3.1.2.2024 Electrochemical Additive Selection for Non–Cyanide Gold Plating Bath
Shoei Mizuhashi
Matsuda Sangyo Co., Ltd.
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3.1.2.2024 Electrochemical Additive Selection for Non–Cyanide Gold Plating Bath for Uniform Thickness Gold Layer for GaAs Backside Metallization
Shoei Mizuhashi, Matsuda Sangyo Co., Ltd.Yusuke Sato, Matsuda Sangyo Co., Ltd.Yuichiro Shindo, Matsuda Sangyo Co., Ltd. -
4B.3 – Heat Resistance Improvement of Palladium Pre Plated Frames of Semiconductor Packaging with a New Additive for Nickel Plating
S. Sekiguchi, Matsuda Sangyo Co., Inc.Shoei Mizuhashi, Matsuda Sangyo Co., Ltd.Yusuke Sato, Matsuda Sangyo Co., Ltd.Taketomo Sato, Hokkaido UniversityYuichiro Shindo, Matsuda Sangyo Co., Ltd.Abstract
We investigated methods for improving the solder wettability of lead frames that connect semiconductor chips to electronic devices. A newly developed Ni plating bath with a Ge additive provided excellent solder wettability to the Ni/Pd/Au protection layer on copper-lead frames, even after heat treatment at 400 °C. It was found that even when the Ni/Pd/Au plating films were heat treated, the diffusion of Cu and Ni was drastically suppressed because the recrystallization of the plated Ni layer was suppressed when the film was deposited with plating chemicals containing Ge.