K. Huynh

University of California, Los Angeles
  • May 12, 2022 // 3:20pm

    18.6 Chemical Mechanical Polishing of β-Ga2O3

    M.S. Goorsky, University of California, Los Angeles
    M. E. Liao, University of California, Los Angeles, CA USA
    K. Huynh, University of California, Los Angeles
    W. Olsen, University of California, Los Angeles, CA USA
    X. Huang, Argonne National Laboratory
    M. Wojcik, Argonne National Laboratory
    J. C. Gallagher, U.S. Naval Research Laboratory
    Y. Wang, University of California, Los Angeles, CA USA

    Student Presentation

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  • May 12, 2022 // 3:20pm

    18.18 Reduction in Thermal Boundary Conductance of Annealed Direct Wafer Bonded GaN|Si Heterojunction Interfaces

    K. Huynh, University of California, Los Angeles
    M. E. Liao, University of California, Los Angeles, CA USA
    V. Dragoi, EV Group
    Eric Guiot, SOITEC
    Raphael Caulmilone, SOITEC
    M.S. Goorsky, University of California, Los Angeles
    X. Yan, University of California Irvine
    T. Pfeifer, University of Virginia Charlottesville
    N. Razek, EV Group and R-Ray Medical
    X. Pan, Soitec
    P. E. Hopkin, University of Virginia Charlottesville
    J. Tomko, University of Virginia Charlottesville

    Student Presentation

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  • 12.0.7.2024 Lapping and Chemical Mechanical Polishing of wide and ultra-wide bandgap semiconductors

    K. Pan, University of California Los Angeles
    K. Huynh, University of California, Los Angeles
    M.S. Goorsky, University of California, Los Angeles
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  • 12.0.10.2024 Large-Scale Thin-Film 128° Y-cut LiNbO3 on Sapphire via Wafer Bonding

    M. E. Liao, Apex Microdevices
    L. Matto, University of California Los Angeles
    K. Huynh, University of California, Los Angeles
    N. Ravi, University of California Los Angeles
    Y. Long, University of California Los Angeles
    P. J. Shah, Apex Microdevices
    M. S. Goorsky, University of California, Los Angeles
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  • 12.0.12.2024 Towards Realization of Large-Scale β-Ga2O3 Composite Wafers

    M. E. Liao, Apex Microdevices
    K. Huynh, University of California, Los Angeles
    N. Ravi, University of California Los Angeles
    K. Pan, University of California Los Angeles
    B. S. Carson, University of California, Los Angeles
    L. Matto, University of California Los Angeles
    P. J. Shah, Apex Microdevices
    M. S. Goorsky, University of California, Los Angeles
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