Abstract
In this paper, we focus on a simple hardware reconfiguration of CMP tools by deploying a slurry injection system (SIS) that modifies the slurry flow distribution, resulting in a more uniformly distributed thin layer of slurry on the polishing pad. The benefits of deploying the SIS on the CMP tools are clearly demonstrated: a 40-50% reduction in slurry flow rate — resulting in increasing throughput due to higher removal rate. A 2- 4% improvement in planarization was also obtained on patterned wafers polished with 5 kÅ of silicon dioxide (SiO2) deposited on top of a titanium/aluminum (Ti/Al) metal stack on a silicon substrate.
