S Dessiatoun
University of Maryland
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7a.5 Near Junction Thermal Transport and Embedded Cooling of High Power GaN Electronics
Carlton Creamer, BAE Systems IncP. C. Chao, MEC, BAE Systems, IQEK K Chu, BAE SystemsA Kassinos, BAE SystemsG Campbell, Science Research Laboratories, Inc.H Eppich, Science Research Laboratories, Inc.A Shooshtari, University of MarylandS Dessiatoun, University of MarylandM Ohadi, University of MarylandC McGray, Modern MicrosystemsR Kallaher, Modern Microsystems