Fraser Wang
WIN Semiconductors Corp
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Quality and throughput improvement of GaN/SiC wafer saw with the addition of ultrasonic power
Fraser Wang, WIN Semiconductors CorpVincent Hsu, I-Te Cho, Walter Wohlmuth WIN Semiconductors Corp.Stanley Hsieh, I-Te Cho, Walter Wohlmuth WIN Semiconductors Corp. -
Method for Forming Through Wafer Vias in GaN on SiC Devices and Circuits
Chia-Hao Chen, WIN Semiconductors CorpYu-Wei Chang, WIN Semiconductors CorpMing-Hung Weng, I-Te Cho, Walter Wohlmuth WIN Semiconductors Corp.Ricky Chang, I-Te Cho, Walter Wohlmuth WIN Semiconductors Corp.Shih-Hui Huang, WIN Semiconductors CorpFraser Wang, WIN Semiconductors CorpYi-Feng Wei, I-Te Cho, Walter Wohlmuth WIN Semiconductors Corp.Stanley Hsieh, I-Te Cho, Walter Wohlmuth WIN Semiconductors Corp. -
14.12 Enhancing the Manufacturability and Evolving the Technology of GaN on SiC Back-Side Vias
Chia-Hao Chen, WIN Semiconductors CorpYu-Wei Chang, WIN Semiconductors CorpShih-Hui Huang, WIN Semiconductors CorpFraser Wang, WIN Semiconductors CorpBenny Ho, WIN Semiconductors CorpWalter Wohlmuth, Vanguard International Semiconductor Corporation, Taiwan