3.1.2.2024 Electrochemical Additive Selection for Non–Cyanide Gold Plating Bath for Uniform Thickness Gold Layer for GaAs Backside Metallization

Shoei Mizuhashi, Matsuda Sangyo Co., Ltd.

Yusuke Sato, Matsuda Sangyo Co., Ltd.

Yuichiro Shindo, Matsuda Sangyo Co., Ltd.

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