Fraser Wang

WIN Semiconductors Corp
  • Quality and throughput improvement of GaN/SiC wafer saw with the addition of ultrasonic power          

    Fraser Wang, WIN Semiconductors Corp
    Vincent Hsu, I-Te Cho, Walter Wohlmuth WIN Semiconductors Corp.
    Stanley Hsieh, I-Te Cho, Walter Wohlmuth WIN Semiconductors Corp.
    Download Paper
  • Method for Forming Through Wafer Vias in GaN on SiC Devices and Circuits

    Chia-Hao Chen, WIN Semiconductors Corp
    Yu-Wei Chang, WIN Semiconductors Corp
    Ming-Hung Weng, I-Te Cho, Walter Wohlmuth WIN Semiconductors Corp.
    Ricky Chang, I-Te Cho, Walter Wohlmuth WIN Semiconductors Corp.
    Shih-Hui Huang, WIN Semiconductors Corp
    Fraser Wang, WIN Semiconductors Corp
    Yi-Feng Wei, I-Te Cho, Walter Wohlmuth WIN Semiconductors Corp.
    Stanley Hsieh, I-Te Cho, Walter Wohlmuth WIN Semiconductors Corp.
    Download Paper
  • 14.12 Enhancing the Manufacturability and Evolving the Technology of GaN on SiC Back-Side Vias

    Chia-Hao Chen, WIN Semiconductors Corp
    Yu-Wei Chang, WIN Semiconductors Corp
    Shih-Hui Huang, WIN Semiconductors Corp
    Fraser Wang, WIN Semiconductors Corp
    Benny Ho, WIN Semiconductors Corp
    Walter Wohlmuth, WIN Semiconductors Corp
    Download Paper