K. Aoyama, Sumiden Semiconductor Materials Co., Ltd.,M Nishioka, Sumiden Semiconductor Materials Co., Ltd.,K. Hashio, Sumiden Semiconductor Materials Co., Ltd.,F. Adachi, Sumiden Semiconductor Materials Co., Ltd.,S. Fujita, Sumiden Semiconductor Materials Co., Ltd., Sumitomo Electric Industries, LtdYoshiaki Hagi, Sumiden Semiconductor Materials Co., Ltd., Sumitomo Electric Industries, Ltd, ItamiTomonori Morishita, Sumiden Semiconductor Materials Co., Ltd., Sumitomo Electric Industries, Ltd
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Norouzi Kalkani, Mahsa
OSRAM Group, Regensburg, Germany-
3.1.2023 Plasma Dicing of thin-film LEDs
Heribert Zull, OSRAM Group, Regensburg, GermanyMahsa Norouzi Kalkani, OSRAM Group, Regensburg, GermanyStelio Correia, OSRAM Group, Regensburg, GermanyMathias Kaempf, OSRAM Group, Regensburg, GermanyMartin Strassburg, OSRAM Group, Regensburg, Germany
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Novak, B.
Northrop Grumman (MS), Linthicum, MD -
Oh, Jang Seok
Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USA-
3.4.2023 Advanced Carbon film for high-voltage power, high-performance SiC devices
Ludovico Megalini, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAYi Zheng, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USARicky Fang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAPratim Palit,, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJinghe Yang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAQintao Zhang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJang Seok Oh, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USABryan Turner, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USASamphy Hong, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJiao Yang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJoseph Lee, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAGopal Prabhu, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAAswin Prathap Pitchiya, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USADavid A. Britz, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USARaghav Sreenivasan, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAStephen Krause, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAMichael Chudzik, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USATamara Fidler, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, GermanyPatrick Schmid, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, GermanyBas Derksema, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, Germany
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Okamoto, Keitro
Mitsuboshi Diamond Industrial Co., Ltd, Osaka, Japan-
3.2.2023 New and Innovative die singulation technology for Compound Semiconductors with Zero kerf loss and completely no damage on the side wall
Keitro Okamoto, Mitsuboshi Diamond Industrial Co., Ltd, Osaka, Japan
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Olson, Brian
Naval Surface Warfare Center Crane -
Onda, S.
Institute of Materials and Systems for Sustainability, Nagoya University-
11.5.2023 GaN substrate cut-out process and GaN on GaN device thinning process with laser slicing
A. Tanaka, Institute of Materials and Systems for Sustainability, Nagoya UniversityK. Matsushima, Institute of Materials and Systems for Sustainability, Nagoya UniversityT. Aratani, Hamamatsu Photonics K.KK. Hara, Hamamatsu Photonics K.KD. Kawaguchi, Hamamatsu Photonics K.KH. Watanabe, Institute of Materials and Systems for Sustainability, Nagoya UniversityT. Kanemura, Institute of Materials and Systems for Sustainability, Nagoya UniversityY. Nagasato, MIRISE Technologies CorporationM. Nagaya, MIRISE Technologies CorporationYoshio Honda, Institute of Materials and Systems for Sustainability, Nagoya UniversityA. Wakejima, Nagoya Institute of TechnologyY. Ando, Institute of Materials and Systems for Sustainability, Nagoya UniversityS. Onda, Institute of Materials and Systems for Sustainability, Nagoya UniversityJ. Suda, Institute of Materials and Systems for Sustainability, Nagoya University
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Ortega, Francis A.
Tignis, Inc.-
10.4.2023 Learnings from Multiple Implementations of Closed Loop AI/ML Controllers for Semiconductor Manufacturing
Francis A. Ortega, Tignis, Inc.Eric Holzer, Tignis, Inc.Mario Faria, Tignis, Inc.Jonathan L. Herlocker, Tignis, Inc.
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Osinsky, Andrei
Agnitron Technology Incorporated, Chanhassen, MN 55317, USA-
7.2.2023 Fabrication and Analysis of β-Ga2O3 Schottky Diodes with Drift Layer Grown by MOCVD on (001) Substrate
Prakash P. Sundaram, University of Minnesota, Minneapolis, MN 55455, USAFengdeng Liu, University of Minnesota, Minneapolis, MN 55455, USAFikadu Alema, Agnitron Technology Incorporated, Chanhassen, MN 55317, USAAndrei Osinsky, Agnitron Technology Incorporated, Chanhassen, MN 55317, USABharat Jalan, University of Minnesota, Minneapolis, MN 55455, USASteven J. Koester, University of Minnesota, Minneapolis, MN 55455, USA -
18.7.2023 Manufacturable processes and performance characteristics of few-layer hexagonal boron nitride-based templates on sapphire
Tim Vogt, Agnitron Technology, IncVitali Soukhoveev, Agnitron Technology Incorporated, Chanhassen, MN 55317, USAFikadu Alema, Agnitron Technology Incorporated, Chanhassen, MN 55317, USAAndrei Osinsky, Agnitron Technology Incorporated, Chanhassen, MN 55317, USA
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Ostermay, I.
Ferdinand-Braun-Institut (FBH)-
10.3.2023 Optimization of Iridium RF-Sputter Process for AlGaN/GaN-based HEMT Gate Technology
I. Ostermay, Ferdinand-Braun-Institut (FBH)Sten Seifert, Ferdinand-Braun-Institut (FBH)Olaf Krueger, Ferdinand-Braun-Institut (FBH)
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Packard, Corinne E.
Colorado School of Mines, National Renewable Energy Laboratory-
17.5.2023 Morphology Control of Growth by Hydride Vapor Phase Epitaxy on Faceted GaAs Substrates Produced by Controlled Spalling for Low Cost III-V devices
A. K. Braun, Colorado School of MinesJ. T. Boyer, National Renewable Energy LaboratoryWilliam E. McMahon, National Renewable Energy LaboratoryKevin Schulte, National Renewable Energy LaboratoryJohn Simon, National Renewable Energy LaboratoryCorinne E. Packard, Colorado School of Mines, National Renewable Energy LaboratoryAaron Ptak, National Renewable Energy Laboratory
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Palit,, Pratim
Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USA-
3.4.2023 Advanced Carbon film for high-voltage power, high-performance SiC devices
Ludovico Megalini, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAYi Zheng, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USARicky Fang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAPratim Palit,, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJinghe Yang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAQintao Zhang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJang Seok Oh, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USABryan Turner, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USASamphy Hong, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJiao Yang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJoseph Lee, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAGopal Prabhu, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAAswin Prathap Pitchiya, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USADavid A. Britz, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USARaghav Sreenivasan, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAStephen Krause, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAMichael Chudzik, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USATamara Fidler, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, GermanyPatrick Schmid, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, GermanyBas Derksema, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, Germany
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Park, Wan-Soo
Kyungpook National University-
2.5.2023 Lg = 25 nm In0.8Ga0.2As/In0.52Al0.48As High-Electron Mobility Transistors on InP Substrate with Both fT and fmax in Excess of 700 GHz
In-Geun Lee, Kyungpook National UniversityHyeon-Bhin Jo, School of Electronic and Electrical Engineering, Kyungpook National UniversityWan-Soo Park, Kyungpook National UniversityJi-Hoon Yoo, School of Electronic and Electrical Engineering, Kyungpook National UniversityJacob Yun, QSITed Kim, QSITakuya Tsutsumi, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaHiroki Sugiyama, NTT Device Technology Laboratories, NTT Corporation, Kanagawa, JapanJae-Hak Lee, Kyungpook National UniversityDae-Hyun Kim, Kyungpook National University -
18.14.2023 A new methodology to extract saturation velocity of In0.53Ga0.47As QW HEMTs
Hyo-Jin Kim, Kyungpook National UniversityJi-Hoon Yoo, School of Electronic and Electrical Engineering, Kyungpook National UniversityWan-Soo Park, Kyungpook National UniversityHyeon-Bhin Jo, School of Electronic and Electrical Engineering, Kyungpook National UniversityIn-Geun Lee, Kyungpook National UniversityTae-Woo Kim, University of Ulsan, Ulsan, South KoreaSang-Kuk Kim, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaYong-Hyun Kim, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaJacob Yun, QSITed Kim, QSITakuya Tsutsumi, QSI, Cheon-An, Kyunggi-do, 31044, South KoreaHiroki Sugiyama, NTT Device Technology Laboratories, NTT Corporation, Kanagawa, JapanHideaki Matsuzaki, NTT Device Technology Laboratories, NTT Corporation, Kanagawa, JapanJae-Hak Lee, Kyungpook National UniversityDae-Hyun Kim, Kyungpook National University
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Park, Yeongeun
Kumoh National Institute of Technology-
12.4.2023 Analysis of the effects of Gamma-ray irradiation on SiC MOSFETs
Chaeyun Kim, Kumoh National Institute of TechnologyHyowon Yoon, Kumoh National Institute of TechnologyYeongeun Park, Kumoh National Institute of TechnologyDong-Seok Kim, Korea Atomic Energy Research Institute, Republic of KoreaOgyun Seok, Kumoh National Institute of Technology -
18.13.2023 Design and Optimization of 1.2 kV SiC Trench MOSFETs Using a Tilted Ion Implantation Process for High Breakdown Voltage
Yeongeun Park, Kumoh National Institute of TechnologyHyowon Yoon, Kumoh National Institute of TechnologyChaeyun Kim, Kumoh National Institute of TechnologyGyuhyeok Kang, Kumoh National Institute of TechnologyOgyun Seok, Kumoh National Institute of Technology
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Parker, Winston
Wolfspeed, Durham NC-
6.1.2023 From Research to Reality – The Path of Compound Semiconductor Manufacturing Innovation
Missy Stigall, Wolfspeed, Durham NCWinston Parker, Wolfspeed, Durham NC
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Pate, Bradford
Naval Research Laboratory-
11.4.2023 Nanocrystalline Diamond-Capped β-(AlxGa1-x)2O3/Ga2O3 Heterostructure FieldEffect Transistor
Hannah N. Masten, National Research Council Postdoctoral Fellow, Residing at NRLJames Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLTatyana Feygelson, U. S. Naval Research LaboratoryJoseph Spencer, U.S. Naval Research LaboratoryTatyana I. Feygelson, American Society for Engineering Education, United States Naval Research Lab. Universidad Politecnica de MadridJennifer K. Hite, Naval Research LaboratoryDaniel Pennachio, U.S. Naval Research Laboratory, Washington DCAlan Jacobs, U.S. Naval Research LaboratoryBoris Feygelson, U.S. Naval Research LaboratoryKohei Sasaki, Novel Crystal TechnologyAkito Kuramata, Novel Crystal Technology, IncPai-Ying Liao, Purdue UniversityPeide D. Ye, Purdue UniversityBradford Pate, Naval Research LaboratoryTravis J. Anderson, U.S. Naval Research LaboratoryMarko J. Tadjer, U.S. Naval Research Laboratory
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Patel, Jash
KLA Corporation-
18.8.2023 Determining the impact of facet roughness on etched facet InP laser devices operating at telecom wavelengths, making comparisons to theoretical models.
Tristan T. Burman, Cardiff UniversityJash Patel, KLA CorporationHuma Ashraf, KLA Corporation (SPTS Division)Tarran Grange, KLA CorporationSamuel Shutts, Cardiff University. IQE plcPeter M. Smowton, Cardiff University, IQE plc
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Pattantyus-Abraham, A. G.
STMicroelectronics-
14.1.2023 Colloidal Quantum Dot Image Sensor Technology
Jonathan Steckel, ST MicroelectronicsJ. Arnaud, STMicroelectronicsA. G. Pattantyus-Abraham, STMicroelectronicsA, Singh, STMicroelectronicsE. Josse, STMicroelectronicsM. Bidaud, STMicroelectronicsJ. Meitzner, STMicroelectronicsM. Sarmiento, STMicroelectronicsA. Arnaud, STMicroelectronicsE. Mazeleyrat, STMicroelectronicsH. Wehbe-Alause, STMicroelectronicsK. Rochereau, STMicroelectronics
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Pearton, Stephen
University of Florida-
18.3.2023 Temperature Independence of Dynamic Switching in 4.8 A /3.6 kV NiO/β-Ga2O3 High Power Rectifiers
Jian-Sian Li, University of Florida, Gainesville, FLChao-Ching Chiang, University of Florida, Gainesville, FLXinyi Xia, University of Florida, Gainesville, FLCheng-Tse Tsai, University of Florida, Gainesville, FLYu-Te Liao, University of Florida, Gainesville, FLStephen Pearton, University of Florida -
18.11.2023 Ionization Thresholds and Residue Removal in Inductively Coupled Etching of NiO/Ga2O3 with Ar and BCl3
Chao-Ching Chiang, University of Florida, Gainesville, FLXinyi Xia, University of Florida, Gainesville, FLJian-Sian Li, University of Florida, Gainesville, FLFan Ren, University of FloridaStephen Pearton, University of Florida
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Pennachio, Daniel
U.S. Naval Research Laboratory, Washington DC-
11.4.2023 Nanocrystalline Diamond-Capped β-(AlxGa1-x)2O3/Ga2O3 Heterostructure FieldEffect Transistor
Hannah N. Masten, National Research Council Postdoctoral Fellow, Residing at NRLJames Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLTatyana Feygelson, U. S. Naval Research LaboratoryJoseph Spencer, U.S. Naval Research LaboratoryTatyana I. Feygelson, American Society for Engineering Education, United States Naval Research Lab. Universidad Politecnica de MadridJennifer K. Hite, Naval Research LaboratoryDaniel Pennachio, U.S. Naval Research Laboratory, Washington DCAlan Jacobs, U.S. Naval Research LaboratoryBoris Feygelson, U.S. Naval Research LaboratoryKohei Sasaki, Novel Crystal TechnologyAkito Kuramata, Novel Crystal Technology, IncPai-Ying Liao, Purdue UniversityPeide D. Ye, Purdue UniversityBradford Pate, Naval Research LaboratoryTravis J. Anderson, U.S. Naval Research LaboratoryMarko J. Tadjer, U.S. Naval Research Laboratory
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Perna, A. N.
National Renewable Energy Laboratory-
17.4.2023 Comparison of Heterointerface Growth Procedures using High-Growth-Rate Hydride Vapor Phase Epitaxy
Aaron Ptak, National Renewable Energy LaboratoryJ. T. Boyer, National Renewable Energy LaboratoryA. K. Braun, Colorado School of MinesA. N. Perna, National Renewable Energy LaboratoryKevin Schulte, National Renewable Energy LaboratoryJohn Simon, National Renewable Energy Laboratory
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Pikul, Kevin P.
University of Illinois Urbana-Champagne-
14.3.2023 Silicon Anti-Phase Optical Coatings for High-Power, Single-Mode Operation in Vertical-Cavity Surface-Emitting Lasers
Kevin P. Pikul, University of Illinois Urbana-ChampagneLeah Espenhahn, University of Illinois at Urbana-ChampaignPatrick Su, University of Illinois at Urbana-ChampaignMark Kraman, University of Illinois Urbana-ChampagneJohn M Dallesasse, University of Illinois at Urbana-Champaign
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Pomeroy, James
University of Bristol-
12.3.2023 Characterization of a Novel Thermal Interface Material based on Nanoparticles for High Power Device Package Assembly
Zeina Abdallah, University of BristolJames Pomeroy, University of BristolNicolas Blasakis, Adamant Composite Ltd.Athanasios Baltopoulos, Adamant Composite Ltd.Antonios Vavouliotis, Adamant Composite Ltd.Martin Kuball, University of Bristol
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Pong, R.
COHERENT - INNOViON-
5.1.2023 Isolation in Compound Semiconductors and the Risk of Neutron Generation with Implantation of Light Ions
J. A. Turcaud, Coherent Corp.C. Heckman, COHERENT - INNOViONV. Heckman, COHERENT - INNOViONA. Hassan, COHERENT - INNOViONR. Pong, COHERENT - INNOViONJ. Schuur, Coherent Corp.
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Posthuma, Niels
Imec-
7.5.2023 Improving the yield for GaN-on-Si HEMT devices for power applications
D. Fahle, AIXTRON SE GermanyC. Mauder, AIXTRON SEH. Hahn, AIXTRON SEZ. Gao, AIXTRON SENiels Posthuma, ImecStefaan Decoutere, Imec, Leuven, Belgium
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Prabhu, Gopal
Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USA-
3.4.2023 Advanced Carbon film for high-voltage power, high-performance SiC devices
Ludovico Megalini, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAYi Zheng, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USARicky Fang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAPratim Palit,, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJinghe Yang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAQintao Zhang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJang Seok Oh, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USABryan Turner, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USASamphy Hong, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJiao Yang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJoseph Lee, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAGopal Prabhu, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAAswin Prathap Pitchiya, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USADavid A. Britz, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USARaghav Sreenivasan, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAStephen Krause, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAMichael Chudzik, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USATamara Fidler, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, GermanyPatrick Schmid, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, GermanyBas Derksema, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, Germany
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Prathap Pitchiya, Aswin
Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USA-
3.4.2023 Advanced Carbon film for high-voltage power, high-performance SiC devices
Ludovico Megalini, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAYi Zheng, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USARicky Fang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAPratim Palit,, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJinghe Yang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAQintao Zhang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJang Seok Oh, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USABryan Turner, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USASamphy Hong, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJiao Yang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJoseph Lee, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAGopal Prabhu, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAAswin Prathap Pitchiya, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USADavid A. Britz, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USARaghav Sreenivasan, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAStephen Krause, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAMichael Chudzik, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USATamara Fidler, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, GermanyPatrick Schmid, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, GermanyBas Derksema, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, Germany
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Prenger, Luke
Brewer Science, Inc.-
3.3.2023 Photonic Debonding for Wafer-Level Packaging
Vikram Turkani, PulseForge Corp.Vahid Akhavan, PulseForge Corp.Kurt Schroder, PulseForge Corp.Luke Prenger, Brewer Science, Inc.Xavier Martinez, Brewer Science, Inc.
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Ptak, Aaron
National Renewable Energy Laboratory-
17.4.2023 Comparison of Heterointerface Growth Procedures using High-Growth-Rate Hydride Vapor Phase Epitaxy
Aaron Ptak, National Renewable Energy LaboratoryJ. T. Boyer, National Renewable Energy LaboratoryA. K. Braun, Colorado School of MinesA. N. Perna, National Renewable Energy LaboratoryKevin Schulte, National Renewable Energy LaboratoryJohn Simon, National Renewable Energy Laboratory -
17.5.2023 Morphology Control of Growth by Hydride Vapor Phase Epitaxy on Faceted GaAs Substrates Produced by Controlled Spalling for Low Cost III-V devices
A. K. Braun, Colorado School of MinesJ. T. Boyer, National Renewable Energy LaboratoryWilliam E. McMahon, National Renewable Energy LaboratoryKevin Schulte, National Renewable Energy LaboratoryJohn Simon, National Renewable Energy LaboratoryCorinne E. Packard, Colorado School of Mines, National Renewable Energy LaboratoryAaron Ptak, National Renewable Energy Laboratory
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Rahman, Sheikh Ifatur
The Ohio State University, Columbus, Ohio-
16.3.2023 Design and Performance of P-side down Green Tunnel-Junction LEDs
Sheikh Ifatur Rahman, The Ohio State University, Columbus, OhioRob Armitage, Lumileds LLCSiddharth Rajan, Ohio State University
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Rajan, Siddharth
Ohio State University-
16.3.2023 Design and Performance of P-side down Green Tunnel-Junction LEDs
Sheikh Ifatur Rahman, The Ohio State University, Columbus, OhioRob Armitage, Lumileds LLCSiddharth Rajan, Ohio State University
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Ramanathan, Dinesh
NexGen Power Systems Inc.-
9.2.2023 Challenges of Manufacturing Vertical GaN™ Technology of Future: Now a Reality with NexGen Power Systems
Dinesh Ramanathan, NexGen Power Systems Inc.
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Regan, Dean
Teledyne Scientific Company-
4.2.2023 Design and Fabrication of Millimeter-Wave GaN HEMTs
Keisuke Shinohara, Teledyne Scientific CompanyDean Regan, Teledyne Scientific CompanyCasey King, Teledyne Scientific CompanyEric Regan, Teledyne Scientific CompanyPetra Rowell, Teledyne Scientific CompanyAndrea Arias, Teledyne Scientific CompanyAndrew Carter, Teledyne Scientific CompanyJoshua Bergman, Teledyne Scientific CompanyMiguel Urteaga, Teledyne Scientific CompanyBerinder Brar, Teledyne Scientific Company
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Regan, Eric
Teledyne Scientific Company-
4.2.2023 Design and Fabrication of Millimeter-Wave GaN HEMTs
Keisuke Shinohara, Teledyne Scientific CompanyDean Regan, Teledyne Scientific CompanyCasey King, Teledyne Scientific CompanyEric Regan, Teledyne Scientific CompanyPetra Rowell, Teledyne Scientific CompanyAndrea Arias, Teledyne Scientific CompanyAndrew Carter, Teledyne Scientific CompanyJoshua Bergman, Teledyne Scientific CompanyMiguel Urteaga, Teledyne Scientific CompanyBerinder Brar, Teledyne Scientific Company
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Ren, Fan
University of Florida-
18.2.2023 Photoresist Softbake Oven Qualification
Nitin Kalra, BAE SystemsJames Mortellaro, BAE Systems Inc.James Martel, BAE Systems Inc.Xiaoping Yang, BAE Systems Inc. -
18.11.2023 Ionization Thresholds and Residue Removal in Inductively Coupled Etching of NiO/Ga2O3 with Ar and BCl3
Chao-Ching Chiang, University of Florida, Gainesville, FLXinyi Xia, University of Florida, Gainesville, FLJian-Sian Li, University of Florida, Gainesville, FLFan Ren, University of FloridaStephen Pearton, University of Florida
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Ren, Zhongmin
Lumileds LLC-
16.1.2023 Technical and Manufacturing Challenges in MicroLED Processes
Hee Jin Kim, Lumileds LLCRob Armitage, Lumileds LLCJoseph Flemish, Lumileds LLCZhongmin Ren, Lumileds LLCMark Holmes, Lumileds LLC
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Risbud, D.
Renesas Electronics America, CA, USA-
6.3.2023 Power Semiconductor Considerations for xEV applications
D. Risbud, Renesas Electronics America, CA, USAA. Kashyap, Renesas Electronics America, CA, USA
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Robertson, D.
Qorvo Inc-
18.6.2023 The Application of High-Volume Manufacturing Heterogeneous Packaging Technology to Simplify Highly Complex Systems
D. Robertson, Qorvo IncMd Hasnine, Qorvo IncG. Kent, Qorvo IncN. Salazar, Qorvo IncB. Rosario, Qorvo IncS. Morris, Qorvo Inc
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Rochereau, K.
STMicroelectronics-
14.1.2023 Colloidal Quantum Dot Image Sensor Technology
Jonathan Steckel, ST MicroelectronicsJ. Arnaud, STMicroelectronicsA. G. Pattantyus-Abraham, STMicroelectronicsA, Singh, STMicroelectronicsE. Josse, STMicroelectronicsM. Bidaud, STMicroelectronicsJ. Meitzner, STMicroelectronicsM. Sarmiento, STMicroelectronicsA. Arnaud, STMicroelectronicsE. Mazeleyrat, STMicroelectronicsH. Wehbe-Alause, STMicroelectronicsK. Rochereau, STMicroelectronics
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Rorsman, Niklas
Chalmers University of Technology-
4.4.2023 Origin of Transconductance roll-off in mmWave AlGaN/GaN HEMTs
Terirama Thingujam, University of BristolMichael J Uren, University of BristolNiklas Rorsman, Chalmers University of TechnologyMatthew Smith, University of BristolAndrew Barnes, European Space AgencyMichele Brondi, Akkodis for European Space Agency (ESA)Martin Kuball, University of Bristol
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Rosario, B.
Qorvo Inc-
18.6.2023 The Application of High-Volume Manufacturing Heterogeneous Packaging Technology to Simplify Highly Complex Systems
D. Robertson, Qorvo IncMd Hasnine, Qorvo IncG. Kent, Qorvo IncN. Salazar, Qorvo IncB. Rosario, Qorvo IncS. Morris, Qorvo Inc
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Ross, Lorain
Skyworks Solutions, Inc.-
10.1.2023 Mechanisms and Control of Photolithography Hotspots in Compound Semiconductor Manufacturing
Mark J. Miller, Skyworks Solutions Inc.Marietta L. Balandan, Skyworks Solutions Inc.,Aida J. Castro, Skyworks Solutions, Inc.Lorain Ross, Skyworks Solutions, Inc.M. Arif Zeeshan, Skyworks Solutions Inc.
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Rousset, Baptiste
Univ. Grenoble Alpes-
17.1.2023 Large Diameter Epi-Ready InP on Si (InPOSi) Substrates
Bruno Ghyselen, SOITECFrançois-Xavier Darras, SOITECOdile Mourey, SOITECChristelle Navone, Univ. Grenoble AlpesLoic Sanchez, Univ. Grenoble AlpesChristine Di Nardo, Univ. Grenoble AlpesCarla Crobu, Univ. Grenoble AlpesLaura Toselli, Univ. Grenoble AlpesBaptiste Rousset, Univ. Grenoble AlpesFrédéric Milesi, Univ. Grenoble AlpesLaurence Gabette, Univ. Grenoble AlpesFrank Fournel, Univ. Grenoble AlpesJean Decobert, III-V LabClaire Besancon, III-V LabMickael Martin, Univ. Grenoble AlpesJeremy Moeyaert, Univ. Grenoble AlpesThierry Baron, Univ. Grenoble Alpes
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Rowell, Petra
Teledyne Scientific Company-
4.2.2023 Design and Fabrication of Millimeter-Wave GaN HEMTs
Keisuke Shinohara, Teledyne Scientific CompanyDean Regan, Teledyne Scientific CompanyCasey King, Teledyne Scientific CompanyEric Regan, Teledyne Scientific CompanyPetra Rowell, Teledyne Scientific CompanyAndrea Arias, Teledyne Scientific CompanyAndrew Carter, Teledyne Scientific CompanyJoshua Bergman, Teledyne Scientific CompanyMiguel Urteaga, Teledyne Scientific CompanyBerinder Brar, Teledyne Scientific Company
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Sahin, H.
United Monolithic Semiconductors – GmbH -
Saito, T.
Canon ANELVA Corporation-
8.5.2023 Atomic Diffusion Bonding Using AlN and Al2O3 Films
T. Saito, Canon ANELVA CorporationH. Makita, Canon ANELVA CorporationY. Suzuki, Canon ANELVA CorporationY. Kozuka, Canon ANELVA CorporationA. Muraoka, Canon ANELVA CorporationH. Fukunaga, FRIS, Tohoku UniversityM. Uomoto, FRIS, Tohoku UniversityT. Shimatsu, FRIS, Tohoku University
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Salazar, N.
Qorvo Inc-
18.6.2023 The Application of High-Volume Manufacturing Heterogeneous Packaging Technology to Simplify Highly Complex Systems
D. Robertson, Qorvo IncMd Hasnine, Qorvo IncG. Kent, Qorvo IncN. Salazar, Qorvo IncB. Rosario, Qorvo IncS. Morris, Qorvo Inc
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Sanchez, Loic
Univ. Grenoble Alpes-
17.1.2023 Large Diameter Epi-Ready InP on Si (InPOSi) Substrates
Bruno Ghyselen, SOITECFrançois-Xavier Darras, SOITECOdile Mourey, SOITECChristelle Navone, Univ. Grenoble AlpesLoic Sanchez, Univ. Grenoble AlpesChristine Di Nardo, Univ. Grenoble AlpesCarla Crobu, Univ. Grenoble AlpesLaura Toselli, Univ. Grenoble AlpesBaptiste Rousset, Univ. Grenoble AlpesFrédéric Milesi, Univ. Grenoble AlpesLaurence Gabette, Univ. Grenoble AlpesFrank Fournel, Univ. Grenoble AlpesJean Decobert, III-V LabClaire Besancon, III-V LabMickael Martin, Univ. Grenoble AlpesJeremy Moeyaert, Univ. Grenoble AlpesThierry Baron, Univ. Grenoble Alpes
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Sanyal, Indraneel
University of Bristol-
15.2.2023 Selective Area Growth of B-Ga2O3
Arpit Nandi, University of BristolIndraneel Sanyal, University of BristolMartin Kuball, University of Bristol
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Sarmiento, M.
STMicroelectronics-
14.1.2023 Colloidal Quantum Dot Image Sensor Technology
Jonathan Steckel, ST MicroelectronicsJ. Arnaud, STMicroelectronicsA. G. Pattantyus-Abraham, STMicroelectronicsA, Singh, STMicroelectronicsE. Josse, STMicroelectronicsM. Bidaud, STMicroelectronicsJ. Meitzner, STMicroelectronicsM. Sarmiento, STMicroelectronicsA. Arnaud, STMicroelectronicsE. Mazeleyrat, STMicroelectronicsH. Wehbe-Alause, STMicroelectronicsK. Rochereau, STMicroelectronics
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Sasaki, Kohei
Novel Crystal Technology-
11.4.2023 Nanocrystalline Diamond-Capped β-(AlxGa1-x)2O3/Ga2O3 Heterostructure FieldEffect Transistor
Hannah N. Masten, National Research Council Postdoctoral Fellow, Residing at NRLJames Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLTatyana Feygelson, U. S. Naval Research LaboratoryJoseph Spencer, U.S. Naval Research LaboratoryTatyana I. Feygelson, American Society for Engineering Education, United States Naval Research Lab. Universidad Politecnica de MadridJennifer K. Hite, Naval Research LaboratoryDaniel Pennachio, U.S. Naval Research Laboratory, Washington DCAlan Jacobs, U.S. Naval Research LaboratoryBoris Feygelson, U.S. Naval Research LaboratoryKohei Sasaki, Novel Crystal TechnologyAkito Kuramata, Novel Crystal Technology, IncPai-Ying Liao, Purdue UniversityPeide D. Ye, Purdue UniversityBradford Pate, Naval Research LaboratoryTravis J. Anderson, U.S. Naval Research LaboratoryMarko J. Tadjer, U.S. Naval Research Laboratory
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Savtchouk, A.
Semilab SDI-
15.4.2023 Noncontact Measurement of Doping with Enhanced Throughput and High Precision for Wide Bandgap Wafer Manufacturing
M. Wilson, Semilab SDICarlos Almeida, Semilab SDII. Shekerov, Semilab SDIB. Schrayer, Semilab SDIA. Savtchouk, Semilab SDIB. Wilson, Semilab SDIJ. Lagowski, Semilab SDI
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Schmid, Patrick
Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, Germany-
3.4.2023 Advanced Carbon film for high-voltage power, high-performance SiC devices
Ludovico Megalini, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAYi Zheng, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USARicky Fang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAPratim Palit,, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJinghe Yang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAQintao Zhang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJang Seok Oh, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USABryan Turner, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USASamphy Hong, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJiao Yang, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAJoseph Lee, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAGopal Prabhu, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAAswin Prathap Pitchiya, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USADavid A. Britz, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USARaghav Sreenivasan, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAStephen Krause, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA: Applied Materials, 35 Dory Road, Gloucester, MA (01930), USAMichael Chudzik, Applied Materials, 3325 Scott Bldv., Santa Clara, CA (95054), USA Applied Materials, 35 Dory Road, Gloucester, MA (01930), USATamara Fidler, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, GermanyPatrick Schmid, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, GermanyBas Derksema, Centrotherm international AG, Württemberger Str. 31, 89143 Blaubeuren, Germany
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Schrayer, B.
Semilab SDI-
15.4.2023 Noncontact Measurement of Doping with Enhanced Throughput and High Precision for Wide Bandgap Wafer Manufacturing
M. Wilson, Semilab SDICarlos Almeida, Semilab SDII. Shekerov, Semilab SDIB. Schrayer, Semilab SDIA. Savtchouk, Semilab SDIB. Wilson, Semilab SDIJ. Lagowski, Semilab SDI
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Schroder, Kurt
PulseForge Corp.-
3.3.2023 Photonic Debonding for Wafer-Level Packaging
Vikram Turkani, PulseForge Corp.Vahid Akhavan, PulseForge Corp.Kurt Schroder, PulseForge Corp.Luke Prenger, Brewer Science, Inc.Xavier Martinez, Brewer Science, Inc.
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Schulte, Kevin
National Renewable Energy Laboratory-
17.4.2023 Comparison of Heterointerface Growth Procedures using High-Growth-Rate Hydride Vapor Phase Epitaxy
Aaron Ptak, National Renewable Energy LaboratoryJ. T. Boyer, National Renewable Energy LaboratoryA. K. Braun, Colorado School of MinesA. N. Perna, National Renewable Energy LaboratoryKevin Schulte, National Renewable Energy LaboratoryJohn Simon, National Renewable Energy Laboratory -
17.5.2023 Morphology Control of Growth by Hydride Vapor Phase Epitaxy on Faceted GaAs Substrates Produced by Controlled Spalling for Low Cost III-V devices
A. K. Braun, Colorado School of MinesJ. T. Boyer, National Renewable Energy LaboratoryWilliam E. McMahon, National Renewable Energy LaboratoryKevin Schulte, National Renewable Energy LaboratoryJohn Simon, National Renewable Energy LaboratoryCorinne E. Packard, Colorado School of Mines, National Renewable Energy LaboratoryAaron Ptak, National Renewable Energy Laboratory
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Schuur, J.
Coherent Corp.-
5.1.2023 Isolation in Compound Semiconductors and the Risk of Neutron Generation with Implantation of Light Ions
J. A. Turcaud, Coherent Corp.C. Heckman, COHERENT - INNOViONV. Heckman, COHERENT - INNOViONA. Hassan, COHERENT - INNOViONR. Pong, COHERENT - INNOViONJ. Schuur, Coherent Corp.
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Scott Katzer, D.
U.S. Naval Research Laboratory-
8.3.2023 Heterogeneous Integration of Gallium Nitride HEMTs with Single Crystal Diamond Substrates via Micro-transfer Printing for Thermal Management
James Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLAndy Xie, QorvoShawn Mack, U.S. Naval Research LaboratoryD. Scott Katzer, U.S. Naval Research LaboratoryMarko J. Tadjer, U.S. Naval Research LaboratoryTravis J. Anderson, U.S. Naval Research LaboratoryBrian Downey, US Naval Research LaboratoryDavid J Meyer, U.S. Naval Research Laboratory, Washington, DC
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Seifert, Sten
Ferdinand-Braun-Institut (FBH)-
10.2.2023 Reduction in Scattered Particles Contamination in Inductively Coupled Plasma Etching Systems for High Volume High Yield Production
Mohammadsadegh Beheshti, Skyworks Solutions Inc.Samuel Mony, Skyworks Solutions, Inc.Nercy Ebrahimi, Skyworks Solution Inc.Tom Brown, Skyworks Solutions, Inc.
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Seok, Ogyun
Kumoh National Institute of Technology-
12.4.2023 Analysis of the effects of Gamma-ray irradiation on SiC MOSFETs
Chaeyun Kim, Kumoh National Institute of TechnologyHyowon Yoon, Kumoh National Institute of TechnologyYeongeun Park, Kumoh National Institute of TechnologyDong-Seok Kim, Korea Atomic Energy Research Institute, Republic of KoreaOgyun Seok, Kumoh National Institute of Technology -
18.13.2023 Design and Optimization of 1.2 kV SiC Trench MOSFETs Using a Tilted Ion Implantation Process for High Breakdown Voltage
Yeongeun Park, Kumoh National Institute of TechnologyHyowon Yoon, Kumoh National Institute of TechnologyChaeyun Kim, Kumoh National Institute of TechnologyGyuhyeok Kang, Kumoh National Institute of TechnologyOgyun Seok, Kumoh National Institute of Technology
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Sepelak, Nicholas P.
KBR, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USA-
7.3.2023 Scaled ?-Ga2O3 MOSFETs with Pulsed Laser Deposition-Regrown Ohmics
Daniel M. Dryden, KBR, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAHyung Min Jeon, KBR Inc.,Kyle Liddy, Air Force Research LaboratoryAhmad Islam, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USADennis E. Walker Jr., Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH,Jeremiah C. Williams, Air Force Research Laboratory, Sensors DirectorateNicholas P. Sepelak, KBR, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USANolan S. Hendricks, Air Force Research Laboratory, Sensors DirectorateKevin Leedy, Air Force Research Laboratory, Sensors DirectorateKelson Chabak, Air Force Research Laboratory, Sensors DirectorateAndrew J. Green, Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH, -
12.2.2023 High Temperature Studies of 140 nm T-gate AlGaN/GaN HEMT Devices
Ahmad Islam, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAAdam Miesle, KBR Inc.Nicholas P. Sepelak, KBR, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAHanwool Lee, KBR Inc.Dennis E. Walker Jr., Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH,N. Miller, Air Force Research LaboratoryMatt Grupen, Air Force Research Laboratory, Sensors DirectorateKyle Liddy, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAAntonio Crespo, Air Force Research Laboratory, Sensors DirectorateGary Hughes, Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OHWenjuan Zhu, University of Illinois, UrbanaKelson Chabak, Air Force Research Laboratory, Sensors DirectorateAndrew J. Green, Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH,
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Shea, P.
Northrop Grumman Mission Center -
Shekerov, I.
Semilab SDI-
15.4.2023 Noncontact Measurement of Doping with Enhanced Throughput and High Precision for Wide Bandgap Wafer Manufacturing
M. Wilson, Semilab SDICarlos Almeida, Semilab SDII. Shekerov, Semilab SDIB. Schrayer, Semilab SDIA. Savtchouk, Semilab SDIB. Wilson, Semilab SDIJ. Lagowski, Semilab SDI
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Shenoy, Devanand
Office of the Under Secretary of Defense for Research and Engineering, Washington, DC-
1.2.2023-DoD Microelectronics: Heterogeneous Integration with Compound Semiconductors and Photonics
Devanand Shenoy, Office of the Under Secretary of Defense for Research and Engineering, Washington, DCDarren Crum, Naval Surface Warfare Center CraneBrian Olson, Naval Surface Warfare Center CraneJoshua Hawke, Naval Surface Warfare Center Crane
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Shibata, K.
Sumiden Semiconductor Materials Co., Ltd.,-
17.2.2023 Development of Laser Diode Grade Si-doped 8-inch GaAs Substrates
K. Shibata, Sumiden Semiconductor Materials Co., Ltd.,K. Aoyama, Sumiden Semiconductor Materials Co., Ltd.,M Nishioka, Sumiden Semiconductor Materials Co., Ltd.,K. Hashio, Sumiden Semiconductor Materials Co., Ltd.,F. Adachi, Sumiden Semiconductor Materials Co., Ltd.,S. Fujita, Sumiden Semiconductor Materials Co., Ltd., Sumitomo Electric Industries, LtdYoshiaki Hagi, Sumiden Semiconductor Materials Co., Ltd., Sumitomo Electric Industries, Ltd, ItamiTomonori Morishita, Sumiden Semiconductor Materials Co., Ltd., Sumitomo Electric Industries, Ltd
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Shimatsu, T.
FRIS, Tohoku University-
8.5.2023 Atomic Diffusion Bonding Using AlN and Al2O3 Films
T. Saito, Canon ANELVA CorporationH. Makita, Canon ANELVA CorporationY. Suzuki, Canon ANELVA CorporationY. Kozuka, Canon ANELVA CorporationA. Muraoka, Canon ANELVA CorporationH. Fukunaga, FRIS, Tohoku UniversityM. Uomoto, FRIS, Tohoku UniversityT. Shimatsu, FRIS, Tohoku University
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Shindo, Yuichiro
Matsuda Sangyo Co., Ltd.-
5.4.2023 Gol
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